FR3026269B1 - Procede de realisation d'un radiateur a picots et dispositif associe a ce radiateur - Google Patents
Procede de realisation d'un radiateur a picots et dispositif associe a ce radiateurInfo
- Publication number
- FR3026269B1 FR3026269B1 FR1402110A FR1402110A FR3026269B1 FR 3026269 B1 FR3026269 B1 FR 3026269B1 FR 1402110 A FR1402110 A FR 1402110A FR 1402110 A FR1402110 A FR 1402110A FR 3026269 B1 FR3026269 B1 FR 3026269B1
- Authority
- FR
- France
- Prior art keywords
- radiator
- picot
- producing
- device associated
- picot radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Air-Conditioning For Vehicles (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1402110A FR3026269B1 (fr) | 2014-09-22 | 2014-09-22 | Procede de realisation d'un radiateur a picots et dispositif associe a ce radiateur |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1402110A FR3026269B1 (fr) | 2014-09-22 | 2014-09-22 | Procede de realisation d'un radiateur a picots et dispositif associe a ce radiateur |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3026269A1 FR3026269A1 (fr) | 2016-03-25 |
FR3026269B1 true FR3026269B1 (fr) | 2018-11-16 |
Family
ID=52423754
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1402110A Active FR3026269B1 (fr) | 2014-09-22 | 2014-09-22 | Procede de realisation d'un radiateur a picots et dispositif associe a ce radiateur |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR3026269B1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3091140B1 (fr) * | 2018-12-19 | 2020-12-11 | Safran Electronics & Defense | Boîtier comportant un dispositif de transfert de chaleur a base de picots metalliques inseres dans une paroi du boitier |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5239806A (en) * | 1990-11-02 | 1993-08-31 | Ak Technology, Inc. | Thermoplastic semiconductor package and method of producing it |
JP3236137B2 (ja) * | 1993-07-30 | 2001-12-10 | 富士通株式会社 | 半導体素子冷却装置 |
US5535515A (en) * | 1995-03-13 | 1996-07-16 | Jacoby; John | Method of manufacturing a stress-free heatsink assembly |
JP2000269561A (ja) * | 1999-03-19 | 2000-09-29 | Asahi Chem Ind Co Ltd | 複合構造体 |
-
2014
- 2014-09-22 FR FR1402110A patent/FR3026269B1/fr active Active
Also Published As
Publication number | Publication date |
---|---|
FR3026269A1 (fr) | 2016-03-25 |
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Legal Events
Date | Code | Title | Description |
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PLFP | Fee payment |
Year of fee payment: 2 |
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PLSC | Publication of the preliminary search report |
Effective date: 20160325 |
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Year of fee payment: 3 |
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Year of fee payment: 4 |
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Year of fee payment: 5 |
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Year of fee payment: 6 |
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PLFP | Fee payment |
Year of fee payment: 7 |
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PLFP | Fee payment |
Year of fee payment: 8 |
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PLFP | Fee payment |
Year of fee payment: 9 |
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PLFP | Fee payment |
Year of fee payment: 10 |