FR3058262A1 - Dispositif electronique protege - Google Patents
Dispositif electronique protege Download PDFInfo
- Publication number
- FR3058262A1 FR3058262A1 FR1660567A FR1660567A FR3058262A1 FR 3058262 A1 FR3058262 A1 FR 3058262A1 FR 1660567 A FR1660567 A FR 1660567A FR 1660567 A FR1660567 A FR 1660567A FR 3058262 A1 FR3058262 A1 FR 3058262A1
- Authority
- FR
- France
- Prior art keywords
- phase change
- electronic device
- change material
- gel
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012782 phase change material Substances 0.000 claims abstract description 53
- 230000001681 protective effect Effects 0.000 claims abstract description 16
- 230000004888 barrier function Effects 0.000 claims abstract description 14
- 230000008859 change Effects 0.000 claims abstract description 14
- 238000000926 separation method Methods 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims description 17
- 239000002775 capsule Substances 0.000 claims description 12
- 150000003839 salts Chemical class 0.000 claims description 4
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 3
- 239000000194 fatty acid Substances 0.000 claims description 3
- 229930195729 fatty acid Natural products 0.000 claims description 3
- 150000004665 fatty acids Chemical class 0.000 claims description 3
- 230000001737 promoting effect Effects 0.000 claims description 3
- 239000000499 gel Substances 0.000 description 55
- 239000010410 layer Substances 0.000 description 23
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 239000012071 phase Substances 0.000 description 7
- 239000012188 paraffin wax Substances 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000013016 damping Methods 0.000 description 3
- 210000000056 organ Anatomy 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 239000012074 organic phase Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001200 Ferrotitanium Inorganic materials 0.000 description 1
- 241000264877 Hippospongia communis Species 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000013528 metallic particle Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/10—Elements for damping the movement of parts
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
- H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/20—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only
- H04N23/21—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only from near infrared [NIR] radiation
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/33—Transforming infrared radiation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0058—Casings specially adapted for optoelectronic applications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
- G01J5/041—Mountings in enclosures or in a particular environment
- G01J5/044—Environment with strong vibrations or shocks
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20463—Filling compound, e.g. potted resin
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Casings For Electric Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
Claims (16)
- REVENDICATIONS1. Dispositif électronique comportant :un composant électronique (12); un bouclier de protection comportant :un matériau à changement de phase (20) présentant une température de changement de phase comprise entre 20°C et 90°C, un gel antivibratoire (16) présentant un comportement hyperélastique et/ou viscoélastique à 20°C, une barrière de séparation (18) disposée de manière à séparer le matériau à changement de phase et le gel antivibratoire, le gel antivibratoire étant disposé, au moins en partie, en contact avec le composant électronique, et présentant une conductivité thermique supérieure à 1 W/m.K à 20°C.
- 2. Dispositif électronique selon la revendication immédiatement précédente, dans lequel le gel antivibratoire présente une conductivité thermique supérieure à 2 W/m.K à 20°C.
- 3. Dispositif électronique selon la revendication immédiatement précédente, dans lequel le gel antivibratoire présente une conductivité thermique supérieure à 2,5 W/m.K à 20°C.
- 4. Dispositif électronique selon l’une quelconque des revendications précédentes, dans lequel le gel antivibratoire présente un module d'élasticité à 20°C inférieur à 1 MPa.
- 5. Dispositif électronique selon l’une quelconque des revendications précédentes, dans lequel le matériau à changement de phase présente une température de changement de phase supérieure à 60°C.
- 6. Dispositif électronique selon l’une quelconque des revendications précédentes, dans lequel le matériau à changement de phase est choisi dans le groupe formé par les paraffines, les acides gras et les sels hydratés.
- 7. Dispositif électronique selon l’une quelconque des revendications précédentes, dans lequel le gel antivibratoire est disposé, au moins en partie, entre le composant électronique et le matériau à changement de phase.
- 8. Dispositif électronique selon l’une quelconque des revendications précédentes, dans lequel le gel antivibratoire est disposé, au moins en partie, entre le composant électronique et le matériau à changement de phase, la barrière de séparation présentant la forme d’une coque intérieure (18) présentant une épaisseur inférieure à 3 mm, le matériau de ladite coque intérieure présentant une conductivité thermique supérieure à 5 W/m.K.
