FR2977121B1 - Systeme de gestion thermique a materiau a volume variable - Google Patents
Systeme de gestion thermique a materiau a volume variableInfo
- Publication number
- FR2977121B1 FR2977121B1 FR1155511A FR1155511A FR2977121B1 FR 2977121 B1 FR2977121 B1 FR 2977121B1 FR 1155511 A FR1155511 A FR 1155511A FR 1155511 A FR1155511 A FR 1155511A FR 2977121 B1 FR2977121 B1 FR 2977121B1
- Authority
- FR
- France
- Prior art keywords
- management system
- thermal management
- variable volume
- volume material
- variable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/01—Control of temperature without auxiliary power
- G05D23/02—Control of temperature without auxiliary power with sensing element expanding and contracting in response to changes of temperature
- G05D23/028—Control of temperature without auxiliary power with sensing element expanding and contracting in response to changes of temperature with fusing sensing element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
- H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F2013/005—Thermal joints
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F2013/005—Thermal joints
- F28F2013/008—Variable conductance materials; Thermal switches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1155511A FR2977121B1 (fr) | 2011-06-22 | 2011-06-22 | Systeme de gestion thermique a materiau a volume variable |
EP12728606.0A EP2724108A2 (fr) | 2011-06-22 | 2012-06-21 | Systeme de gestion thermique a materiau a volume variable |
US14/128,266 US20140158334A1 (en) | 2011-06-22 | 2012-06-21 | Thermal management system with variable-volume material |
PCT/EP2012/062001 WO2012175627A2 (fr) | 2011-06-22 | 2012-06-21 | Systeme de gestion thermique a materiau a volume variable |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1155511A FR2977121B1 (fr) | 2011-06-22 | 2011-06-22 | Systeme de gestion thermique a materiau a volume variable |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2977121A1 FR2977121A1 (fr) | 2012-12-28 |
FR2977121B1 true FR2977121B1 (fr) | 2014-04-25 |
Family
ID=46321044
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1155511A Active FR2977121B1 (fr) | 2011-06-22 | 2011-06-22 | Systeme de gestion thermique a materiau a volume variable |
Country Status (4)
Country | Link |
---|---|
US (1) | US20140158334A1 (fr) |
EP (1) | EP2724108A2 (fr) |
FR (1) | FR2977121B1 (fr) |
WO (1) | WO2012175627A2 (fr) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2934709B1 (fr) * | 2008-08-01 | 2010-09-10 | Commissariat Energie Atomique | Structure d'echange thermique et dispositif de refroidissement comportant une telle structure. |
FR2961956B1 (fr) | 2010-06-23 | 2012-08-17 | Commissariat Energie Atomique | Thermogenerateur a materiaux a changement de phase |
FR2985249B1 (fr) | 2012-01-02 | 2014-03-07 | Commissariat Energie Atomique | Procede de transfert d'objets sur un substrat a l'aide d'un film compact de particules |
FR2986722B1 (fr) | 2012-02-10 | 2014-03-28 | Commissariat Energie Atomique | Procede de transfert d'objets sur un substrat a l'aide d'un film compact de particules, avec une etape de realisation de connecteurs sur les objets |
FR2986721B1 (fr) | 2012-02-10 | 2014-06-27 | Commissariat Energie Atomique | Procede de depot d'un film de particules sur un substrat via un convoyeur liquide, comprenant une etape de structuration du film sur le substrat |
