FR3078448B1 - Ensemble de bus barres formant boitier et dissipateur thermique pour un dispositif electronique de puissance - Google Patents
Ensemble de bus barres formant boitier et dissipateur thermique pour un dispositif electronique de puissance Download PDFInfo
- Publication number
- FR3078448B1 FR3078448B1 FR1851689A FR1851689A FR3078448B1 FR 3078448 B1 FR3078448 B1 FR 3078448B1 FR 1851689 A FR1851689 A FR 1851689A FR 1851689 A FR1851689 A FR 1851689A FR 3078448 B1 FR3078448 B1 FR 3078448B1
- Authority
- FR
- France
- Prior art keywords
- bus
- housing
- power device
- electronic power
- assembly forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 241001604129 Polydactylus Species 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G5/00—Installations of bus-bars
- H02G5/10—Cooling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Multi-Conductor Connections (AREA)
- Inverter Devices (AREA)
Abstract
L'ensemble de bus barres selon l'invention comprend une pluralité de secteurs de bus barres (S1 à S6) agencés, de manière jointive et en contact électrique, autour d'un axe central (C) et des plaques de fermeture haute et basse (BPD) perpendiculaires à l'axe central, les secteurs de bus barres comprenant chacun un tronçon de bus barre externe (B11 à B16) et au moins un tronçon de bus barre interne (B21 à B26, B31 à B36) qui délimitent une pluralité de volumes internes, les plaques de fermeture haute et basse étant en contact respectivement contre des faces haute et basse des tronçons de bus barre et les tronçons de bus barre comprenant une pluralité de faces de contact électrique du type dit « press pack ».
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1851689A FR3078448B1 (fr) | 2018-02-27 | 2018-02-27 | Ensemble de bus barres formant boitier et dissipateur thermique pour un dispositif electronique de puissance |
JP2020545172A JP2021515399A (ja) | 2018-02-27 | 2019-02-22 | 電子パワーデバイス用のケーシングおよび放熱体を形成するバスバーアセンブリ |
PCT/FR2019/050412 WO2019166721A1 (fr) | 2018-02-27 | 2019-02-22 | Ensemble de bus barres formant boîtier et dissipateur thermique pour un dispositif électronique de puissance |
US16/975,079 US11081970B2 (en) | 2018-02-27 | 2019-02-22 | Assembly of bus bars forming a casing and heat dissipator for an electronic power device |
CN201980015661.2A CN111819688B (zh) | 2018-02-27 | 2019-02-22 | 形成用于电力电子装置的壳体和散热器的母线组件 |
EP19713530.4A EP3759736A1 (fr) | 2018-02-27 | 2019-02-22 | Ensemble de bus barres formant boîtier et dissipateur thermique pour un dispositif électronique de puissance |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1851689 | 2018-02-27 | ||
FR1851689A FR3078448B1 (fr) | 2018-02-27 | 2018-02-27 | Ensemble de bus barres formant boitier et dissipateur thermique pour un dispositif electronique de puissance |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3078448A1 FR3078448A1 (fr) | 2019-08-30 |
FR3078448B1 true FR3078448B1 (fr) | 2020-02-28 |
Family
ID=62167543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1851689A Active FR3078448B1 (fr) | 2018-02-27 | 2018-02-27 | Ensemble de bus barres formant boitier et dissipateur thermique pour un dispositif electronique de puissance |
Country Status (6)
Country | Link |
---|---|
US (1) | US11081970B2 (fr) |
EP (1) | EP3759736A1 (fr) |
JP (1) | JP2021515399A (fr) |
