FR3062546B1 - Structure de diffraction integree dans une carte de circuit imprime et procede de fabrication de celle-ci - Google Patents

Structure de diffraction integree dans une carte de circuit imprime et procede de fabrication de celle-ci Download PDF

Info

Publication number
FR3062546B1
FR3062546B1 FR1750852A FR1750852A FR3062546B1 FR 3062546 B1 FR3062546 B1 FR 3062546B1 FR 1750852 A FR1750852 A FR 1750852A FR 1750852 A FR1750852 A FR 1750852A FR 3062546 B1 FR3062546 B1 FR 3062546B1
Authority
FR
France
Prior art keywords
circuit board
printed circuit
manufacturing
diffraction structure
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1750852A
Other languages
English (en)
Other versions
FR3062546A1 (fr
Inventor
Friedbald Kiel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Institut Vedecom
Original Assignee
Institut Vedecom
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Institut Vedecom filed Critical Institut Vedecom
Priority to FR1750852A priority Critical patent/FR3062546B1/fr
Priority to JP2019541226A priority patent/JP2020511774A/ja
Priority to EP18706787.1A priority patent/EP3578018A1/fr
Priority to PCT/FR2018/050202 priority patent/WO2018142055A1/fr
Priority to CN201880009838.3A priority patent/CN110383958A/zh
Priority to US16/480,303 priority patent/US10912191B2/en
Publication of FR3062546A1 publication Critical patent/FR3062546A1/fr
Application granted granted Critical
Publication of FR3062546B1 publication Critical patent/FR3062546B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/02—Simple or compound lenses with non-spherical faces
    • G02B3/08—Simple or compound lenses with non-spherical faces with discontinuous faces, e.g. Fresnel lens
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/18—Diffraction gratings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/18—Diffraction gratings
    • G02B5/1847—Manufacturing methods
    • G02B5/1857—Manufacturing methods using exposure or etching means, e.g. holography, photolithography, exposure to electron or ion beams
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/18—Diffraction gratings
    • G02B5/1866—Transmission gratings characterised by their structure, e.g. step profile, contours of substrate or grooves, pitch variations, materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
    • G03H1/02—Details of features involved during the holographic process; Replication of holograms without interference recording
    • G03H1/024—Hologram nature or properties
    • G03H1/0244—Surface relief holograms
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/32—Holograms used as optical elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H2260/00—Recording materials or recording processes
    • G03H2260/50—Reactivity or recording processes
    • G03H2260/62—Direct etching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H2260/00—Recording materials or recording processes
    • G03H2260/50—Reactivity or recording processes
    • G03H2260/63—Indirect etching, e.g. lithography
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1006—Non-printed filter
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/061—Lamination of previously made multilayered subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)
  • Led Device Packages (AREA)
  • Transmitters (AREA)

Abstract

La structure de diffraction selon l'invention est intégrée dans une carte de circuit imprimé (1) et comprend une plaque de diffraction (17) formée sur une face extérieure de la carte de circuit imprimé et une cavité (15) formée dans l'épaisseur de la carte de circuit imprimé (1) et située sous la plaque de diffraction. L'invention est applicable pour des dispositifs émetteurs ou récepteurs, des transducteurs, des capteurs, des détecteurs et autres, dans les domaines des micro-ondes, de l'optique et de l'acoustique.
FR1750852A 2017-02-01 2017-02-01 Structure de diffraction integree dans une carte de circuit imprime et procede de fabrication de celle-ci Active FR3062546B1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FR1750852A FR3062546B1 (fr) 2017-02-01 2017-02-01 Structure de diffraction integree dans une carte de circuit imprime et procede de fabrication de celle-ci
JP2019541226A JP2020511774A (ja) 2017-02-01 2018-01-30 一体化された回折構造を含む印刷回路を伴う電子カード、及びその製造方法
EP18706787.1A EP3578018A1 (fr) 2017-02-01 2018-01-30 Carte électronique à circuit imprimé comprenant une structure de diffraction integrée et procédé de fabrication de celle-ci
PCT/FR2018/050202 WO2018142055A1 (fr) 2017-02-01 2018-01-30 Carte électronique à circuit imprimé comprenant une structure de diffraction integrée et procédé de fabrication de celle-ci
CN201880009838.3A CN110383958A (zh) 2017-02-01 2018-01-30 包括集成衍射结构的电子印刷电路板及其制造方法
US16/480,303 US10912191B2 (en) 2017-02-01 2018-01-30 Electronic card with printed circuit comprising an integrated diffraction structure and method for the production thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1750852A FR3062546B1 (fr) 2017-02-01 2017-02-01 Structure de diffraction integree dans une carte de circuit imprime et procede de fabrication de celle-ci
FR1750852 2017-02-01