- 9. Dispositif électronique selon l’une quelconque des revendications précédentes, dans lequel la barrière de séparation est en un matériau présentant une conductivité thermique supérieure à 10 W/m.K.
- 10. Dispositif électronique selon l’une quelconque des revendications précédentes, dans lequel le matériau à changement de phase est, au moins en partie, contenu dans des capsules dispersées au sein du gel antivibratoire, la plus grande dimension d'une capsule quelconque étant inférieure à 100 pm.
- 11. Dispositif électronique selon l’une quelconque des revendications précédentes, comportant une coque extérieure (22) contenant le composant électronique, le matériau à changement de phase, le gel antivibratoire et ladite barrière de séparation.
- 12. Dispositif électronique selon l’une quelconque des revendications précédentes, dans lequel la coque extérieure et/ou, lorsque la revendication 8 s’applique, la coque intérieure présente(nt) des nervures favorisant les échanges thermiques entre le matériau à changement de phase et l’environnement extérieur, et entre le gel antivibratoire et le matériau à changement de phase, respectivement.
- 13. Dispositif électronique selon l’une quelconque des revendications précédentes, dans lequel la coque extérieure et/ou, lorsque la revendication 8 s’applique, la coque intérieure présente(nt) un blindage électromagnétique.
- 14. Dispositif électronique selon l’une quelconque des revendications précédentes, dans lequel le composant électronique comporte une caméra infrarouge.
- 15. Groupe moteur comportant un moteur, un dispositif électronique selon l’une quelconque des revendications précédentes, et, optionnellement, un organe5 dit « surveillé », ledit dispositif étant configuré pour surveiller le fonctionnement dudit moteur et/ou dudit organe surveillé.
- 16. Véhicule automobile, aérien ou spatial, comportant un dispositif électronique selon l’une quelconque des revendications 1 à 14 et/ou un groupe moteur selon la revendication immédiatement précédente.1/2
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1660567A FR3058262A1 (fr) | 2016-10-31 | 2016-10-31 | Dispositif electronique protege |
GB1717985.4A GB2558723B (en) | 2016-10-31 | 2017-10-31 | Protective shield for an electronic device |
CN201711047544.3A CN108012472B (zh) | 2016-10-31 | 2017-10-31 | 防护电子设备 |
US15/799,500 US10798850B2 (en) | 2016-10-31 | 2017-10-31 | Protected electronic device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1660567 | 2016-10-31 | ||
FR1660567A FR3058262A1 (fr) | 2016-10-31 | 2016-10-31 | Dispositif electronique protege |
Publications (1)
Publication Number | Publication Date |
---|---|
FR3058262A1 true FR3058262A1 (fr) | 2018-05-04 |
Family
ID=58213192
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1660567A Pending FR3058262A1 (fr) | 2016-10-31 | 2016-10-31 | Dispositif electronique protege |
Country Status (4)
Country | Link |
---|---|
US (1) | US10798850B2 (fr) |
CN (1) | CN108012472B (fr) |
FR (1) | FR3058262A1 (fr) |
GB (1) | GB2558723B (fr) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019118908A1 (fr) | 2017-12-14 | 2019-06-20 | Adaptive Global Solutions, LLC | Véhicule aérien résistant aux incendies permettant d'éteindre des incendies étendus |
US10575393B1 (en) * | 2018-11-13 | 2020-02-25 | International Business Machines Corporation | Heat-shielding microcapsules for protecting temperature sensitive components |
CN109526172A (zh) * | 2019-01-08 | 2019-03-26 | 中国联合网络通信集团有限公司 | 机箱及射频装置 |
FR3099639B1 (fr) * | 2019-08-01 | 2021-07-23 | Commissariat Energie Atomique | Dispositif de gestion thermique et électromagnétique d'un module électronique |
CN111447343B (zh) * | 2020-04-09 | 2021-07-23 | 北华航天工业学院 | 一种摄像机专用低温防护装置 |