CN (1) | CN111819688B (fr) |
FR (1) | FR3078448B1 (fr) |
WO (1) | WO2019166721A1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3078456B1 (fr) * | 2018-02-27 | 2020-02-28 | Institut Vedecom | Module de commutation de puissance et dispositif electronique de puissance integrant celui-ci |
WO2024059490A2 (fr) * | 2022-09-12 | 2024-03-21 | H3X Technologies Inc. | Liaison cc distribuée |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3555293A (en) * | 1969-04-04 | 1971-01-12 | Westinghouse Electric Corp | Bus duct |
US3584138A (en) * | 1969-12-10 | 1971-06-08 | Westinghouse Electric Corp | Bus duct including improved housing |
US4945188A (en) * | 1987-08-14 | 1990-07-31 | Cableware Pty. Ltd. | Bus system |
US5619014A (en) * | 1993-03-25 | 1997-04-08 | Siemens Energy & Automation, Inc. | Busway busbar with plug-in tab |
US5442135A (en) * | 1993-03-25 | 1995-08-15 | Siemens Energy & Automation, Inc. | Electrical power distribution busway and housing |
US6265666B1 (en) * | 1998-10-02 | 2001-07-24 | Siemens Energy & Automation, Inc. | Electrical power distribution busway having a two-piece housing |
DE19846156C1 (de) * | 1998-10-07 | 2000-07-27 | Bosch Gmbh Robert | Anordnung eines mehrphasigen Umrichters |
JP2004186504A (ja) * | 2002-12-04 | 2004-07-02 | Hitachi Unisia Automotive Ltd | 半導体装置 |
US6778389B1 (en) * | 2003-07-03 | 2004-08-17 | Visteon Global Technologies, Inc. | Microelectronic package with tubular housing |
JP2005348522A (ja) * | 2004-06-03 | 2005-12-15 | Hitachi Ltd | 電動パワーステアリング用モータおよびその製造方法 |
US7829994B2 (en) * | 2007-09-24 | 2010-11-09 | Sixis, Inc. | Semiconductor substrate elastomeric stack |
PT2161745E (pt) * | 2008-09-08 | 2012-10-29 | Converteam Technology Ltd | Unidades de empilhamento contendo dispositivos semicondutores |
JP2013033901A (ja) * | 2011-06-29 | 2013-02-14 | Nissan Motor Co Ltd | 半導体装置 |
JP2013143427A (ja) * | 2012-01-10 | 2013-07-22 | Nissan Motor Co Ltd | 半導体装置 |
JP5726215B2 (ja) * | 2013-01-11 | 2015-05-27 | 株式会社豊田中央研究所 | 冷却型スイッチング素子モジュール |
US9812934B2 (en) * | 2013-04-16 | 2017-11-07 | Mistubishi Electric Corporation | Inverter device and inverter-integrated electric motor |
WO2016057569A1 (fr) * | 2014-10-08 | 2016-04-14 | Remy Technologies,Llc | Surface de socle pour module à mosfet |
US9681568B1 (en) * | 2015-12-02 | 2017-06-13 | Ge Energy Power Conversion Technology Ltd | Compact stacked power modules for minimizing commutating inductance and methods for making the same |
CN110495076B (zh) * | 2017-03-31 | 2021-06-04 | 日本电产株式会社 | 汇流条单元和马达 |
-
2018
- 2018-02-27 FR FR1851689A patent/FR3078448B1/fr active Active
-
2019
- 2019-02-22 US US16/975,079 patent/US11081970B2/en active Active
- 2019-02-22 CN CN201980015661.2A patent/CN111819688B/zh active Active
- 2019-02-22 WO PCT/FR2019/050412 patent/WO2019166721A1/fr unknown
- 2019-02-22 EP EP19713530.4A patent/EP3759736A1/fr not_active Withdrawn
- 2019-02-22 JP JP2020545172A patent/JP2021515399A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
CN111819688B (zh) | 2024-07-16 |
FR3078448A1 (fr) | 2019-08-30 |
EP3759736A1 (fr) | 2021-01-06 |
CN111819688A (zh) | 2020-10-23 |
US11081970B2 (en) | 2021-08-03 |
JP2021515399A (ja) | 2021-06-17 |
US20200403523A1 (en) | 2020-12-24 |
WO2019166721A1 (fr) | 2019-09-06 |
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