Publications (2)

Publication Number Publication Date
FR3062546A1 FR3062546A1 (fr) 2018-08-03
FR3062546B1 true FR3062546B1 (fr) 2021-09-10

Family

ID=59152993

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1750852A Active FR3062546B1 (fr) 2017-02-01 2017-02-01 Structure de diffraction integree dans une carte de circuit imprime et procede de fabrication de celle-ci

Country Status (6)

Country Link
US (1) US10912191B2 (fr)
EP (1) EP3578018A1 (fr)
JP (1) JP2020511774A (fr)
CN (1) CN110383958A (fr)
FR (1) FR3062546B1 (fr)
WO (1) WO2018142055A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI812074B (zh) * 2022-03-16 2023-08-11 大陸商芯愛科技（南京）有限公司 封裝基板及其製法
CN114828407A (zh) * 2022-03-30 2022-07-29 青岛歌尔智能传感器有限公司 一种感光器件和电子设备

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5041849A (en) 1989-12-26 1991-08-20 Xerox Corporation Multi-discrete-phase Fresnel acoustic lenses and their application to acoustic ink printing
US6007183A (en) * 1997-11-25 1999-12-28 Xerox Corporation Acoustic metal jet fabrication using an inert gas
US6302524B1 (en) * 1998-10-13 2001-10-16 Xerox Corporation Liquid level control in an acoustic droplet emitter
US6925856B1 (en) * 2001-11-07 2005-08-09 Edc Biosystems, Inc. Non-contact techniques for measuring viscosity and surface tension information of a liquid
KR100580753B1 (ko) * 2004-12-17 2006-05-15 엘지이노텍 주식회사 발광소자 패키지
JP2006324398A (ja) * 2005-05-18 2006-11-30 Ngk Spark Plug Co Ltd 配線基板
KR100827317B1 (ko) * 2005-09-07 2008-05-06 삼성전기주식회사 연성 기판을 이용한 초소형 광 변조기 모듈
US7719170B1 (en) 2007-01-11 2010-05-18 University Of Southern California Self-focusing acoustic transducer with fresnel lens
US8221963B2 (en) * 2007-12-27 2012-07-17 Seiko Epson Corporation Method for producing fine structure
WO2009115946A1 (fr) * 2008-03-18 2009-09-24 Philips Intellectual Property & Standards Gmbh Module de capteur optique
JP5173907B2 (ja) * 2009-03-25 2013-04-03 トッパン・フォームズ株式会社 配線基材の製造方法
WO2010122458A1 (fr) * 2009-04-20 2010-10-28 Koninklijke Philips Electronics N.V. Textile électroluminescent présentant une couche de diffusion de lumière à transmission optique accrue
JP2011187108A (ja) * 2010-03-05 2011-09-22 Hitachi Maxell Ltd 偏光性回折格子及びその製造方法、並びに、その偏光性回折格子を用いた光ピックアップ装置
JP2011210945A (ja) * 2010-03-30 2011-10-20 Brother Industries Ltd 多層プリント配線板の製造方法
US9184414B2 (en) * 2010-04-22 2015-11-10 Idemitsu Kosan Co., Ltd. Organic electroluminescent element and lighting device
CN103221740B (zh) * 2010-11-18 2015-02-25 日本电气株式会社 光源单元和具有其的投影显示设备
JP4962635B1 (ja) * 2011-03-15 2012-06-27 オムロン株式会社 光半導体パッケージおよび光半導体モジュールならびにこれらの製造方法
JP6042103B2 (ja) * 2012-05-30 2016-12-14 ユー・ディー・シー アイルランド リミテッド 有機電界発光素子
KR101420514B1 (ko) * 2012-10-23 2014-07-17 삼성전기주식회사 전자부품들이 구비된 기판구조 및 전자부품들이 구비된 기판구조의 제조방법
EP2802009B1 (fr) * 2013-05-08 2021-03-24 ams AG Dispositif d'imagerie intégré pour un rayonnement infrarouge et procédé de production
US9827804B2 (en) * 2014-05-13 2017-11-28 Toppan Printing Co., Ltd. Diffraction structure transfer foil and forgery prevention medium using same
DE102014013563A1 (de) * 2014-09-18 2016-03-24 Plastic Electronic Gmbh Verfahren zur Herstellung einer bestückt umformbaren, hinterspritzbaren Schaltungsträgereinheit,sowie Schaltungsträgereinheit
US10091887B2 (en) * 2015-04-02 2018-10-02 Tactotek Oy Multi-material structure with embedded electronics
JP6657941B2 (ja) * 2015-12-28 2020-03-04 凸版印刷株式会社 液晶積層体、および、液晶積層体の製造方法
US10642057B2 (en) * 2017-07-20 2020-05-05 Benq Materials Corporation Light redirecting film and method for manufacturing the same

