FR2996662B1 - Procede de fabrication d'une carte a puce sans contact avec logo transparent - Google Patents

Procede de fabrication d'une carte a puce sans contact avec logo transparent

Info

Publication number
FR2996662B1
FR2996662B1 FR1202671A FR1202671A FR2996662B1 FR 2996662 B1 FR2996662 B1 FR 2996662B1 FR 1202671 A FR1202671 A FR 1202671A FR 1202671 A FR1202671 A FR 1202671A FR 2996662 B1 FR2996662 B1 FR 2996662B1
Authority
FR
France
Prior art keywords
chip card
contactless chip
transparent logo
manufacturing contactless
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1202671A
Other languages
English (en)
Other versions
FR2996662A1 (fr
Inventor
Pierre Benato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASK SA
Original Assignee
ASK SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR1202671A priority Critical patent/FR2996662B1/fr
Application filed by ASK SA filed Critical ASK SA
Priority to EP13795542.3A priority patent/EP2904550A1/fr
Priority to AU2013326370A priority patent/AU2013326370B2/en
Priority to JP2015535081A priority patent/JP2016500864A/ja
Priority to CA2886837A priority patent/CA2886837C/fr
Priority to US14/047,170 priority patent/US8978986B2/en
Priority to KR1020157008682A priority patent/KR20150093651A/ko
Priority to SG11201504399PA priority patent/SG11201504399PA/en
Priority to MX2015004230A priority patent/MX2015004230A/es
Priority to PCT/FR2013/000262 priority patent/WO2014053717A1/fr
Priority to CN201380058189.3A priority patent/CN104769614B/zh
Priority to BR112015007320-4A priority patent/BR112015007320B1/pt
Publication of FR2996662A1 publication Critical patent/FR2996662A1/fr
Application granted granted Critical
Publication of FR2996662B1 publication Critical patent/FR2996662B1/fr
Priority to IL238081A priority patent/IL238081A0/en
Priority to ZA2015/02408A priority patent/ZA201502408B/en
Priority to IN3168DEN2015 priority patent/IN2015DN03168A/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
FR1202671A 2012-10-05 2012-10-05 Procede de fabrication d'une carte a puce sans contact avec logo transparent Active FR2996662B1 (fr)

Priority Applications (15)

Application Number Priority Date Filing Date Title
FR1202671A FR2996662B1 (fr) 2012-10-05 2012-10-05 Procede de fabrication d'une carte a puce sans contact avec logo transparent
CN201380058189.3A CN104769614B (zh) 2012-10-05 2013-10-07 带有透明标记的非接触式智能卡的制造方法
JP2015535081A JP2016500864A (ja) 2012-10-05 2013-10-07 透明なロゴを有する非接触型スマートカードの製造方法
CA2886837A CA2886837C (fr) 2012-10-05 2013-10-07 Procede de fabrication d'une carte a puce sans contact avec logo transparent
US14/047,170 US8978986B2 (en) 2012-10-05 2013-10-07 Process for manufacturing a contactless smartcard having a transparent logo
KR1020157008682A KR20150093651A (ko) 2012-10-05 2013-10-07 투명한 로고를 갖고 있는 비접촉 스마트카드를 제조하는 방법
SG11201504399PA SG11201504399PA (en) 2012-10-05 2013-10-07 Method for producing a contactless smart card with a transparent logo
MX2015004230A MX2015004230A (es) 2012-10-05 2013-10-07 Metodo para producir tarjeta inteligente sin contacto con logo transparente.
EP13795542.3A EP2904550A1 (fr) 2012-10-05 2013-10-07 Procédé de fabrication d'une carte à puce sans contact avec logo transparent
AU2013326370A AU2013326370B2 (en) 2012-10-05 2013-10-07 Method for producing a contactless smart card with a transparent logo
BR112015007320-4A BR112015007320B1 (pt) 2012-10-05 2013-10-07 Cartão inteligente sem contato em multicamadas, e, processo para a fabricação de um cartão inteligente sem contato
PCT/FR2013/000262 WO2014053717A1 (fr) 2012-10-05 2013-10-07 Procédé de fabrication d'une carte à puce sans contact avec logo transparent
IL238081A IL238081A0 (en) 2012-10-05 2015-04-01 A process for manufacturing a contactless smart card with a transparent logo
ZA2015/02408A ZA201502408B (en) 2012-10-05 2015-04-10 Method for producing a contactless smart card with a transparent logo
IN3168DEN2015 IN2015DN03168A (fr) 2012-10-05 2015-04-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1202671A FR2996662B1 (fr) 2012-10-05 2012-10-05 Procede de fabrication d'une carte a puce sans contact avec logo transparent

Publications (2)

Publication Number Publication Date
FR2996662A1 FR2996662A1 (fr) 2014-04-11
FR2996662B1 true FR2996662B1 (fr) 2014-10-17

Family

ID=47553138

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1202671A Active FR2996662B1 (fr) 2012-10-05 2012-10-05 Procede de fabrication d'une carte a puce sans contact avec logo transparent

Country Status (15)