FR2986720B1 (fr) | 2012-02-10 | 2014-03-28 | Commissariat Energie Atomique | Procede de depot de particules sur un substrat, comprenant une etape de structuration d'un film de particules sur un convoyeur liquide |
FR2986908B1 (fr) | 2012-02-14 | 2014-03-28 | Commissariat Energie Atomique | Dispositif de recuperation et de conversion d'energie thermique en energie electrique |
FR2995228B1 (fr) | 2012-09-10 | 2014-09-05 | Commissariat Energie Atomique | Procede de formation d'un film de particules sur liquide porteur, avec deplacement d'une rampe inclinee de compression des particules |
FR3005432B1 (fr) | 2013-05-13 | 2015-06-05 | Commissariat Energie Atomique | Procede de depot d'un film compact de particules sur la surface interieure d'une piece presentant un creux delimite par cette surface interieure |
FR3006111B1 (fr) | 2013-05-24 | 2016-11-25 | Commissariat Energie Atomique | Dispositif de conversion d'energie thermique en energie electrique a molecules thermo-sensibles |
FR3008691B1 (fr) | 2013-07-22 | 2016-12-23 | Commissariat Energie Atomique | Dispositif comportant un canal fluidique muni d'au moins un systeme micro ou nanoelectronique et procede de realisation d'un tel dispositif |
FR3008690B1 (fr) | 2013-07-22 | 2016-12-23 | Commissariat Energie Atomique | Dispositif comportant un canal fluidique muni d'au moins un systeme micro ou nanoelectronique et procede de realisation d'un tel dispositif |
FR3011752B1 (fr) | 2013-10-11 | 2015-12-25 | Commissariat Energie Atomique | Installation et procede a rendement ameliore de formation d'un film compact de particules a la surface d'un liquide porteur |
JP6392015B2 (ja) * | 2014-07-18 | 2018-09-19 | 株式会社東芝 | 電子機器 |
FR3026287B1 (fr) | 2014-09-30 | 2017-02-24 | Seb Sa | Poignee amovible comprenant un generateur thermoelectrique |
FR3026288B1 (fr) * | 2014-09-30 | 2017-02-24 | Seb Sa | Poignee comprenant un generateur thermoelectrique |
FR3027449B1 (fr) | 2014-10-21 | 2017-10-20 | Commissariat Energie Atomique | Procede ameliore de realisation d'interconnexions pour circuit integre 3d |
US10386127B2 (en) | 2015-09-09 | 2019-08-20 | General Electric Company | Thermal management system |
US10209009B2 (en) | 2016-06-21 | 2019-02-19 | General Electric Company | Heat exchanger including passageways |
JP6662239B2 (ja) * | 2016-08-08 | 2020-03-11 | 株式会社デンソー | 熱スイッチ装置 |
FR3059152B1 (fr) * | 2016-11-21 | 2019-01-25 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif de transfert thermique, de connexion electrique et dispositif electronique |
KR20180088193A (ko) * | 2017-01-26 | 2018-08-03 | 삼성전자주식회사 | 적응적 열 저항 및 열 용량을 사용하는 열 관리 장치 및 방법 |
CN107168415B (zh) * | 2017-06-01 | 2020-03-31 | 西南电子技术研究所(中国电子科技集团公司第十研究所) | 快响应相变温控装置 |
US10375855B2 (en) * | 2017-11-08 | 2019-08-06 | Honeywell International Inc. | Systems and methods for zero power automatic thermal regulation |
JP7133020B2 (ja) * | 2017-12-29 | 2022-09-07 | エアバス ディフェンス アンド スペース,エス.エー. | 高コンダクタンス熱リンク |
US10292307B1 (en) * | 2018-01-04 | 2019-05-14 | Juniper Networks, Inc. | Thermal heatsink |
CN108777927B (zh) * | 2018-06-26 | 2019-11-26 | 联想(北京)有限公司 | 一种散热装置、方法及电子设备 |
CN109060495B (zh) * | 2018-09-11 | 2024-03-15 | 四川省机械研究设计院(集团)有限公司 | 可调节热阻的装置 |
CN114342031B (zh) * | 2019-07-15 | 2022-11-22 | 具特拉有限公司 | 热敏开关 |
DE102019123908A1 (de) * | 2019-09-05 | 2021-03-11 | Karl Storz Se & Co. Kg | Vorrichtung zur Wärmeableitung und Verwendung einer solchen Vorrichtung |
