FR3051033B1 - Dispositif emetteur de lumiere - Google Patents

Dispositif emetteur de lumiere Download PDF

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Publication number
FR3051033B1
FR3051033B1 FR1654093A FR1654093A FR3051033B1 FR 3051033 B1 FR3051033 B1 FR 3051033B1 FR 1654093 A FR1654093 A FR 1654093A FR 1654093 A FR1654093 A FR 1654093A FR 3051033 B1 FR3051033 B1 FR 3051033B1
Authority
FR
France
Prior art keywords
conductive layer
electrically
thermally conductive
layer
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1654093A
Other languages
English (en)
Other versions
FR3051033A1 (fr
Inventor
Eric Eymard
Christophe Mathieu
Jerome Deschamps
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lumiliite SAS
Original Assignee
Linxens Holding SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Linxens Holding SAS filed Critical Linxens Holding SAS
Priority to FR1654093A priority Critical patent/FR3051033B1/fr
Priority to PCT/FR2017/051055 priority patent/WO2017191411A1/fr
Publication of FR3051033A1 publication Critical patent/FR3051033A1/fr
Application granted granted Critical
Publication of FR3051033B1 publication Critical patent/FR3051033B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

Dispositif émetteur de lumière comprenant : - une puce LED (1) à configuration « horizontale » ; - un support flexible portant cette puce LED (1) et formé d'au moins une couche support (20) électriquement isolante et une couche électriquement conductrice (210) ; - deux fils de connexion (41, 42) reliant électriquement chacune des deux électrodes (14, 15) à la couche électriquement conductrice (210) ; et - une couche thermiquement conductrice (211) en contact avec une première face de la couche support (20) et l'embase (10), le contact thermique entre la couche thermiquement conductrice (211) et ladite embase (10) étant réalisée via un corps d'attache (3) thermiquement conducteur disposé dans un évidement (200, 202, 203, 204) traversant toute l'épaisseur de la couche support, la couche thermiquement conductrice (211) étant électriquement et thermiquement isolée de la couche électriquement conductrice (210).
FR1654093A 2016-05-05 2016-05-05 Dispositif emetteur de lumiere Active FR3051033B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR1654093A FR3051033B1 (fr) 2016-05-05 2016-05-05 Dispositif emetteur de lumiere
PCT/FR2017/051055 WO2017191411A1 (fr) 2016-05-05 2017-05-03 Dispositif emetteur de lumiere

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1654093A FR3051033B1 (fr) 2016-05-05 2016-05-05 Dispositif emetteur de lumiere

Publications (2)

Publication Number Publication Date
FR3051033A1 FR3051033A1 (fr) 2017-11-10
FR3051033B1 true FR3051033B1 (fr) 2020-08-28

Family

ID=56404139

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1654093A Active FR3051033B1 (fr) 2016-05-05 2016-05-05 Dispositif emetteur de lumiere

Country Status (2)

Country Link
FR (1) FR3051033B1 (fr)
WO (1) WO2017191411A1 (fr)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6936855B1 (en) * 2002-01-16 2005-08-30 Shane Harrah Bendable high flux LED array
CN102376855B (zh) * 2010-08-09 2015-08-19 Lg伊诺特有限公司 发光器件和具有发光器件的照明***
KR20140019150A (ko) * 2012-08-06 2014-02-14 삼성디스플레이 주식회사 광원모듈 및 이를 포함하는 백라이트 어셈블리

Also Published As

Publication number Publication date
WO2017191411A1 (fr) 2017-11-09
FR3051033A1 (fr) 2017-11-10

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