FR3062525B1 - Antenne a fentes integree dans une carte de circuit imprime et procede de fabrication de celle-ci - Google Patents
Antenne a fentes integree dans une carte de circuit imprime et procede de fabrication de celle-ci Download PDFInfo
- Publication number
- FR3062525B1 FR3062525B1 FR1750851A FR1750851A FR3062525B1 FR 3062525 B1 FR3062525 B1 FR 3062525B1 FR 1750851 A FR1750851 A FR 1750851A FR 1750851 A FR1750851 A FR 1750851A FR 3062525 B1 FR3062525 B1 FR 3062525B1
- Authority
- FR
- France
- Prior art keywords
- circuit board
- printed circuit
- manufacturing
- same
- antenna integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/10—Resonant slot antennas
- H01Q13/18—Resonant slot antennas the slot being backed by, or formed in boundary wall of, a resonant cavity ; Open cavity antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/064—Two dimensional planar arrays using horn or slot aerials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Waveguide Aerials (AREA)
- Details Of Aerials (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
L'antenne à fentes (AT) est intégrée dans une carte de circuit imprimé et comprend une couche conductrice métallique (17) ayant une pluralité de fentes (S17). Les fentes forment des ouvertures dans la couche conductrice métallique. Conformément à l'invention, l'antenne à fentes comprend une cavité (15) qui est formée dans l'épaisseur de la carte de circuit imprimé et est située sous la pluralité de fentes de la couche conductrice métallique.
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1750851A FR3062525B1 (fr) | 2017-02-01 | 2017-02-01 | Antenne a fentes integree dans une carte de circuit imprime et procede de fabrication de celle-ci |
KR1020197025263A KR20190139836A (ko) | 2017-02-01 | 2018-01-29 | 통합된 슬롯들을 가진 안테나를 포함하는 인쇄 회로를 구비한 전자 카드 및 그 제조 방법 |
EP18705686.6A EP3577722A1 (fr) | 2017-02-01 | 2018-01-29 | Carte électronique à circuit imprimé comprenant une antenne à fentes intégrée et procédé de fabrication de celle-ci |
PCT/FR2018/050195 WO2018142051A1 (fr) | 2017-02-01 | 2018-01-29 | Carte électronique à circuit imprimé comprenant une antenne à fentes intégrée et procédé de fabrication de celle-ci |
JP2019541295A JP2020506618A (ja) | 2017-02-01 | 2018-01-29 | 一体化されたスロット付きアンテナを含む印刷回路基板を伴う電子カード、及びその製造方法 |
US16/480,304 US11177139B2 (en) | 2017-02-01 | 2018-01-29 | Electronic card with printed circuit comprising an antenna with integrated slots and method for the production thereof |
CN201880009828.XA CN110268582A (zh) | 2017-02-01 | 2018-01-29 | 包括集成缝隙天线的电子印刷电路板及其制造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1750851 | 2017-02-01 | ||
FR1750851A FR3062525B1 (fr) | 2017-02-01 | 2017-02-01 | Antenne a fentes integree dans une carte de circuit imprime et procede de fabrication de celle-ci |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3062525A1 FR3062525A1 (fr) | 2018-08-03 |
FR3062525B1 true FR3062525B1 (fr) | 2020-11-20 |
Family
ID=59152992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1750851A Active FR3062525B1 (fr) | 2017-02-01 | 2017-02-01 | Antenne a fentes integree dans une carte de circuit imprime et procede de fabrication de celle-ci |
Country Status (7)
Country | Link |
---|---|
US (1) | US11177139B2 (fr) |
EP (1) | EP3577722A1 (fr) |
JP (1) | JP2020506618A (fr) |
KR (1) | KR20190139836A (fr) |
CN (1) | CN110268582A (fr) |
FR (1) | FR3062525B1 (fr) |
WO (1) | WO2018142051A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220061572A (ko) * | 2020-11-06 | 2022-05-13 | 삼성전자주식회사 | 안테나를 포함하는 전자 장치 |
