FR3073084B3 - SEMICONDUCTOR PROCESSING DEVICE - Google Patents

SEMICONDUCTOR PROCESSING DEVICE Download PDF

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Publication number
FR3073084B3
FR3073084B3 FR1859962A FR1859962A FR3073084B3 FR 3073084 B3 FR3073084 B3 FR 3073084B3 FR 1859962 A FR1859962 A FR 1859962A FR 1859962 A FR1859962 A FR 1859962A FR 3073084 B3 FR3073084 B3 FR 3073084B3
Authority
FR
France
Prior art keywords
processing device
semiconductor processing
main body
side wall
wall surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1859962A
Other languages
French (fr)
Other versions
FR3073084A3 (en
Inventor
Yo-Yu Chang
Chun-Yao Huang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MFC Sealing Technology Co Ltd
Original Assignee
MFC Sealing Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from TW106216106U external-priority patent/TWM557447U/en
Priority claimed from TW106216107U external-priority patent/TWM557448U/en
Priority claimed from TW106216105U external-priority patent/TWM564819U/en
Priority claimed from TW107208318U external-priority patent/TWM566398U/en
Application filed by MFC Sealing Technology Co Ltd filed Critical MFC Sealing Technology Co Ltd
Publication of FR3073084A3 publication Critical patent/FR3073084A3/en
Application granted granted Critical
Publication of FR3073084B3 publication Critical patent/FR3073084B3/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Element Separation (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Engineering (AREA)

Abstract

L'invention concerne un dispositif de traitement de semi-conducteur, comportant un élément supérieur, un élément inférieur, une rainure annulaire et un élastomère. L'élément supérieur est configuré pour retenir une tranche. L'élément inférieur comporte une surface de paroi latérale, et est configuré pour retenir l'élément supérieur. La rainure annulaire se situe entre l'élément inférieur et l'élément supérieur. L'élastomère est disposé dans la rainure annulaire, et comporte un corps principal et une partie en extension raccordée au corps principal. La partie en extension fait saillie du corps principal et de la surface de paroi latérale, et s'étend le long de la surface de paroi latérale.The invention relates to a semiconductor processing device, comprising an upper element, a lower element, an annular groove and an elastomer. The upper element is configured to retain a slice. The lower member has a side wall surface, and is configured to retain the upper member. The annular groove is located between the lower element and the upper element. The elastomer is arranged in the annular groove, and comprises a main body and an extension part connected to the main body. The extended portion projects from the main body and the side wall surface, and extends along the side wall surface.

FR1859962A 2017-10-31 2018-10-26 SEMICONDUCTOR PROCESSING DEVICE Active FR3073084B3 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
TW106216106U TWM557447U (en) 2017-10-31 2017-10-31 Semiconductor process equipment
TW106216107U TWM557448U (en) 2017-10-31 2017-10-31 Semiconductor process equipment
TW106216105U TWM564819U (en) 2017-10-31 2017-10-31 Semiconductor process equipment
TW107208318U TWM566398U (en) 2018-06-21 2018-06-21 Semiconductor process equipment

Publications (2)

Publication Number Publication Date
FR3073084A3 FR3073084A3 (en) 2019-05-03
FR3073084B3 true FR3073084B3 (en) 2020-05-15

Family

ID=64568197

Family Applications (2)

Application Number Title Priority Date Filing Date
FR1859962A Active FR3073084B3 (en) 2017-10-31 2018-10-26 SEMICONDUCTOR PROCESSING DEVICE
FR1912926A Active FR3091954B3 (en) 2017-10-31 2019-11-20 SEMICONDUCTOR TREATMENT DEVICE

Family Applications After (1)

Application Number Title Priority Date Filing Date
FR1912926A Active FR3091954B3 (en) 2017-10-31 2019-11-20 SEMICONDUCTOR TREATMENT DEVICE

Country Status (5)

Country Link
JP (1) JP3219636U (en)
KR (1) KR200493938Y1 (en)
CN (1) CN208938918U (en)
DE (1) DE202018106098U1 (en)
FR (2) FR3073084B3 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7353106B2 (en) * 2019-09-09 2023-09-29 日本特殊陶業株式会社 holding device
JP7281374B2 (en) * 2019-09-09 2023-05-25 日本特殊陶業株式会社 Retaining device and method for manufacturing the retaining device
JP7445420B2 (en) * 2019-12-23 2024-03-07 日本特殊陶業株式会社 Parts for semiconductor manufacturing equipment
JP7446176B2 (en) * 2020-07-31 2024-03-08 東京エレクトロン株式会社 Mounting table and plasma processing equipment
JP7425034B2 (en) 2021-12-01 2024-01-30 三菱電線工業株式会社 Protective ring, adhesive surface protection structure equipped with the same, and adhesive surface protection method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0742588A3 (en) * 1995-05-11 1997-08-27 Applied Materials Inc Method of protecting electrostatic chuck
JP2000114358A (en) * 1998-10-05 2000-04-21 Tomoegawa Paper Co Ltd Electrostatic chuck device
US20060273277A1 (en) * 2005-06-02 2006-12-07 Heller Mark J Plasma resistant seal assembly with replaceable barrier shield
CN107195578B (en) * 2017-07-17 2019-11-29 北京北方华创微电子装备有限公司 Electrostatic chuck

Also Published As

Publication number Publication date
DE202018106098U1 (en) 2018-11-19
FR3073084A3 (en) 2019-05-03
JP3219636U (en) 2019-01-10
FR3091954A3 (en) 2020-07-24
CN208938918U (en) 2019-06-04
FR3091954B3 (en) 2021-01-29
KR20200000695U (en) 2020-04-01
KR200493938Y1 (en) 2021-07-01

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