FR2962225B1 - Procede de caracterisation de la sensibilite de composants electroniques vis-a-vis de mecanismes destructifs - Google Patents
Procede de caracterisation de la sensibilite de composants electroniques vis-a-vis de mecanismes destructifsInfo
- Publication number
- FR2962225B1 FR2962225B1 FR1055292A FR1055292A FR2962225B1 FR 2962225 B1 FR2962225 B1 FR 2962225B1 FR 1055292 A FR1055292 A FR 1055292A FR 1055292 A FR1055292 A FR 1055292A FR 2962225 B1 FR2962225 B1 FR 2962225B1
- Authority
- FR
- France
- Prior art keywords
- characterizing
- sensitivity
- electronic components
- destructive mechanisms
- destructive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000001066 destructive effect Effects 0.000 title 1
- 230000035945 sensitivity Effects 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/001—Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing
- G01R31/002—Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing where the device under test is an electronic circuit
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2836—Fault-finding or characterising
- G01R31/2846—Fault-finding or characterising using hard- or software simulation or using knowledge-based systems, e.g. expert systems, artificial intelligence or interactive algorithms
- G01R31/2848—Fault-finding or characterising using hard- or software simulation or using knowledge-based systems, e.g. expert systems, artificial intelligence or interactive algorithms using simulation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2836—Fault-finding or characterising
- G01R31/2849—Environmental or reliability testing, e.g. burn-in or validation tests
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2881—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to environmental aspects other than temperature, e.g. humidity or vibrations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B1/00—Measuring instruments characterised by the selection of material therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/31816—Soft error testing; Soft error rate evaluation; Single event testing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Artificial Intelligence (AREA)
- Evolutionary Computation (AREA)
- Medical Informatics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1055292A FR2962225B1 (fr) | 2010-07-01 | 2010-07-01 | Procede de caracterisation de la sensibilite de composants electroniques vis-a-vis de mecanismes destructifs |
JP2013517303A JP6023050B2 (ja) | 2010-07-01 | 2011-06-30 | 破壊メカニズムに対する電子コンポーネントの感受性を特性化するための方法 |
CN201180033072.0A CN102959416B (zh) | 2010-07-01 | 2011-06-30 | 表征电子元件对损毁机制的敏感度的方法 |
BR112012033461A BR112012033461A2 (pt) | 2010-07-01 | 2011-06-30 | processo de caracterização da sensibilidade de componentes eletrônicos em relação a mecanismos destrutivos |
CA2803054A CA2803054A1 (fr) | 2010-07-01 | 2011-06-30 | Procede de caracterisation de la sensibilite de composants electroniques vis-a-vis de mecanismes destructifs |
PCT/EP2011/061034 WO2012001119A1 (fr) | 2010-07-01 | 2011-06-30 | Procede de caracterisation de la sensibilite de composants electroniques vis-a-vis de mecanismes destructifs |
EP11733613.1A EP2588874A1 (fr) | 2010-07-01 | 2011-06-30 | Procede de caracterisation de la sensibilite de composants electroniques vis-a-vis de mecanismes destructifs |
US13/807,889 US9506970B2 (en) | 2010-07-01 | 2011-06-30 | Method for characterizing the sensitivity of electronic components to destructive mechanisms |
IL223823A IL223823A (en) | 2010-07-01 | 2012-12-24 | A method for characterizing the sensitivity of electronic components to destructive mechanisms |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1055292A FR2962225B1 (fr) | 2010-07-01 | 2010-07-01 | Procede de caracterisation de la sensibilite de composants electroniques vis-a-vis de mecanismes destructifs |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2962225A1 FR2962225A1 (fr) | 2012-01-06 |
FR2962225B1 true FR2962225B1 (fr) | 2012-08-17 |
Family
ID=43598246
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1055292A Active FR2962225B1 (fr) | 2010-07-01 | 2010-07-01 | Procede de caracterisation de la sensibilite de composants electroniques vis-a-vis de mecanismes destructifs |
Country Status (9)
Country | Link |
---|---|
US (1) | US9506970B2 (fr) |
EP (1) | EP2588874A1 (fr) |
JP (1) | JP6023050B2 (fr) |
CN (1) | CN102959416B (fr) |
BR (1) | BR112012033461A2 (fr) |
CA (1) | CA2803054A1 (fr) |
