FR2962578B1 - Composant électronique en boitier céramique - Google Patents
Composant électronique en boitier céramiqueInfo
- Publication number
- FR2962578B1 FR2962578B1 FR1002899A FR1002899A FR2962578B1 FR 2962578 B1 FR2962578 B1 FR 2962578B1 FR 1002899 A FR1002899 A FR 1002899A FR 1002899 A FR1002899 A FR 1002899A FR 2962578 B1 FR2962578 B1 FR 2962578B1
- Authority
- FR
- France
- Prior art keywords
- area
- chip
- electronic component
- housing
- onto
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000919 ceramic Substances 0.000 title abstract 3
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
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- H01L23/00—Details of semiconductor or other solid state devices
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- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Ceramic Products (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1002899A FR2962578B1 (fr) | 2010-07-09 | 2010-07-09 | Composant électronique en boitier céramique |
PCT/EP2011/061287 WO2012004249A1 (fr) | 2010-07-09 | 2011-07-05 | Composant electronique en boîtier ceramique |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1002899A FR2962578B1 (fr) | 2010-07-09 | 2010-07-09 | Composant électronique en boitier céramique |
Publications (2)
Publication Number | Publication Date |
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FR2962578A1 FR2962578A1 (fr) | 2012-01-13 |
FR2962578B1 true FR2962578B1 (fr) | 2012-08-03 |
Family
ID=43530288
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1002899A Active FR2962578B1 (fr) | 2010-07-09 | 2010-07-09 | Composant électronique en boitier céramique |
Country Status (2)
Country | Link |
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FR (1) | FR2962578B1 (fr) |
WO (1) | WO2012004249A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2602046B (en) * | 2020-12-16 | 2023-07-19 | Rockley Photonics Ltd | Electro-optical package and method of fabrication |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6380849U (fr) * | 1986-11-17 | 1988-05-27 | Nec Corp | |
JPH0423441A (ja) * | 1990-05-18 | 1992-01-27 | Fujitsu Ltd | セラミックパッケージ半導体装置およびその製造方法 |
WO1998020546A1 (fr) * | 1996-11-08 | 1998-05-14 | W.L. Gore & Associates, Inc. | Cavites a haute tolerance dans des boitiers de puces |
US6428650B1 (en) * | 1998-06-23 | 2002-08-06 | Amerasia International Technology, Inc. | Cover for an optical device and method for making same |
JP2000323617A (ja) * | 1999-05-12 | 2000-11-24 | Mitsubishi Electric Corp | 高周波用半導体パッケージ |
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2010
- 2010-07-09 FR FR1002899A patent/FR2962578B1/fr active Active
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2011
- 2011-07-05 WO PCT/EP2011/061287 patent/WO2012004249A1/fr active Application Filing
Also Published As
Publication number | Publication date |
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FR2962578A1 (fr) | 2012-01-13 |
WO2012004249A1 (fr) | 2012-01-12 |
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