FR3029700B1 - Module de borne - Google Patents

Module de borne Download PDF

Info

Publication number
FR3029700B1
FR3029700B1 FR1561813A FR1561813A FR3029700B1 FR 3029700 B1 FR3029700 B1 FR 3029700B1 FR 1561813 A FR1561813 A FR 1561813A FR 1561813 A FR1561813 A FR 1561813A FR 3029700 B1 FR3029700 B1 FR 3029700B1
Authority
FR
France
Prior art keywords
terminal module
module
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1561813A
Other languages
English (en)
Other versions
FR3029700A1 (fr
Inventor
Takayoshi Endo
Sakai Yagi
Katsunori Kakese
Takuya Takeda
Hiroyuki Kurita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
I Pex Inc
Original Assignee
Dai Ichi Seiko Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Ichi Seiko Co Ltd filed Critical Dai Ichi Seiko Co Ltd
Publication of FR3029700A1 publication Critical patent/FR3029700A1/fr
Application granted granted Critical
Publication of FR3029700B1 publication Critical patent/FR3029700B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7082—Coupling device supported only by cooperation with PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00—Coupling parts supported only by co-operation with counterpart
    • H01R31/02—Intermediate parts for distributing energy to two or more circuits in parallel, e.g. splitter
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
FR1561813A 2014-12-05 2015-12-03 Module de borne Expired - Fee Related FR3029700B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014247175A JP5871044B1 (ja) 2014-12-05 2014-12-05 端子モジュール
JP2014247175 2014-12-05

Publications (2)

Publication Number Publication Date
FR3029700A1 FR3029700A1 (fr) 2016-06-10
FR3029700B1 true FR3029700B1 (fr) 2018-10-12

Family

ID=55362118

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1561813A Expired - Fee Related FR3029700B1 (fr) 2014-12-05 2015-12-03 Module de borne

Country Status (6)

Country Link
US (1) US9634407B2 (fr)
JP (1) JP5871044B1 (fr)
KR (1) KR101764768B1 (fr)
CN (1) CN105680201B (fr)
DE (1) DE102015224249A1 (fr)
FR (1) FR3029700B1 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10455506B2 (en) * 2015-05-11 2019-10-22 Telefonaktiebolaget Lm Ericsson (Publ) Method and apparatus for discontinuous reception
JP6984127B2 (ja) * 2016-12-28 2021-12-17 富士電機株式会社 半導体装置および半導体装置の製造方法
CN110366876B (zh) * 2017-03-06 2023-05-05 三菱电机株式会社 具有压配结构的控制单元
US10505303B2 (en) * 2017-04-14 2019-12-10 Amphenol Corporation Float connector for interconnecting printed circuit boards
US11056807B2 (en) 2017-04-14 2021-07-06 Amphenol Corporation Float connector for interconnecting printed circuit boards
US10320124B1 (en) * 2018-05-02 2019-06-11 All Best Precision Technology Co., Ltd. Electrical connector with internal terminals having opposite sides located from connector internal sidewalls
US10971839B1 (en) * 2019-12-19 2021-04-06 Greenconn Corp. Floating connector
DE102020111526B3 (de) * 2020-04-28 2021-06-02 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Einpresskontaktelement
WO2021230615A1 (fr) * 2020-05-15 2021-11-18 주식회사 아모센스 Module d'alimentation et son procédé de fabrication
DE102020125574B3 (de) 2020-09-30 2021-11-25 Semikron Elektronik Gmbh & Co. Kg Einpresskontaktelement und Leistungshalbleitermodul hiermit
KR102651499B1 (ko) * 2021-08-20 2024-03-27 현대모비스 주식회사 양방향 시그널핀 모듈, 이를 포함한 파워 모듈 및 이의 제조 방법
WO2023244588A1 (fr) * 2022-06-16 2023-12-21 Interplex Industries, Inc. Connecteur à ajustement à force
CN117712730A (zh) * 2022-09-06 2024-03-15 泰科电子(上海)有限公司 电连接组件和电连接装置

