FR3064151B1 - Procede de fabrication de circuits electriques, circuit electrique et composant electronique - Google Patents

Procede de fabrication de circuits electriques, circuit electrique et composant electronique Download PDF

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Publication number
FR3064151B1
FR3064151B1 FR1752216A FR1752216A FR3064151B1 FR 3064151 B1 FR3064151 B1 FR 3064151B1 FR 1752216 A FR1752216 A FR 1752216A FR 1752216 A FR1752216 A FR 1752216A FR 3064151 B1 FR3064151 B1 FR 3064151B1
Authority
FR
France
Prior art keywords
electrical circuits
electronic component
manufacturing process
circuits
component manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1752216A
Other languages
English (en)
Other versions
FR3064151A1 (fr
Inventor
Fabien Marcq
Jean-Fabien Capsal
Pierre-Jean Cottinet
Minh Quyen Le
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Institut National des Sciences Appliquees de Lyon
Linxens Holding SAS
Original Assignee
Institut National des Sciences Appliquees de Lyon
Linxens Holding SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Institut National des Sciences Appliquees de Lyon , Linxens Holding SAS filed Critical Institut National des Sciences Appliquees de Lyon
Priority to FR1752216A priority Critical patent/FR3064151B1/fr
Priority to PCT/FR2018/050640 priority patent/WO2018167441A1/fr
Publication of FR3064151A1 publication Critical patent/FR3064151A1/fr
Application granted granted Critical
Publication of FR3064151B1 publication Critical patent/FR3064151B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
    • H10N15/10—Thermoelectric devices using thermal change of the dielectric constant, e.g. working above and below the Curie point
    • H10N15/15—Thermoelectric active materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/092—Forming composite materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Insulating Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne un procédé de la fabrication de circuits électrique, dans lequel on utilise une matrice diélectrique de résine polymère chargée de particules (1) ayant au moins l'une des propriétés choisies parmi des propriétés piézoélectriques, ferroélectriques, pyroélectriques et diélectriques. L'invention concerne également des circuits électriques fabriqués selon ce procédé ou des composants électroniques comportant un circuit électrique fabriqué selon ce procédé. Les circuits électriques ou composants électroniques ainsi fabriqués peuvent être utilisés pour réaliser des capteurs, des détecteurs, des sources de tension, des circuits intégrés, des antennes, etc.
FR1752216A 2017-03-17 2017-03-17 Procede de fabrication de circuits electriques, circuit electrique et composant electronique Expired - Fee Related FR3064151B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR1752216A FR3064151B1 (fr) 2017-03-17 2017-03-17 Procede de fabrication de circuits electriques, circuit electrique et composant electronique
PCT/FR2018/050640 WO2018167441A1 (fr) 2017-03-17 2018-03-16 Procédé de fabrication de complexes pour circuits électriques, circuit électrique et composant électronique

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1752216 2017-03-17
FR1752216A FR3064151B1 (fr) 2017-03-17 2017-03-17 Procede de fabrication de circuits electriques, circuit electrique et composant electronique

Publications (2)

Publication Number Publication Date
FR3064151A1 FR3064151A1 (fr) 2018-09-21
FR3064151B1 true FR3064151B1 (fr) 2021-10-15

Family

ID=60302153

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1752216A Expired - Fee Related FR3064151B1 (fr) 2017-03-17 2017-03-17 Procede de fabrication de circuits electriques, circuit electrique et composant electronique

Country Status (2)

Country Link
FR (1) FR3064151B1 (fr)
WO (1) WO2018167441A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112928199B (zh) * 2021-01-29 2022-09-06 上海交通大学 一种高灵敏柔性传感器及其制备方法和应用

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1261844A (zh) * 1997-05-02 2000-08-02 伊索拉层压***公司 用于电路板的挤压层合芯板
JP2002324729A (ja) * 2001-02-22 2002-11-08 Tdk Corp 電子部品とその製造方法
FR2953824B1 (fr) * 2009-12-11 2015-04-24 Univ Toulouse 3 Paul Sabatier Materiau solide composite piezoelectrique et/ou pyroelectrique, procede d'obtention et utilisation d'un tel materiau
CA2892989A1 (fr) * 2014-01-29 2015-07-29 Tarun Amla Materiaux preimpregnes et stratifies ayant des proprietes dielectriques homogenes

Also Published As

Publication number Publication date
WO2018167441A1 (fr) 2018-09-20
FR3064151A1 (fr) 2018-09-21

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