FR2945152B1 - Ensemble de circuit electronique composite - Google Patents

Ensemble de circuit electronique composite

Info

Publication number
FR2945152B1
FR2945152B1 FR0952808A FR0952808A FR2945152B1 FR 2945152 B1 FR2945152 B1 FR 2945152B1 FR 0952808 A FR0952808 A FR 0952808A FR 0952808 A FR0952808 A FR 0952808A FR 2945152 B1 FR2945152 B1 FR 2945152B1
Authority
FR
France
Prior art keywords
electronic circuit
circuit assembly
composite electronic
composite
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0952808A
Other languages
English (en)
Other versions
FR2945152A1 (fr
Inventor
Alain Artieri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OCT Circuit Technologies International Ltd
Original Assignee
STMicroelectronics Wireless SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics Wireless SAS filed Critical STMicroelectronics Wireless SAS
Priority to FR0952808A priority Critical patent/FR2945152B1/fr
Priority to US13/266,180 priority patent/US8913356B2/en
Priority to PCT/EP2010/055181 priority patent/WO2010124967A1/fr
Priority to JP2012507679A priority patent/JP5584285B2/ja
Priority to EP10713995A priority patent/EP2425451A1/fr
Publication of FR2945152A1 publication Critical patent/FR2945152A1/fr
Application granted granted Critical
Publication of FR2945152B1 publication Critical patent/FR2945152B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/1302—Disposition
    • H01L2224/13025—Disposition the bump connector being disposed on a via connection of the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H01L2224/16146—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked the bump connector connecting to a via connection in the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
    • H01L2224/171—Disposition
    • H01L2224/1718—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/17181—On opposite sides of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06513—Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06517—Bump or bump-like direct electrical connections from device to substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Logic Circuits (AREA)
FR0952808A 2009-04-29 2009-04-29 Ensemble de circuit electronique composite Active FR2945152B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR0952808A FR2945152B1 (fr) 2009-04-29 2009-04-29 Ensemble de circuit electronique composite
US13/266,180 US8913356B2 (en) 2009-04-29 2010-04-20 Composite electronic circuit assembly
PCT/EP2010/055181 WO2010124967A1 (fr) 2009-04-29 2010-04-20 Ensemble circuit électronique composite
JP2012507679A JP5584285B2 (ja) 2009-04-29 2010-04-20 複合電子回路アセンブリ
EP10713995A EP2425451A1 (fr) 2009-04-29 2010-04-20 Ensemble circuit électronique composite

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0952808A FR2945152B1 (fr) 2009-04-29 2009-04-29 Ensemble de circuit electronique composite

Publications (2)

Publication Number Publication Date
FR2945152A1 FR2945152A1 (fr) 2010-11-05
FR2945152B1 true FR2945152B1 (fr) 2011-07-29

Family

ID=41319542

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0952808A Active FR2945152B1 (fr) 2009-04-29 2009-04-29 Ensemble de circuit electronique composite

Country Status (5)

Country Link
US (1) US8913356B2 (fr)
EP (1) EP2425451A1 (fr)
JP (1) JP5584285B2 (fr)
FR (1) FR2945152B1 (fr)
WO (1) WO2010124967A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8399961B2 (en) * 2010-12-21 2013-03-19 Taiwan Semiconductor Manufacturing Company, Ltd. Tuning the efficiency in the transmission of radio-frequency signals using micro-bumps
JP5696602B2 (ja) * 2011-06-29 2015-04-08 コニカミノルタ株式会社 インクジェットヘッドの駆動回路及びインクジェットヘッド
US9728453B2 (en) 2013-03-15 2017-08-08 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for hybrid wafer bonding integrated with CMOS processing
US9756491B2 (en) * 2014-11-14 2017-09-05 Zen-Me Labs Oy System and method for social sensor platform based private social network
EP3208921B1 (fr) * 2016-02-16 2019-04-17 Mitsubishi Electric R&D Centre Europe B.V. Système et procédé pour commander le fonctionnement d'un module de puissance à puces multiples

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6181008B1 (en) * 1998-11-12 2001-01-30 Sarnoff Corporation Integrated circuit power supply
WO2000041242A1 (fr) * 1998-12-30 2000-07-13 Infineon Technologies Ag Ensemble semi-conducteur
US6396137B1 (en) * 2000-03-15 2002-05-28 Kevin Mark Klughart Integrated voltage/current/power regulator/switch system and method
JP2003132683A (ja) * 2001-10-23 2003-05-09 Hitachi Ltd 半導体装置
JP2004047987A (ja) * 2003-06-12 2004-02-12 Rohm Co Ltd 積層基板体および半導体装置
US20060065962A1 (en) * 2004-09-29 2006-03-30 Intel Corporation Control circuitry in stacked silicon
US7085143B1 (en) * 2005-05-23 2006-08-01 International Business Machines Corporation In-module current source
JP4671786B2 (ja) * 2005-07-04 2011-04-20 パナソニック株式会社 半導体集積回路装置
JP2008219813A (ja) * 2007-03-07 2008-09-18 Sharp Corp Ｌｖｄｓ受信装置、ｌｖｄｓ受信方法、ｌｖｄｓデータ伝送システム、および半導体装置
JP4384195B2 (ja) * 2007-03-22 2009-12-16 株式会社東芝 半導体装置の製造方法
JP2009076518A (ja) * 2007-09-19 2009-04-09 Nec Electronics Corp 半導体装置

Also Published As

Publication number Publication date
EP2425451A1 (fr) 2012-03-07
JP5584285B2 (ja) 2014-09-03
WO2010124967A1 (fr) 2010-11-04
JP2012525691A (ja) 2012-10-22
US8913356B2 (en) 2014-12-16
FR2945152A1 (fr) 2010-11-05
US20120039004A1 (en) 2012-02-16

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Legal Events

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CD Change of name or company name

Owner name: ST-ERICSSON SA, CH

Effective date: 20120326

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Effective date: 20120326

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TP Transmission of property

Owner name: OCT CIRCUIT TECHNOLOGIES INTERNATIONAL LIMITED, IE

Effective date: 20180116

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