Family Cites Families (23)

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Publication number Priority date Publication date Assignee Title
US3864000A (en) * 1973-06-07 1975-02-04 Amp Inc Mating contact connector housing assembly
US4446505A (en) * 1982-03-22 1984-05-01 Amp Incorporated Electrical connector for interconnecting printed circuit boards
US5106310A (en) * 1990-04-26 1992-04-21 Cray Research, Inc. Z-Axis pin connectors for stacked printed circuit board assemblies
JPH0645721A (ja) 1992-07-24 1994-02-18 Sanyo Electric Co Ltd 混成集積回路装置
EP0677897A3 (fr) * 1994-04-14 1996-09-11 Siemens Ag Arrangement de plaque à circuits pour connecteurs.
JP4295384B2 (ja) * 1999-03-08 2009-07-15 富士通コンポーネント株式会社 コネクタ
DE19934709C2 (de) 1999-07-23 2003-12-04 Tyco Electronics Logistics Ag Kontaktelement zum Einpressen in ein Loch einer Leiterplatte
JP4311859B2 (ja) * 2000-04-17 2009-08-12 富士通株式会社 バックボード
US6623280B2 (en) * 2001-11-13 2003-09-23 International Business Machines Corporation Dual compliant pin interconnect system
JP3958590B2 (ja) * 2002-01-23 2007-08-15 株式会社オートネットワーク技術研究所 電気接続箱用配電ユニット及び電気接続箱
US6997727B1 (en) * 2003-03-14 2006-02-14 Zierick Manufacturing Corp Compliant surface mount electrical contacts for circuit boards and method of making and using same
DE102005044867B4 (de) * 2005-09-20 2021-08-19 Vitesco Technologies GmbH Kombiniertes Befestigungs- und Kontaktierungssystem für elektrische Bauelemente auf übereinander angeordneten Leiterplatten
EP2111673B1 (fr) * 2007-02-02 2014-11-19 Delphi International Operations Luxembourg S.à r.l. Dispositif de connexion
JP5227645B2 (ja) * 2008-04-21 2013-07-03 矢崎総業株式会社 基板用コネクタ
CN101562288B (zh) * 2009-05-25 2011-09-28 番禺得意精密电子工业有限公司 一种电连接器及其制造方法
US8545237B2 (en) * 2010-06-30 2013-10-01 Deere & Company Connector for interconnecting conductors of circuit boards
JP5590409B2 (ja) * 2011-02-10 2014-09-17 株式会社オートネットワーク技術研究所 電気接続箱
JP5679333B2 (ja) * 2011-08-29 2015-03-04 住友電装株式会社 プリント基板積層体およびその製造方法
JP5445605B2 (ja) 2011-08-30 2014-03-19 第一精工株式会社 プレスフィット用コネクタ端子
EP3206261A1 (fr) * 2012-03-15 2017-08-16 Dai-Ichi Seiko Co., Ltd. Borne de connecteur de type à ajustement serré
JP5815454B2 (ja) * 2012-03-30 2015-11-17 新電元工業株式会社 パワーモジュール及びパワーモジュールの製造方法
CN203026667U (zh) * 2013-01-04 2013-06-26 深圳市晶福源电子技术有限公司 一种用于pcb板间的连接结构
CN104124553A (zh) * 2014-07-24 2014-10-29 珠海格力电器股份有限公司 插片及具有其的印制电路板

Also Published As

Publication number Publication date
CN105680201A (zh) 2016-06-15
US9634407B2 (en) 2017-04-25
JP5871044B1 (ja) 2016-03-01
US20160164202A1 (en) 2016-06-09
JP2016110837A (ja) 2016-06-20
KR20160068670A (ko) 2016-06-15
FR3029700A1 (fr) 2016-06-10
DE102015224249A1 (de) 2016-06-09
CN105680201B (zh) 2018-02-02
KR101764768B1 (ko) 2017-08-03

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