FR3051033B1 - Dispositif emetteur de lumiere - Google Patents
Dispositif emetteur de lumiere Download PDFInfo
- Publication number
- FR3051033B1 FR3051033B1 FR1654093A FR1654093A FR3051033B1 FR 3051033 B1 FR3051033 B1 FR 3051033B1 FR 1654093 A FR1654093 A FR 1654093A FR 1654093 A FR1654093 A FR 1654093A FR 3051033 B1 FR3051033 B1 FR 3051033B1
- Authority
- FR
- France
- Prior art keywords
- conductive layer
- electrically
- thermally conductive
- layer
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Dispositif émetteur de lumière comprenant : - une puce LED (1) à configuration « horizontale » ; - un support flexible portant cette puce LED (1) et formé d'au moins une couche support (20) électriquement isolante et une couche électriquement conductrice (210) ; - deux fils de connexion (41, 42) reliant électriquement chacune des deux électrodes (14, 15) à la couche électriquement conductrice (210) ; et - une couche thermiquement conductrice (211) en contact avec une première face de la couche support (20) et l'embase (10), le contact thermique entre la couche thermiquement conductrice (211) et ladite embase (10) étant réalisée via un corps d'attache (3) thermiquement conducteur disposé dans un évidement (200, 202, 203, 204) traversant toute l'épaisseur de la couche support, la couche thermiquement conductrice (211) étant électriquement et thermiquement isolée de la couche électriquement conductrice (210).
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1654093A FR3051033B1 (fr) | 2016-05-05 | 2016-05-05 | Dispositif emetteur de lumiere |
PCT/FR2017/051055 WO2017191411A1 (fr) | 2016-05-05 | 2017-05-03 | Dispositif emetteur de lumiere |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1654093A FR3051033B1 (fr) | 2016-05-05 | 2016-05-05 | Dispositif emetteur de lumiere |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3051033A1 FR3051033A1 (fr) | 2017-11-10 |
FR3051033B1 true FR3051033B1 (fr) | 2020-08-28 |
Family
ID=56404139
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1654093A Active FR3051033B1 (fr) | 2016-05-05 | 2016-05-05 | Dispositif emetteur de lumiere |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR3051033B1 (fr) |
WO (1) | WO2017191411A1 (fr) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6936855B1 (en) * | 2002-01-16 | 2005-08-30 | Shane Harrah | Bendable high flux LED array |
CN102376855B (zh) * | 2010-08-09 | 2015-08-19 | Lg伊诺特有限公司 | 发光器件和具有发光器件的照明*** |
KR20140019150A (ko) * | 2012-08-06 | 2014-02-14 | 삼성디스플레이 주식회사 | 광원모듈 및 이를 포함하는 백라이트 어셈블리 |
-
2016
- 2016-05-05 FR FR1654093A patent/FR3051033B1/fr active Active
-
2017
- 2017-05-03 WO PCT/FR2017/051055 patent/WO2017191411A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2017191411A1 (fr) | 2017-11-09 |
FR3051033A1 (fr) | 2017-11-10 |
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Legal Events
Date | Code | Title | Description |
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PLFP | Fee payment |
Year of fee payment: 2 |
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PLSC | Publication of the preliminary search report |
Effective date: 20171110 |
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PLFP | Fee payment |
Year of fee payment: 3 |
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PLFP | Fee payment |
Year of fee payment: 4 |
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PLFP | Fee payment |
Year of fee payment: 5 |
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PLFP | Fee payment |
Year of fee payment: 6 |
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PLFP | Fee payment |
Year of fee payment: 7 |
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TP | Transmission of property |
Owner name: LUMILIITE, FR Effective date: 20220629 |
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PLFP | Fee payment |
Year of fee payment: 8 |
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PLFP | Fee payment |
Year of fee payment: 9 |