FR2972199B1 - Dispositif de production de nanoparticules a haut rendement, utilisation du dispositif de production dans un dispositif de depot et procede de depot de nanoparticules - Google Patents
Dispositif de production de nanoparticules a haut rendement, utilisation du dispositif de production dans un dispositif de depot et procede de depot de nanoparticulesInfo
- Publication number
- FR2972199B1 FR2972199B1 FR1100614A FR1100614A FR2972199B1 FR 2972199 B1 FR2972199 B1 FR 2972199B1 FR 1100614 A FR1100614 A FR 1100614A FR 1100614 A FR1100614 A FR 1100614A FR 2972199 B1 FR2972199 B1 FR 2972199B1
- Authority
- FR
- France
- Prior art keywords
- deposition
- nanoparticles
- high yield
- producing high
- production
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/228—Gas flow assisted PVD deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3452—Magnet distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3458—Electromagnets in particular for cathodic sputtering apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3461—Means for shaping the magnetic field, e.g. magnetic shunts
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Nanotechnology (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1100614A FR2972199B1 (fr) | 2011-03-01 | 2011-03-01 | Dispositif de production de nanoparticules a haut rendement, utilisation du dispositif de production dans un dispositif de depot et procede de depot de nanoparticules |
PCT/FR2012/000069 WO2012117171A1 (fr) | 2011-03-01 | 2012-02-27 | Dispositif de production de nanoparticules à haut rendement, utilisation dudit dispositif et procede de depot de nanoparticules |
EP12710765.4A EP2681758A1 (fr) | 2011-03-01 | 2012-02-27 | Dispositif de production de nanoparticules à haut rendement, utilisation dudit dispositif et procede de depot de nanoparticules |
US14/002,588 US20140001031A1 (en) | 2011-03-01 | 2012-02-27 | Device for producing nanoparticles at high efficiency, use of said device and method of depositing nanoparticles |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1100614A FR2972199B1 (fr) | 2011-03-01 | 2011-03-01 | Dispositif de production de nanoparticules a haut rendement, utilisation du dispositif de production dans un dispositif de depot et procede de depot de nanoparticules |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2972199A1 FR2972199A1 (fr) | 2012-09-07 |
FR2972199B1 true FR2972199B1 (fr) | 2015-04-24 |
Family
ID=45888426
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1100614A Expired - Fee Related FR2972199B1 (fr) | 2011-03-01 | 2011-03-01 | Dispositif de production de nanoparticules a haut rendement, utilisation du dispositif de production dans un dispositif de depot et procede de depot de nanoparticules |
Country Status (4)
Country | Link |
---|---|
US (1) | US20140001031A1 (fr) |
EP (1) | EP2681758A1 (fr) |
FR (1) | FR2972199B1 (fr) |
WO (1) | WO2012117171A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103205723A (zh) * | 2013-04-03 | 2013-07-17 | 同济大学 | 一种纳米超细粉的制备装置和方法 |
CN109506805B (zh) * | 2018-12-17 | 2019-09-27 | 华中科技大学 | 一种基于磁纳米粒子的双差分温度测量方法 |
US11740173B2 (en) * | 2020-05-29 | 2023-08-29 | University Of New York | Systems and methods for detecting particles |
DE102020119279A1 (de) | 2020-07-22 | 2022-01-27 | Leibniz-Institut für Oberflächenmodifizierung e.V. | Verfahren und Vorrichtung zur Nanopartikelsynthese |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6013069A (ja) * | 1983-07-01 | 1985-01-23 | Sanyo Electric Co Ltd | 薄膜形成方法 |
JPS62167877A (ja) * | 1986-01-20 | 1987-07-24 | Fujitsu Ltd | プラズマ移動式マグネトロン型スパツタ装置 |
JPH0765168B2 (ja) * | 1987-10-14 | 1995-07-12 | 日電アネルバ株式会社 | 平板マグネトロンスパッタ装置 |
EP0724652B1 (fr) * | 1993-10-22 | 2003-10-01 | Manley, Kelly | Procede et appareil de pulverisation de materiaux cibles magnetiques |
US5736019A (en) * | 1996-03-07 | 1998-04-07 | Bernick; Mark A. | Sputtering cathode |
GB2340845B (en) * | 1998-08-19 | 2001-01-31 | Kobe Steel Ltd | Magnetron sputtering apparatus |
US20070209927A1 (en) * | 2004-07-09 | 2007-09-13 | Masayuki Kamei | Magnetron Sputtering Device In which Two Modes Of Magnetic Flux Distribution (Balanced Mode/Unbalanced Mode) Can Be Switched From One To The Other And Vice Versa, A Film Formation Method For Forming A Film From An Inorganic Film Formation Material Using The Device, And A Dual Mode Magnetron Sputtering Device And Film Formation Method For Forming A Film From An Inorganic Film Formation Material At A Low Temperature Using The Device |
DE102006058078A1 (de) * | 2006-12-07 | 2008-06-19 | Systec System- Und Anlagentechnik Gmbh & Co. Kg | Vakuumbeschichtungsanlage zur homogenen PVD-Beschichtung |
WO2010120792A1 (fr) * | 2009-04-17 | 2010-10-21 | The Regents Of The University Of California | Procédé et appareil pour dépôt à vitesse très élevée |
EP2530182B1 (fr) * | 2010-01-26 | 2015-03-25 | Canon Anelva Corporation | Procédé ainsi que dispositif de formation de film, et dispositif de commande dudit dispositif de formation de film |
-
2011
- 2011-03-01 FR FR1100614A patent/FR2972199B1/fr not_active Expired - Fee Related
-
2012
- 2012-02-27 US US14/002,588 patent/US20140001031A1/en not_active Abandoned
- 2012-02-27 EP EP12710765.4A patent/EP2681758A1/fr not_active Withdrawn
- 2012-02-27 WO PCT/FR2012/000069 patent/WO2012117171A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
FR2972199A1 (fr) | 2012-09-07 |
EP2681758A1 (fr) | 2014-01-08 |
WO2012117171A1 (fr) | 2012-09-07 |
US20140001031A1 (en) | 2014-01-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 6 |
|
ST | Notification of lapse |
Effective date: 20171130 |