FR (1) | FR2962225B1 (fr) |
IL (1) | IL223823A (fr) |
WO (1) | WO2012001119A1 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9904750B2 (en) * | 2014-03-07 | 2018-02-27 | The Boeing Company | System and method to predict whether a protection circuit is likely to prevent a latent failure within a monitored circuit |
WO2018148377A1 (fr) | 2017-02-08 | 2018-08-16 | Vanderbilt University | Déclenchement parasite efficace d'événement isolé induit par laser et procédés de fonctionnement |
WO2019038836A1 (fr) * | 2017-08-22 | 2019-02-28 | 富士通株式会社 | Procédé d'inspection d'erreur logique, dispositif d'inspection d'erreur logique et système d'inspection d'erreur logique |
JP7145826B2 (ja) * | 2019-08-27 | 2022-10-03 | 三菱電機株式会社 | Seb耐性評価方法およびseb耐性評価装置 |
CN111737934A (zh) * | 2020-06-30 | 2020-10-02 | 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所)(中国赛宝实验室)) | 功率器件的敏感区域检测方法、计算机设备及存储介质 |
CN114676571B (zh) * | 2022-03-25 | 2024-03-22 | 扬州大学 | 一种功率器件的单粒子硬错误鉴别方法 |
JP2024039422A (ja) * | 2022-09-09 | 2024-03-22 | 株式会社デンソー | 特性予測システム |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4572954A (en) * | 1984-06-11 | 1986-02-25 | The United States Of America As Represented By The Secretary Of The Air Force | Radiation measuring system using transister flux sensors |
US4786865A (en) * | 1986-03-03 | 1988-11-22 | The Boeing Company | Method and apparatus for testing integrated circuit susceptibility to cosmic rays |
US6800852B2 (en) * | 2002-12-27 | 2004-10-05 | Revera Incorporated | Nondestructive characterization of thin films using measured basis spectra |
US7019311B1 (en) * | 2004-03-25 | 2006-03-28 | Sandia Corporation | Laser-based irradiation apparatus and methods for monitoring the dose-rate response of semiconductor devices |
US7787779B2 (en) * | 2005-05-06 | 2010-08-31 | Purdue Research Foundation | Photonic time-domain electromagnetic signal generator and system using the same |
US20080142899A1 (en) * | 2006-08-04 | 2008-06-19 | Silicon Space Technology Corporation | Radiation immunity of integrated circuits using backside die contact and electrically conductive layers |
US8299767B1 (en) * | 2006-08-18 | 2012-10-30 | Picor Corporation | Dynamic safe operating area control |
US7499308B2 (en) * | 2007-03-21 | 2009-03-03 | International Business Machines Corporation | Programmable heavy-ion sensing device for accelerated DRAM soft error detection |
US8024163B2 (en) * | 2007-07-23 | 2011-09-20 | International Business Machines Corporation | Method and apparatus for executing multiple simulations on a supercomputer |
FR2920882B1 (fr) * | 2007-09-06 | 2010-02-26 | Eads Europ Aeronautic Defence | Procede de caracterisation des conditions d'utilisation d'un composant electronique permettant de limiter sa sensibilite aux interactions energetiques |
US8886779B2 (en) * | 2007-10-19 | 2014-11-11 | Oracle America, Inc. | Performance modeling for SOA security appliance |
FR2923021B1 (fr) * | 2007-10-26 | 2010-02-19 | Eads Europ Aeronautic Defence | Procede de determination de la sensibilite des composants electroniques vis-a-vis des particules. |
CN100538378C (zh) * | 2007-11-22 | 2009-09-09 | 北京圣涛平试验工程技术研究院有限责任公司 | 获取单粒子现象截面与重离子线性能量转移关系的方法 |
-
2010
- 2010-07-01 FR FR1055292A patent/FR2962225B1/fr active Active
-
2011
- 2011-06-30 CN CN201180033072.0A patent/CN102959416B/zh not_active Expired - Fee Related
- 2011-06-30 EP EP11733613.1A patent/EP2588874A1/fr not_active Withdrawn
- 2011-06-30 BR BR112012033461A patent/BR112012033461A2/pt active Search and Examination
- 2011-06-30 WO PCT/EP2011/061034 patent/WO2012001119A1/fr active Application Filing
- 2011-06-30 CA CA2803054A patent/CA2803054A1/fr not_active Abandoned
- 2011-06-30 JP JP2013517303A patent/JP6023050B2/ja not_active Expired - Fee Related
- 2011-06-30 US US13/807,889 patent/US9506970B2/en not_active Expired - Fee Related
-
2012
- 2012-12-24 IL IL223823A patent/IL223823A/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP2013531797A (ja) | 2013-08-08 |
BR112012033461A2 (pt) | 2016-11-22 |
CA2803054A1 (fr) | 2012-01-05 |
WO2012001119A1 (fr) | 2012-01-05 |
CN102959416A (zh) | 2013-03-06 |
IL223823A (en) | 2017-04-30 |
FR2962225A1 (fr) | 2012-01-06 |
CN102959416B (zh) | 2016-02-03 |
US9506970B2 (en) | 2016-11-29 |
EP2588874A1 (fr) | 2013-05-08 |
JP6023050B2 (ja) | 2016-11-09 |
US20130099774A1 (en) | 2013-04-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 7 |
|
PLFP | Fee payment |
Year of fee payment: 8 |