DE102019216924A1 (de) * | 2019-11-04 | 2021-05-06 | Robert Bosch Gmbh | Laseremitteranordnung sowie LiDAR-System |
US11260953B2 (en) | 2019-11-15 | 2022-03-01 | General Electric Company | System and method for cooling a leading edge of a high speed vehicle |
US11352120B2 (en) | 2019-11-15 | 2022-06-07 | General Electric Company | System and method for cooling a leading edge of a high speed vehicle |
US11260976B2 (en) | 2019-11-15 | 2022-03-01 | General Electric Company | System for reducing thermal stresses in a leading edge of a high speed vehicle |
US11267551B2 (en) | 2019-11-15 | 2022-03-08 | General Electric Company | System and method for cooling a leading edge of a high speed vehicle |
US11427330B2 (en) | 2019-11-15 | 2022-08-30 | General Electric Company | System and method for cooling a leading edge of a high speed vehicle |
US10866036B1 (en) | 2020-05-18 | 2020-12-15 | Envertic Thermal Systems, Llc | Thermal switch |
US11745847B2 (en) | 2020-12-08 | 2023-09-05 | General Electric Company | System and method for cooling a leading edge of a high speed vehicle |
US11407488B2 (en) | 2020-12-14 | 2022-08-09 | General Electric Company | System and method for cooling a leading edge of a high speed vehicle |
US11577817B2 (en) | 2021-02-11 | 2023-02-14 | General Electric Company | System and method for cooling a leading edge of a high speed vehicle |
CN113097599B (zh) * | 2021-04-07 | 2022-07-01 | 华北电力大学 | 基于过冷相变材料被动式电池热调节器、方法和管理*** |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3225820A (en) * | 1962-11-01 | 1965-12-28 | Gen Precision Inc | Device for controlling temperature by heat conduction |
US3302703A (en) * | 1964-07-03 | 1967-02-07 | Trw Inc | Thermal valve |
US3763454A (en) * | 1972-02-22 | 1973-10-02 | Tektronix Inc | Thermal switch |
US3957107A (en) * | 1975-02-27 | 1976-05-18 | The United States Of America As Represented By The Secretary Of The Air Force | Thermal switch |
DE2724309C3 (de) * | 1977-05-28 | 1980-02-21 | Dornier System Gmbh, 7990 Friedrichshafen | Regelbares Wärmerohr |
US4384610A (en) * | 1981-10-19 | 1983-05-24 | Mcdonnell Douglas Corporation | Simple thermal joint |
US4858678A (en) * | 1988-06-02 | 1989-08-22 | The Boeing Company | Variable heat conductance heat exchanger |
US5466605A (en) * | 1993-03-15 | 1995-11-14 | Arizona Board Of Regents | Method for detection of chemical components |
US5379601A (en) * | 1993-09-15 | 1995-01-10 | International Business Machines Corporation | Temperature actuated switch for cryo-coolers |
DE4402918C2 (de) * | 1994-02-01 | 1998-03-12 | Export Contor Ausenhandelsgese | Kühlkörper mit Flüssigkeitsfüllung |
US6317321B1 (en) * | 1994-11-04 | 2001-11-13 | Compaq Computer Corporation | Lap-top enclosure having surface coated with heat-absorbing phase-change material |
AU2002335883A1 (en) * | 2002-02-06 | 2003-09-02 | Parker Hannifin Corporation | Thermal management materials having a phase change dispersion |
US6946190B2 (en) * | 2002-02-06 | 2005-09-20 | Parker-Hannifin Corporation | Thermal management materials |
EP1568054A2 (fr) * | 2002-11-18 | 2005-08-31 | Washington State University | Thermocontact, procedes d'utilisation et procedes de realisation |
US7034375B2 (en) * | 2003-02-21 | 2006-04-25 | Honeywell International Inc. | Micro electromechanical systems thermal switch |