US11889666B2 (en) | 2021-11-03 | 2024-01-30 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power device assemblies having embedded PCBs and methods of fabricating the same |
KR102640270B1 (ko) | 2023-12-07 | 2024-02-27 | 주식회사 월드씨엔에스 | 개선된 방열 성능을 지닌 led 조명 장치 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6049311A (en) * | 1999-03-05 | 2000-04-11 | The Whitaker Corporation | Planar flat plate scanning antenna |
JP4022052B2 (ja) * | 2001-07-18 | 2007-12-12 | 日本放送協会 | アクティブフェーズドアレーアンテナ及びそれを用いた送信装置 |
US6778144B2 (en) * | 2002-07-02 | 2004-08-17 | Raytheon Company | Antenna |
FR2901062B1 (fr) * | 2006-05-12 | 2008-07-04 | Alcatel Sa | Dispositif rayonnant a cavite(s) resonnante(s) a air a fort rendement de surface, pour une antenne reseau |
US7518229B2 (en) * | 2006-08-03 | 2009-04-14 | International Business Machines Corporation | Versatile Si-based packaging with integrated passive components for mmWave applications |
EP2034429A1 (fr) * | 2007-09-05 | 2009-03-11 | Assa Abloy AB | Procédé de fabrication d'une carte et carte obtenue selon ledit procédé |
TWI458400B (zh) * | 2008-10-31 | 2014-10-21 | Taiyo Yuden Kk | Printed circuit board and manufacturing method thereof |
US20100238085A1 (en) * | 2009-03-23 | 2010-09-23 | Toyota Motor Engineering & Manufacturing North America, Inc. | Plastic waveguide slot array and method of manufacture |
WO2011030277A2 (fr) * | 2009-09-08 | 2011-03-17 | Yigal Leiba | Interfaces de puce de radiofréquence (rfic) et structures d'onde millimétrique |
FR2959611B1 (fr) * | 2010-04-30 | 2012-06-08 | Thales Sa | Element rayonnant compact a cavites resonantes. |
US8674885B2 (en) * | 2010-08-31 | 2014-03-18 | Siklu Communication ltd. | Systems for interfacing waveguide antenna feeds with printed circuit boards |
US8895380B2 (en) | 2010-11-22 | 2014-11-25 | Bridge Semiconductor Corporation | Method of making semiconductor assembly with built-in stiffener and semiconductor assembly manufactured thereby |
US8865525B2 (en) * | 2010-11-22 | 2014-10-21 | Bridge Semiconductor Corporation | Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby |
DE102011005145A1 (de) * | 2011-03-04 | 2012-09-06 | Rohde & Schwarz Gmbh & Co. Kg | Leiterplattenanordnung für Millimeterwellen-Scanner |
US9219041B2 (en) * | 2012-03-29 | 2015-12-22 | International Business Machines Corporation | Electronic package for millimeter wave semiconductor dies |
US20140246227A1 (en) * | 2013-03-01 | 2014-09-04 | Bridge Semiconductor Corporation | Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby |
WO2014154231A1 (fr) * | 2013-03-24 | 2014-10-02 | Telefonaktiebolaget L M Ericsson (Publ) | Agencement d'antenne siw |
-
2017
- 2017-02-01 FR FR1750851A patent/FR3062525B1/fr active Active
-
2018
- 2018-01-29 JP JP2019541295A patent/JP2020506618A/ja active Pending
- 2018-01-29 KR KR1020197025263A patent/KR20190139836A/ko unknown
- 2018-01-29 WO PCT/FR2018/050195 patent/WO2018142051A1/fr unknown
- 2018-01-29 CN CN201880009828.XA patent/CN110268582A/zh active Pending
- 2018-01-29 EP EP18705686.6A patent/EP3577722A1/fr not_active Withdrawn
- 2018-01-29 US US16/480,304 patent/US11177139B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US11177139B2 (en) | 2021-11-16 |
KR20190139836A (ko) | 2019-12-18 |
EP3577722A1 (fr) | 2019-12-11 |
JP2020506618A (ja) | 2020-02-27 |
US20190371622A1 (en) | 2019-12-05 |
FR3062525A1 (fr) | 2018-08-03 |
WO2018142051A1 (fr) | 2018-08-09 |
CN110268582A (zh) | 2019-09-20 |
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