FR2986170B1 - Procede et dispositif de soudage, notamment par laser, de fils sur un substrat - Google Patents

Procede et dispositif de soudage, notamment par laser, de fils sur un substrat

Info

Publication number
FR2986170B1
FR2986170B1 FR1200230A FR1200230A FR2986170B1 FR 2986170 B1 FR2986170 B1 FR 2986170B1 FR 1200230 A FR1200230 A FR 1200230A FR 1200230 A FR1200230 A FR 1200230A FR 2986170 B1 FR2986170 B1 FR 2986170B1
Authority
FR
France
Prior art keywords
wires
welding
laser
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1200230A
Other languages
English (en)
Other versions
FR2986170A1 (fr
Inventor
Jean Baptiste Palomares
Francois Palomares
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JFP MICROTECHNIC
Original Assignee
JFP MICROTECHNIC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JFP MICROTECHNIC filed Critical JFP MICROTECHNIC
Priority to FR1200230A priority Critical patent/FR2986170B1/fr
Priority to US13/744,748 priority patent/US20130192062A1/en
Publication of FR2986170A1 publication Critical patent/FR2986170A1/fr
Application granted granted Critical
Publication of FR2986170B1 publication Critical patent/FR2986170B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/22—Spot welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/035—Aligning the laser beam
    • B23K26/037—Aligning the laser beam by pressing on the workpiece, e.g. pressing roller foot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Media Introduction/Drainage Providing Device (AREA)
FR1200230A 2012-01-26 2012-01-26 Procede et dispositif de soudage, notamment par laser, de fils sur un substrat Expired - Fee Related FR2986170B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR1200230A FR2986170B1 (fr) 2012-01-26 2012-01-26 Procede et dispositif de soudage, notamment par laser, de fils sur un substrat
US13/744,748 US20130192062A1 (en) 2012-01-26 2013-01-18 Method and a device for bonding wires to a substrate, in particular by laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1200230A FR2986170B1 (fr) 2012-01-26 2012-01-26 Procede et dispositif de soudage, notamment par laser, de fils sur un substrat

Publications (2)

Publication Number Publication Date
FR2986170A1 FR2986170A1 (fr) 2013-08-02
FR2986170B1 true FR2986170B1 (fr) 2014-03-07

Family

ID=45815801

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1200230A Expired - Fee Related FR2986170B1 (fr) 2012-01-26 2012-01-26 Procede et dispositif de soudage, notamment par laser, de fils sur un substrat

Country Status (2)

Country Link
US (1) US20130192062A1 (fr)
FR (1) FR2986170B1 (fr)

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3444347A (en) * 1966-01-10 1969-05-13 Unitek Corp Method for solder reflow connection of insulated conductors
US3689983A (en) * 1970-05-11 1972-09-12 Gen Motors Corp Method of bonding
US3646307A (en) * 1970-09-24 1972-02-29 Ibm Wiring apparatus
JPS63115671A (ja) * 1986-10-31 1988-05-20 Nippei Toyama Corp 被覆電線の半田付け方法
JPS63194954A (ja) * 1987-02-10 1988-08-12 Yasuki Seimitsu:Kk ワイドツトプリンタヘツド
US4925085A (en) * 1989-05-25 1990-05-15 Motorola Inc. Bonding means and method
US5674420A (en) * 1995-06-12 1997-10-07 Worthington Industries Incorporated Clamping device for welding machine
GB2328636A (en) * 1997-08-29 1999-03-03 Rye Machinery Ltd A support for a laser tool
US6501043B1 (en) * 1999-10-22 2002-12-31 Medtronic, Inc. Apparatus and method for laser welding of ribbons
FR2805186B1 (fr) * 2000-02-21 2002-06-21 Vai Clecim Machine a rabouter des bandes metalliques et son procede de mise en oeuvre
JP3394750B2 (ja) * 2000-10-02 2003-04-07 ファナック株式会社 ワーク押し付け装置
DE10103084B4 (de) * 2001-01-24 2006-08-03 Infineon Technologies Ag Halbleitermodul und Verfahren zu seiner Herstellung
TWI229397B (en) * 2002-10-16 2005-03-11 Esec Trading Sa Method for determining optimum bond parameters when bonding with a wire bonder
FR2869558B1 (fr) * 2004-04-29 2006-09-01 Vai Clecim Soc Par Actions Sim Procede de reglage de l'epaisseur du cordon de soudure de deux toles metalliques
CA2533998A1 (fr) * 2005-01-27 2006-07-27 Inspeck Inc. Appareil et methode permettant de produire un objet 3d personnalise
US7872208B2 (en) * 2005-03-31 2011-01-18 Medtronic, Inc. Laser bonding tool with improved bonding accuracy
DE102006014068A1 (de) * 2006-03-27 2007-10-04 Precitec Kg Vorrichtung und Verfahren zum Spannen von Blechbauteilen
US7597235B2 (en) * 2007-11-15 2009-10-06 Infineon Technologies Ag Apparatus and method for producing a bonding connection
DE102009053261A1 (de) * 2009-11-11 2011-05-12 Jenoptik Automatisierungstechnik Gmbh Vorrichtung zum Punktschweißen mit Laserstrahl

Also Published As

Publication number Publication date
US20130192062A1 (en) 2013-08-01
FR2986170A1 (fr) 2013-08-02

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Year of fee payment: 5

ST Notification of lapse

Effective date: 20170929