Country Link
US (1) US8978986B2 (fr)
EP (1) EP2904550A1 (fr)
JP (1) JP2016500864A (fr)
KR (1) KR20150093651A (fr)
CN (1) CN104769614B (fr)
AU (1) AU2013326370B2 (fr)
BR (1) BR112015007320B1 (fr)
CA (1) CA2886837C (fr)
FR (1) FR2996662B1 (fr)
IL (1) IL238081A0 (fr)
IN (1) IN2015DN03168A (fr)
MX (1) MX2015004230A (fr)
SG (1) SG11201504399PA (fr)
WO (1) WO2014053717A1 (fr)
ZA (1) ZA201502408B (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2015240515B2 (en) * 2014-04-04 2019-08-15 Visa International Service Association Payment device with holographic security element
CN105279648A (zh) * 2014-07-04 2016-01-27 Ub特伦株式会社 利用密钥安全卡的网上银行登录***及其网上银行登录方法
DE102015005082A1 (de) 2015-04-21 2016-10-27 Giesecke & Devrient Gmbh Mehrschichtiges Sicherheitselement
WO2017006191A1 (fr) * 2015-07-09 2017-01-12 Assa Abloy Ab Document de sécurité doté d'une fenêtre transparente
FR3045890B1 (fr) * 2015-12-21 2018-08-31 Smart Packaging Solutions Document pourvu d'un motif de securite marque par une image fantome
KR101799438B1 (ko) * 2016-05-02 2017-11-20 브릴리언츠주식회사 스마트멀티카드 및 스마트멀티카드 제조방법
GB201608070D0 (en) * 2016-05-09 2016-06-22 Polar Oled Ltd Substrate with OLED display
US10984304B2 (en) 2017-02-02 2021-04-20 Jonny B. Vu Methods for placing an EMV chip onto a metal card
EP3421235B1 (fr) * 2017-06-28 2024-03-20 HID Global CID SAS Procédé de fabrication de cartes avec une fenêtre transparente
FR3069082B1 (fr) * 2017-07-17 2019-08-16 Idemia Identity And Security Carte electronique comprenant un capteur d'empreinte et une marque tactile
USD877739S1 (en) * 2017-09-15 2020-03-10 uQontrol, Inc. Smartcard with Q-shaped contact pad
CN108446755A (zh) * 2018-04-25 2018-08-24 捷德（中国）信息科技有限公司 一种识别卡
USD956760S1 (en) * 2018-07-30 2022-07-05 Lion Credit Card Inc. Multi EMV chip card
WO2021022126A1 (fr) * 2019-07-31 2021-02-04 Avery Dennison Retail Information Services, Llc Dispositifs rfid à propriétés optiques contrôlées
JPWO2021044748A1 (fr) * 2019-09-05 2021-03-11
DE102021114246A1 (de) * 2021-06-01 2022-12-01 Bundesdruckerei Gmbh Karte und Verfahren zur Herstellung einer Karte
CN115456130A (zh) * 2022-09-02 2022-12-09 东信和平科技股份有限公司 一种双界面芯片卡制作工艺

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4328469A1 (de) * 1993-08-24 1995-03-02 Giesecke & Devrient Gmbh IC-Karte mit integriertem Baustein
DE4446369A1 (de) * 1994-12-23 1996-06-27 Giesecke & Devrient Gmbh Datenträger mit einem elektronischen Modul
DE29804833U1 (de) * 1998-03-18 1998-07-23 Eue, Wolfgang, Dipl.-Ing., 38162 Cremlingen Chip-Karte mit Loch
US7306158B2 (en) * 2001-07-10 2007-12-11 American Express Travel Related Services Company, Inc. Clear contactless card
US6832730B2 (en) * 2001-07-27 2004-12-21 Storcard, Inc. Smart card with rotating storage
US8061618B2 (en) * 2004-08-09 2011-11-22 Oberthur Card Systems Sa Multi-layer cards with aesthetic features and related methods of manufacturing
CN100535447C (zh) * 2007-04-11 2009-09-02 浙江盾安人工环境设备股份有限公司 新型电磁三通阀

Also Published As

Publication number Publication date
KR20150093651A (ko) 2015-08-18
EP2904550A1 (fr) 2015-08-12
WO2014053717A1 (fr) 2014-04-10
IN2015DN03168A (fr) 2015-10-02
CN104769614B (zh) 2019-08-23
AU2013326370B2 (en) 2019-08-22
US8978986B2 (en) 2015-03-17
FR2996662A1 (fr) 2014-04-11
CA2886837A1 (fr) 2014-04-10
CA2886837C (fr) 2021-02-16
MX2015004230A (es) 2015-06-10
SG11201504399PA (en) 2015-07-30
AU2013326370A1 (en) 2015-05-21
BR112015007320A2 (pt) 2017-07-04
CN104769614A (zh) 2015-07-08
US20140097253A1 (en) 2014-04-10
JP2016500864A (ja) 2016-01-14
BR112015007320B1 (pt) 2022-02-15
ZA201502408B (en) 2016-01-27
IL238081A0 (en) 2015-05-31

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