Also Published As

Publication number Publication date
EP3578018A1 (fr) 2019-12-11
FR3062546A1 (fr) 2018-08-03
US20190373720A1 (en) 2019-12-05
WO2018142055A1 (fr) 2018-08-09
JP2020511774A (ja) 2020-04-16
CN110383958A (zh) 2019-10-25
US10912191B2 (en) 2021-02-02

Similar Documents

Publication Publication Date Title
EP3583890A3 (fr) Dispositif de mesure magnétique
FR3062546B1 (fr) Structure de diffraction integree dans une carte de circuit imprime et procede de fabrication de celle-ci
DE60226383D1 (de) Verarbeitung der Signale eines Bildsensors mit mehreren Sensorchips
ATE434395T1 (de) Kabelverwaltungssystem und herstellungsverfahren davon.
WO2007025002A3 (fr) Signal de trafic avec des detecteurs integres
MX2019007158A (es) Dispositivos y sensores para cosecha de energía, métodos para fabricarlos, y su uso.
ATE546964T1 (de) Vorrichtung zur fusionierung räumlicher audioströme
WO2016048438A3 (fr) Détection acoustique dans des environnements de traitement
ATE487132T1 (de) Vorrichtung mit piezoakustischem resonatorelement und deren verwendung zur ausgabe eines signals in abhängigkeit einer resonanzfrequenz
MX2020012937A (es) Dispositivos y sensores de recolección de energía y métodos de fabricación y uso de estos.
DE502005003775D1 (de) Vorrichtung und verfahren zur schwingungsbeeinflussung eines flächenelementes
SE1750678A1 (en) A surface acoustic wave resonant sensor
HK1093097A1 (en) Angular speed measuring transducer
JP2019111093A5 (fr)
WO2016027056A3 (fr) Calcul de contrainte de contact ou de charge de contact au moyen de données ultrasonores
JP2015087257A5 (fr)
FR3017482B1 (fr) Procede de transmission d'un modele d'environnement
WO2015038131A3 (fr) Ice variable et procédés de mesure de propriétés d'échantillon avec celui-ci
FR2863701B1 (fr) Procede de compensation d'une anisotropie dans un capteur de rotation inertiel a cloche vibrante
IT9021799U1 (it) Disposizione di montaggio di un trasduttore di ultrasuoni su di una va sca di lavaggio.
EA201692244A3 (ru) Ультразвуковой измерительный преобразователь и способ изготовления ультразвукового измерительного преобразователя
FR3064062B1 (fr) Detecteur pyroelectrique
TH173583B (th) ตัวเรียงแนวที่มีสี่ล้อและระบบอิเล็กทรอนิกส์, แผงประมวลผลกลาง, และแผงกล้องถ่ายภาพของสิ่งเดียวกัน
CN107966224A (zh) 一种压力传感器
EA202092885A1 (ru) Устройства и датчики для аккумулирования энергии и способы их получения и применения

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 2

PLSC Publication of the preliminary search report

Effective date: 20180803

PLFP Fee payment

Year of fee payment: 4

PLFP Fee payment

Year of fee payment: 5

PLFP Fee payment

Year of fee payment: 6

PLFP Fee payment

Year of fee payment: 7

PLFP Fee payment

Year of fee payment: 8