FR3022697B1 - Dispositif de connexion electrique a elements de connexion comportant des membranes deformables - Google Patents

Dispositif de connexion electrique a elements de connexion comportant des membranes deformables

Info

Publication number
FR3022697B1
FR3022697B1 FR1455855A FR1455855A FR3022697B1 FR 3022697 B1 FR3022697 B1 FR 3022697B1 FR 1455855 A FR1455855 A FR 1455855A FR 1455855 A FR1455855 A FR 1455855A FR 3022697 B1 FR3022697 B1 FR 3022697B1
Authority
FR
France
Prior art keywords
electrical connection
connection device
connecting elements
deformable membranes
deformable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1455855A
Other languages
English (en)
Other versions
FR3022697A1 (fr
Inventor
Jamaa Haykel Ben
Patrice Rey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA, Commissariat a lEnergie Atomique et aux Energies Alternatives CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR1455855A priority Critical patent/FR3022697B1/fr
Publication of FR3022697A1 publication Critical patent/FR3022697A1/fr
Application granted granted Critical
Publication of FR3022697B1 publication Critical patent/FR3022697B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
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    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
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    • G01R1/06733—Geometry aspects
    • G—PHYSICS
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    • H01L2224/141—Disposition
    • H01L2224/1418—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/14181—On opposite sides of the body
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    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81192—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81897—Mechanical interlocking, e.g. anchoring, hook and loop-type fastening or the like
    • H01L2224/81898—Press-fitting, i.e. pushing the parts together and fastening by friction, e.g. by compression of one part against the other
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/147—Semiconductor insulating substrates
    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/38—Effects and problems related to the device integration
    • H01L2924/381—Pitch distance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
FR1455855A 2014-06-24 2014-06-24 Dispositif de connexion electrique a elements de connexion comportant des membranes deformables Expired - Fee Related FR3022697B1 (fr)

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KR0154994B1 (ko) * 1993-11-22 1998-12-01 세끼자와 다다시 반도체장치 및 그 제조방법
JP3825290B2 (ja) * 1994-06-03 2006-09-27 株式会社ルネサステクノロジ 半導体素子の製造方法
US6893901B2 (en) * 2001-05-14 2005-05-17 Fairchild Semiconductor Corporation Carrier with metal bumps for semiconductor die packages
US7042080B2 (en) * 2003-07-14 2006-05-09 Micron Technology, Inc. Semiconductor interconnect having compliant conductive contacts
US7453139B2 (en) * 2005-12-27 2008-11-18 Tessera, Inc. Compliant terminal mountings with vented spaces and methods
US7629804B2 (en) * 2006-08-04 2009-12-08 Vertical Test Inc. Probe head assembly for use in testing multiple wafer die
JP2012021773A (ja) * 2008-11-12 2012-02-02 Alps Electric Co Ltd 球殻型接触子およびその製造方法
TWI484610B (zh) * 2012-07-09 2015-05-11 矽品精密工業股份有限公司 半導體結構之製法與導電凸塊

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