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JP2005129820A (ja) * | 2003-10-27 | 2005-05-19 | Mitsubishi Electric Corp | 電子回路装置 |
US20050104029A1 (en) * | 2002-01-07 | 2005-05-19 | Mark Neuschuetz | Use of paraffin-containing powders as phase-change materials (pcm) in polymer composites in cooling devices |
EP2107864A2 (fr) * | 2008-03-31 | 2009-10-07 | Hitachi Ltd. | Dispositif de commande |
FR2932944A1 (fr) * | 2008-06-20 | 2009-12-25 | Thales Sa | Dispositif electronique comportant une interface thermique elastique avec des composants electroniques |
KR20140053629A (ko) * | 2012-10-26 | 2014-05-08 | 엔트리움 주식회사 | 열 계면 물질(접착제) 및 이를 포함하는 반도체 칩 패키지 |
EP2738803A2 (fr) * | 2012-11-30 | 2014-06-04 | GE Aviation Systems LLC | Dissipateur de chaleur à changement de phase pour la gestion thermique transitoire |
JP2015056562A (ja) * | 2013-09-12 | 2015-03-23 | 株式会社東芝 | 半導体装置及び放射線装置 |
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ES2310575T3 (es) * | 2001-07-19 | 2009-01-16 | Otto Bock Healthcare Gmbh | Material de un gel de poliuretano, procedimiento de fabricacion y aplicaciones. |
US20080131722A1 (en) * | 2006-03-21 | 2008-06-05 | Ephraim Suhir | Single Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices |
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CN201903400U (zh) * | 2010-11-29 | 2011-07-20 | 中国科学院西安光学精密机械研究所 | 一种小型红外*** |
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CN102548361B (zh) * | 2011-12-21 | 2014-12-10 | 华中科技大学 | 利用潜热型功能流体的散热装置及其散热方法 |
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US9537344B2 (en) * | 2013-02-21 | 2017-01-03 | Cyberonics, Inc. | Phase change material as a dynamic heat sink for trancutaneous energy transmission systems |
US10431858B2 (en) * | 2015-02-04 | 2019-10-01 | Global Web Horizons, Llc | Systems, structures and materials for electrochemical device thermal management |
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2016
- 2016-10-31 FR FR1660567A patent/FR3058262A1/fr active Pending
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2017
- 2017-10-31 GB GB1717985.4A patent/GB2558723B/en active Active
- 2017-10-31 US US15/799,500 patent/US10798850B2/en active Active
- 2017-10-31 CN CN201711047544.3A patent/CN108012472B/zh active Active
Patent Citations (8)
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---|---|---|---|---|
US20030112603A1 (en) * | 2001-12-13 | 2003-06-19 | Roesner Arlen L. | Thermal interface |
US20050104029A1 (en) * | 2002-01-07 | 2005-05-19 | Mark Neuschuetz | Use of paraffin-containing powders as phase-change materials (pcm) in polymer composites in cooling devices |
JP2005129820A (ja) * | 2003-10-27 | 2005-05-19 | Mitsubishi Electric Corp | 電子回路装置 |
EP2107864A2 (fr) * | 2008-03-31 | 2009-10-07 | Hitachi Ltd. | Dispositif de commande |
FR2932944A1 (fr) * | 2008-06-20 | 2009-12-25 | Thales Sa | Dispositif electronique comportant une interface thermique elastique avec des composants electroniques |
KR20140053629A (ko) * | 2012-10-26 | 2014-05-08 | 엔트리움 주식회사 | 열 계면 물질(접착제) 및 이를 포함하는 반도체 칩 패키지 |
EP2738803A2 (fr) * | 2012-11-30 | 2014-06-04 | GE Aviation Systems LLC | Dissipateur de chaleur à changement de phase pour la gestion thermique transitoire |
JP2015056562A (ja) * | 2013-09-12 | 2015-03-23 | 株式会社東芝 | 半導体装置及び放射線装置 |
Also Published As
Publication number | Publication date |
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GB201717985D0 (en) | 2017-12-13 |
CN108012472B (zh) | 2020-10-27 |
GB2558723B (en) | 2021-11-03 |
US10798850B2 (en) | 2020-10-06 |
US20180124945A1 (en) | 2018-05-03 |
CN108012472A (zh) | 2018-05-08 |
GB2558723A (en) | 2018-07-18 |
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