FR3050865B1 - Procede de realisation d'interconnexions conductrices sur un substrat et interconnexions ainsi obtenues - Google Patents
Procede de realisation d'interconnexions conductrices sur un substrat et interconnexions ainsi obtenues Download PDFInfo
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- FR3050865B1 FR3050865B1 FR1653947A FR1653947A FR3050865B1 FR 3050865 B1 FR3050865 B1 FR 3050865B1 FR 1653947 A FR1653947 A FR 1653947A FR 1653947 A FR1653947 A FR 1653947A FR 3050865 B1 FR3050865 B1 FR 3050865B1
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- interconnections
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- conductive interconnections
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- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/812—Applying energy for connecting
- H01L2224/81201—Compression bonding
- H01L2224/81203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Priority Applications (1)
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FR1653947A FR3050865B1 (fr) | 2016-05-02 | 2016-05-02 | Procede de realisation d'interconnexions conductrices sur un substrat et interconnexions ainsi obtenues |
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FR1653947A FR3050865B1 (fr) | 2016-05-02 | 2016-05-02 | Procede de realisation d'interconnexions conductrices sur un substrat et interconnexions ainsi obtenues |
FR1653947 | 2016-05-02 |
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FR3050865A1 FR3050865A1 (fr) | 2017-11-03 |
FR3050865B1 true FR3050865B1 (fr) | 2018-10-12 |
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FR1653947A Active FR3050865B1 (fr) | 2016-05-02 | 2016-05-02 | Procede de realisation d'interconnexions conductrices sur un substrat et interconnexions ainsi obtenues |
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Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5162257A (en) * | 1991-09-13 | 1992-11-10 | Mcnc | Solder bump fabrication method |
JP2985426B2 (ja) * | 1991-10-09 | 1999-11-29 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
KR100367702B1 (ko) * | 1995-03-20 | 2003-04-07 | 유나이티브 인터내셔널 리미티드 | 티타늄장벽층을포함하는솔더범프제조방법및구조 |
KR100319813B1 (ko) * | 2000-01-03 | 2002-01-09 | 윤종용 | 유비엠 언더컷을 개선한 솔더 범프의 형성 방법 |
KR20020060307A (ko) * | 2001-01-10 | 2002-07-18 | 윤종용 | 솔더 범프의 형성 방법 |
US8569897B2 (en) * | 2009-09-14 | 2013-10-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Protection layer for preventing UBM layer from chemical attack and oxidation |
KR101782503B1 (ko) * | 2011-05-18 | 2017-09-28 | 삼성전자 주식회사 | 솔더 범프 붕괴를 억제하는 반도체 소자의 범프 형성방법 |
FR2980952A1 (fr) * | 2011-10-03 | 2013-04-05 | St Microelectronics Grenoble 2 | Procede d'assemblage de deux dispositifs electroniques et structure comprenant ces dispositifs |
US9177928B1 (en) * | 2014-04-24 | 2015-11-03 | Globalfoundries | Contact and solder ball interconnect |
US9324669B2 (en) * | 2014-09-12 | 2016-04-26 | International Business Machines Corporation | Use of electrolytic plating to control solder wetting |
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2016
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