FR3078448B1 - Ensemble de bus barres formant boitier et dissipateur thermique pour un dispositif electronique de puissance - Google Patents

Ensemble de bus barres formant boitier et dissipateur thermique pour un dispositif electronique de puissance Download PDF

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Publication number
FR3078448B1
FR3078448B1 FR1851689A FR1851689A FR3078448B1 FR 3078448 B1 FR3078448 B1 FR 3078448B1 FR 1851689 A FR1851689 A FR 1851689A FR 1851689 A FR1851689 A FR 1851689A FR 3078448 B1 FR3078448 B1 FR 3078448B1
Authority
FR
France
Prior art keywords
bus
housing
power device
electronic power
assembly forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1851689A
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English (en)
Other versions
FR3078448A1 (fr
Inventor
Friedbald Kiel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Institut Vedecom
Original Assignee
Institut Vedecom
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Institut Vedecom filed Critical Institut Vedecom
Priority to FR1851689A priority Critical patent/FR3078448B1/fr
Priority to JP2020545172A priority patent/JP2021515399A/ja
Priority to PCT/FR2019/050412 priority patent/WO2019166721A1/fr
Priority to US16/975,079 priority patent/US11081970B2/en
Priority to CN201980015661.2A priority patent/CN111819688B/zh
Priority to EP19713530.4A priority patent/EP3759736A1/fr
Publication of FR3078448A1 publication Critical patent/FR3078448A1/fr
Application granted granted Critical
Publication of FR3078448B1 publication Critical patent/FR3078448B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G5/00—Installations of bus-bars
    • H02G5/10—Cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Multi-Conductor Connections (AREA)
  • Inverter Devices (AREA)

Abstract

L'ensemble de bus barres selon l'invention comprend une pluralité de secteurs de bus barres (S1 à S6) agencés, de manière jointive et en contact électrique, autour d'un axe central (C) et des plaques de fermeture haute et basse (BPD) perpendiculaires à l'axe central, les secteurs de bus barres comprenant chacun un tronçon de bus barre externe (B11 à B16) et au moins un tronçon de bus barre interne (B21 à B26, B31 à B36) qui délimitent une pluralité de volumes internes, les plaques de fermeture haute et basse étant en contact respectivement contre des faces haute et basse des tronçons de bus barre et les tronçons de bus barre comprenant une pluralité de faces de contact électrique du type dit « press pack ».
FR1851689A 2018-02-27 2018-02-27 Ensemble de bus barres formant boitier et dissipateur thermique pour un dispositif electronique de puissance Active FR3078448B1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FR1851689A FR3078448B1 (fr) 2018-02-27 2018-02-27 Ensemble de bus barres formant boitier et dissipateur thermique pour un dispositif electronique de puissance
JP2020545172A JP2021515399A (ja) 2018-02-27 2019-02-22 電子パワーデバイス用のケーシングおよび放熱体を形成するバスバーアセンブリ
PCT/FR2019/050412 WO2019166721A1 (fr) 2018-02-27 2019-02-22 Ensemble de bus barres formant boîtier et dissipateur thermique pour un dispositif électronique de puissance
US16/975,079 US11081970B2 (en) 2018-02-27 2019-02-22 Assembly of bus bars forming a casing and heat dissipator for an electronic power device
CN201980015661.2A CN111819688B (zh) 2018-02-27 2019-02-22 形成用于电力电子装置的壳体和散热器的母线组件
EP19713530.4A EP3759736A1 (fr) 2018-02-27 2019-02-22 Ensemble de bus barres formant boîtier et dissipateur thermique pour un dispositif électronique de puissance

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1851689 2018-02-27
FR1851689A FR3078448B1 (fr) 2018-02-27 2018-02-27 Ensemble de bus barres formant boitier et dissipateur thermique pour un dispositif electronique de puissance

Publications (2)