EP1460740B1 (fr) * | 2003-03-20 | 2006-06-07 | Agilent Technologies, Inc. - a Delaware corporation - | Module optoélectronique et commutateur de transfert thermique associé |
WO2005052179A2 (fr) * | 2003-08-13 | 2005-06-09 | The Johns Hopkins University | Procede de fabrication de reseaux de nanotubes de carbone et interfaces thermiques utilisant ces reseaux |
EP1697972A2 (fr) * | 2003-11-18 | 2006-09-06 | Washington State University Research Foundation | Micro-transducteur et commutateur thermique associe |
US7205653B2 (en) * | 2004-08-17 | 2007-04-17 | Delphi Technologies, Inc. | Fluid cooled encapsulated microelectronic package |
US20060141308A1 (en) * | 2004-12-23 | 2006-06-29 | Becerra Juan J | Apparatus and method for variable conductance temperature control |
DK1979939T3 (da) * | 2006-01-18 | 2013-04-29 | Aaac Microtec Ab | Miniaturiseret termisk, elektrisk omskifter med høj ledningsevne |
US20070205473A1 (en) * | 2006-03-03 | 2007-09-06 | Honeywell International Inc. | Passive analog thermal isolation structure |
FR2899374B1 (fr) * | 2006-03-30 | 2008-05-30 | Air Liquide | Interrupteur thermique |
FR2904103B1 (fr) * | 2006-07-18 | 2015-05-15 | Airbus France | Dispositif a ecoulement de chaleur |
FR2904102B1 (fr) * | 2006-07-18 | 2015-03-27 | Airbus France | Dispositif a ecoulement de chaleur |
KR100780838B1 (ko) * | 2006-08-16 | 2007-11-30 | 광주과학기술원 | 열 스위치 |
US8443874B2 (en) * | 2007-03-30 | 2013-05-21 | Nec Corporation | Heat dissipating structure and portable phone |
US7497123B1 (en) * | 2007-12-18 | 2009-03-03 | Rosemount Inc. | Direct mount for pressure transmitter with thermal management |
US20090277608A1 (en) * | 2008-05-07 | 2009-11-12 | Kamins Theodore I | Thermal Control Via Adjustable Thermal Links |
US20090321044A1 (en) * | 2008-06-30 | 2009-12-31 | Alcatel-Lucent Technologies Inc. | Active heat sink designs |
US7772042B2 (en) * | 2008-09-24 | 2010-08-10 | Eastman Kodak Company | Solvent softening to allow die placement |
US8143991B2 (en) * | 2009-06-30 | 2012-03-27 | Chin-Chi Yang | Current and temperature overloading protection device |
EP2505913B1 (fr) * | 2011-03-30 | 2016-03-23 | Nxp B.V. | Dispositif de gestion thermique active et procédé de gestion thermique |
US9349558B2 (en) * | 2011-12-06 | 2016-05-24 | Palo Alto Research Center Incorporated | Mechanically acuated heat switch |
FR2984008B1 (fr) * | 2011-12-13 | 2014-01-10 | Commissariat Energie Atomique | Dispositif electronique |
FR2999336A1 (fr) * | 2012-12-07 | 2014-06-13 | Commissariat Energie Atomique | Composant electronique comportant un materiau absorbeur de chaleur et procede de fabrication de ce composant electronique |
-
2011
- 2011-06-22 FR FR1155511A patent/FR2977121B1/fr active Active
-
2012
- 2012-06-21 US US14/128,266 patent/US20140158334A1/en not_active Abandoned
- 2012-06-21 EP EP12728606.0A patent/EP2724108A2/fr not_active Withdrawn
- 2012-06-21 WO PCT/EP2012/062001 patent/WO2012175627A2/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
EP2724108A2 (fr) | 2014-04-30 |
FR2977121A1 (fr) | 2012-12-28 |
US20140158334A1 (en) | 2014-06-12 |
WO2012175627A3 (fr) | 2013-02-21 |
WO2012175627A2 (fr) | 2012-12-27 |
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Legal Events
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PLFP | Fee payment |
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