FR3038426B1 - Procede d'application d'une couche adhesive sur un substrat, et dispositif d'application correspondant - Google Patents
Procede d'application d'une couche adhesive sur un substrat, et dispositif d'application correspondant Download PDFInfo
- Publication number
- FR3038426B1 FR3038426B1 FR1556151A FR1556151A FR3038426B1 FR 3038426 B1 FR3038426 B1 FR 3038426B1 FR 1556151 A FR1556151 A FR 1556151A FR 1556151 A FR1556151 A FR 1556151A FR 3038426 B1 FR3038426 B1 FR 3038426B1
- Authority
- FR
- France
- Prior art keywords
- applying
- substrate
- adhesive layer
- application device
- corresponding application
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000012790 adhesive layer Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07701—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction
- G06K19/07703—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction the interface being visual
- G06K19/07707—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction the interface being visual the visual interface being a display, e.g. LCD or electronic ink
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
- G06K19/027—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being suitable for use as a textile, e.g. woven-based RFID-like labels designed for attachment to laundry items
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Textile Engineering (AREA)
- Credit Cards Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1556151A FR3038426B1 (fr) | 2015-06-30 | 2015-06-30 | Procede d'application d'une couche adhesive sur un substrat, et dispositif d'application correspondant |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1556151 | 2015-06-30 | ||
FR1556151A FR3038426B1 (fr) | 2015-06-30 | 2015-06-30 | Procede d'application d'une couche adhesive sur un substrat, et dispositif d'application correspondant |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3038426A1 FR3038426A1 (fr) | 2017-01-06 |
FR3038426B1 true FR3038426B1 (fr) | 2018-09-14 |
Family
ID=54186131
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1556151A Active FR3038426B1 (fr) | 2015-06-30 | 2015-06-30 | Procede d'application d'une couche adhesive sur un substrat, et dispositif d'application correspondant |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR3038426B1 (fr) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0696357B2 (ja) * | 1986-12-11 | 1994-11-30 | 三菱電機株式会社 | Icカードの製造方法 |
ATE170307T1 (de) * | 1994-05-27 | 1998-09-15 | Ake Gustafson | Verfahren zur herstellung eines elektronischen moduls und nach diesem verfahren hergestelltes modul |
EP2085914B1 (fr) * | 2006-11-07 | 2014-03-12 | Toppan Forms Co., Ltd. | Matériau de base de fenêtre, et carte à module incorporé et son procédé de fabrication |
US8322623B1 (en) * | 2010-07-26 | 2012-12-04 | Dynamics Inc. | Systems and methods for advanced card printing |
DE102011050794A1 (de) * | 2011-06-01 | 2012-12-06 | Bundesdruckerei Gmbh | Sicherheits- oder Wertdokument und Verfahren zu dessen Herstellung |
EP2854078A1 (fr) * | 2013-09-27 | 2015-04-01 | Gemalto SA | Carte à puce à afficheur et son procédé de fabrication |
-
2015
- 2015-06-30 FR FR1556151A patent/FR3038426B1/fr active Active
Also Published As
Publication number | Publication date |
---|---|
FR3038426A1 (fr) | 2017-01-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
PL3370973T3 (pl) | Sposób nanoszenia warstwy przenoszonej folii na podłoże | |
MA42528A (fr) | Procédé et dispositif d'application d'une isolation sur des édifices | |
FR3009833B1 (fr) | Procede d'obtention d'un substrat muni d'un revetement comprenant une couche mince metallique discontinue | |
KR102316761B9 (ko) | 기재의 선택된 구역들에 막을 코팅하기 위한 인쇄 방법 및 장치 | |
FI20135707A (fi) | Menetelmä ja laitteisto substraatin pinnan pinnoittamiseksi | |
FR3004364B1 (fr) | Dispositif et procede de depot d'un revetement microstructure sur un substrat a partir d'une bande de resine prepolymerisee | |
FR3007831B1 (fr) | Procede de mesure de l'epaisseur d'une couche d'un materiau, procede de galvanisation et dispositif de mesure associes | |
FR3021310B1 (fr) | Substrat muni d'un empilement a couche metallique partielle, vitrage et procede. | |
FR3020175B1 (fr) | Procede de transfert d'une couche utile | |
FR3014876B1 (fr) | Procede de realisation d'un film de copolymere a blocs sur un substrat | |
SG11201510022SA (en) | Apparatus and method for taping adhesive film on semiconductor substrate | |
DK3526042T3 (da) | Indretning til laminering af et substrat med et termoplastisk belægningsmateriale | |
DK3095890T3 (da) | Fremgangsmåde til påføring af tynde lag på substrater samt anordning til fremstilling heraf | |
GB2556205B (en) | Method for manufacturing thin film transistor array substrate | |
FR2988323B1 (fr) | Dispositif et procede de formation d'un revetement microstructure sur un substrat tel qu'un element d'aeronef | |
FI20146132A (fi) | Suutinpää, laitteisto ja menetelmä substraatin pinnan pinnoittamiseksi | |
FI20165543A (fi) | Menetelmä ja laitteisto substraatin pinnoittamiseksi | |
DK3313657T3 (da) | Belægningssystem til belægning af en overflade af et substrat | |
EP3385791A4 (fr) | Procédé de formation de motif, procédé de fabrication de dispositif électronique, film stratifié et composition de formation de film de couche supérieure | |
DK3237894T3 (da) | Fremgangsmåde til fremstilling af et optoelektronisk modul med en bærer, som omfatter et metalsubstrat, en dielektrisk belægning og et ledende lag | |
TWI799562B (zh) | 基板載置裝置及基板載置方法 | |
SG11201605819SA (en) | Adhesive composition and adhesive film having same, substrate provided with adhesive composition, and semiconductor device and method for manufacturing same | |
FR3038426B1 (fr) | Procede d'application d'une couche adhesive sur un substrat, et dispositif d'application correspondant | |
FR3007576B1 (fr) | Procede de transfert d'une couche de circuits. | |
EP3520649A4 (fr) | Dispositif de fixation de film mince et procédé de formation de film mince |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 2 |
|
PLSC | Publication of the preliminary search report |
Effective date: 20170106 |
|
PLFP | Fee payment |
Year of fee payment: 3 |
|
PLFP | Fee payment |
Year of fee payment: 4 |
|
CD | Change of name or company name |
Owner name: IDEMIA FRANCE, FR Effective date: 20180618 |
|
CJ | Change in legal form |
Effective date: 20180618 |
|
PLFP | Fee payment |
Year of fee payment: 6 |
|
PLFP | Fee payment |
Year of fee payment: 7 |
|
PLFP | Fee payment |
Year of fee payment: 8 |
|
PLFP | Fee payment |
Year of fee payment: 9 |
|
PLFP | Fee payment |
Year of fee payment: 10 |