Publication Number Publication Date
FR3078448A1 FR3078448A1 (fr) 2019-08-30
FR3078448B1 true FR3078448B1 (fr) 2020-02-28

Family

ID=62167543

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1851689A Active FR3078448B1 (fr) 2018-02-27 2018-02-27 Ensemble de bus barres formant boitier et dissipateur thermique pour un dispositif electronique de puissance

Country Status (6)

Country Link
US (1) US11081970B2 (fr)
EP (1) EP3759736A1 (fr)
JP (1) JP2021515399A (fr)
CN (1) CN111819688B (fr)
FR (1) FR3078448B1 (fr)
WO (1) WO2019166721A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3078456B1 (fr) * 2018-02-27 2020-02-28 Institut Vedecom Module de commutation de puissance et dispositif electronique de puissance integrant celui-ci
WO2024059490A2 (fr) * 2022-09-12 2024-03-21 H3X Technologies Inc. Liaison cc distribuée

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3555293A (en) * 1969-04-04 1971-01-12 Westinghouse Electric Corp Bus duct
US3584138A (en) * 1969-12-10 1971-06-08 Westinghouse Electric Corp Bus duct including improved housing
US4945188A (en) * 1987-08-14 1990-07-31 Cableware Pty. Ltd. Bus system
US5619014A (en) * 1993-03-25 1997-04-08 Siemens Energy & Automation, Inc. Busway busbar with plug-in tab
US5442135A (en) * 1993-03-25 1995-08-15 Siemens Energy & Automation, Inc. Electrical power distribution busway and housing
US6265666B1 (en) * 1998-10-02 2001-07-24 Siemens Energy & Automation, Inc. Electrical power distribution busway having a two-piece housing
DE19846156C1 (de) * 1998-10-07 2000-07-27 Bosch Gmbh Robert Anordnung eines mehrphasigen Umrichters
JP2004186504A (ja) * 2002-12-04 2004-07-02 Hitachi Unisia Automotive Ltd 半導体装置
US6778389B1 (en) * 2003-07-03 2004-08-17 Visteon Global Technologies, Inc. Microelectronic package with tubular housing
JP2005348522A (ja) * 2004-06-03 2005-12-15 Hitachi Ltd 電動パワーステアリング用モータおよびその製造方法
US7829994B2 (en) * 2007-09-24 2010-11-09 Sixis, Inc. Semiconductor substrate elastomeric stack
PT2161745E (pt) * 2008-09-08 2012-10-29 Converteam Technology Ltd Unidades de empilhamento contendo dispositivos semicondutores
JP2013033901A (ja) * 2011-06-29 2013-02-14 Nissan Motor Co Ltd 半導体装置
JP2013143427A (ja) * 2012-01-10 2013-07-22 Nissan Motor Co Ltd 半導体装置
JP5726215B2 (ja) * 2013-01-11 2015-05-27 株式会社豊田中央研究所 冷却型スイッチング素子モジュール
US9812934B2 (en) * 2013-04-16 2017-11-07 Mistubishi Electric Corporation Inverter device and inverter-integrated electric motor
WO2016057569A1 (fr) * 2014-10-08 2016-04-14 Remy Technologies,Llc Surface de socle pour module à mosfet
US9681568B1 (en) * 2015-12-02 2017-06-13 Ge Energy Power Conversion Technology Ltd Compact stacked power modules for minimizing commutating inductance and methods for making the same
CN110495076B (zh) * 2017-03-31 2021-06-04 日本电产株式会社 汇流条单元和马达

Also Published As

Publication number Publication date
CN111819688B (zh) 2024-07-16
FR3078448A1 (fr) 2019-08-30
EP3759736A1 (fr) 2021-01-06
CN111819688A (zh) 2020-10-23
US11081970B2 (en) 2021-08-03
JP2021515399A (ja) 2021-06-17
US20200403523A1 (en) 2020-12-24
WO2019166721A1 (fr) 2019-09-06

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