FR3073084B3 - SEMICONDUCTOR PROCESSING DEVICE - Google Patents
SEMICONDUCTOR PROCESSING DEVICE Download PDFInfo
- Publication number
- FR3073084B3 FR3073084B3 FR1859962A FR1859962A FR3073084B3 FR 3073084 B3 FR3073084 B3 FR 3073084B3 FR 1859962 A FR1859962 A FR 1859962A FR 1859962 A FR1859962 A FR 1859962A FR 3073084 B3 FR3073084 B3 FR 3073084B3
- Authority
- FR
- France
- Prior art keywords
- processing device
- semiconductor processing
- main body
- side wall
- wall surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 229920001971 elastomer Polymers 0.000 abstract 2
- 239000000806 elastomer Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Element Separation (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Engineering (AREA)
Abstract
L'invention concerne un dispositif de traitement de semi-conducteur, comportant un élément supérieur, un élément inférieur, une rainure annulaire et un élastomère. L'élément supérieur est configuré pour retenir une tranche. L'élément inférieur comporte une surface de paroi latérale, et est configuré pour retenir l'élément supérieur. La rainure annulaire se situe entre l'élément inférieur et l'élément supérieur. L'élastomère est disposé dans la rainure annulaire, et comporte un corps principal et une partie en extension raccordée au corps principal. La partie en extension fait saillie du corps principal et de la surface de paroi latérale, et s'étend le long de la surface de paroi latérale.The invention relates to a semiconductor processing device, comprising an upper element, a lower element, an annular groove and an elastomer. The upper element is configured to retain a slice. The lower member has a side wall surface, and is configured to retain the upper member. The annular groove is located between the lower element and the upper element. The elastomer is arranged in the annular groove, and comprises a main body and an extension part connected to the main body. The extended portion projects from the main body and the side wall surface, and extends along the side wall surface.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW106216106U TWM557447U (en) | 2017-10-31 | 2017-10-31 | Semiconductor process equipment |
TW106216107U TWM557448U (en) | 2017-10-31 | 2017-10-31 | Semiconductor process equipment |
TW106216105U TWM564819U (en) | 2017-10-31 | 2017-10-31 | Semiconductor process equipment |
TW107208318U TWM566398U (en) | 2018-06-21 | 2018-06-21 | Semiconductor process equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3073084A3 FR3073084A3 (en) | 2019-05-03 |
FR3073084B3 true FR3073084B3 (en) | 2020-05-15 |
Family
ID=64568197
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1859962A Active FR3073084B3 (en) | 2017-10-31 | 2018-10-26 | SEMICONDUCTOR PROCESSING DEVICE |
FR1912926A Active FR3091954B3 (en) | 2017-10-31 | 2019-11-20 | SEMICONDUCTOR TREATMENT DEVICE |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1912926A Active FR3091954B3 (en) | 2017-10-31 | 2019-11-20 | SEMICONDUCTOR TREATMENT DEVICE |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP3219636U (en) |
KR (1) | KR200493938Y1 (en) |
CN (1) | CN208938918U (en) |
DE (1) | DE202018106098U1 (en) |
FR (2) | FR3073084B3 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7353106B2 (en) * | 2019-09-09 | 2023-09-29 | 日本特殊陶業株式会社 | holding device |
JP7281374B2 (en) * | 2019-09-09 | 2023-05-25 | 日本特殊陶業株式会社 | Retaining device and method for manufacturing the retaining device |
JP7445420B2 (en) * | 2019-12-23 | 2024-03-07 | 日本特殊陶業株式会社 | Parts for semiconductor manufacturing equipment |
JP7446176B2 (en) * | 2020-07-31 | 2024-03-08 | 東京エレクトロン株式会社 | Mounting table and plasma processing equipment |
JP7425034B2 (en) | 2021-12-01 | 2024-01-30 | 三菱電線工業株式会社 | Protective ring, adhesive surface protection structure equipped with the same, and adhesive surface protection method |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0742588A3 (en) * | 1995-05-11 | 1997-08-27 | Applied Materials Inc | Method of protecting electrostatic chuck |
JP2000114358A (en) * | 1998-10-05 | 2000-04-21 | Tomoegawa Paper Co Ltd | Electrostatic chuck device |
US20060273277A1 (en) * | 2005-06-02 | 2006-12-07 | Heller Mark J | Plasma resistant seal assembly with replaceable barrier shield |
CN107195578B (en) * | 2017-07-17 | 2019-11-29 | 北京北方华创微电子装备有限公司 | Electrostatic chuck |
-
2018
- 2018-10-25 DE DE202018106098.8U patent/DE202018106098U1/en active Active
- 2018-10-26 KR KR2020180004871U patent/KR200493938Y1/en active IP Right Grant
- 2018-10-26 JP JP2018004178U patent/JP3219636U/en active Active
- 2018-10-26 CN CN201821778556.3U patent/CN208938918U/en active Active
- 2018-10-26 FR FR1859962A patent/FR3073084B3/en active Active
-
2019
- 2019-11-20 FR FR1912926A patent/FR3091954B3/en active Active
Also Published As
Publication number | Publication date |
---|---|
DE202018106098U1 (en) | 2018-11-19 |
FR3073084A3 (en) | 2019-05-03 |
JP3219636U (en) | 2019-01-10 |
FR3091954A3 (en) | 2020-07-24 |
CN208938918U (en) | 2019-06-04 |
FR3091954B3 (en) | 2021-01-29 |
KR20200000695U (en) | 2020-04-01 |
KR200493938Y1 (en) | 2021-07-01 |
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