FR2944853B1 - LED LIGHTING DEVICE INCORPORATING A SUPPORT FOR THERMAL DISSIPATION. - Google Patents

LED LIGHTING DEVICE INCORPORATING A SUPPORT FOR THERMAL DISSIPATION.

Info

Publication number
FR2944853B1
FR2944853B1 FR0952735A FR0952735A FR2944853B1 FR 2944853 B1 FR2944853 B1 FR 2944853B1 FR 0952735 A FR0952735 A FR 0952735A FR 0952735 A FR0952735 A FR 0952735A FR 2944853 B1 FR2944853 B1 FR 2944853B1
Authority
FR
France
Prior art keywords
support
lighting device
led lighting
device incorporating
thermal dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0952735A
Other languages
French (fr)
Other versions
FR2944853A1 (en
Inventor
Michel Petit
Herve Michon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HMI INNOVATION
Original Assignee
HMI INNOVATION
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HMI INNOVATION filed Critical HMI INNOVATION
Priority to FR0952735A priority Critical patent/FR2944853B1/en
Priority to FR0958320A priority patent/FR2944855A1/en
Priority to PCT/FR2010/050793 priority patent/WO2010125294A1/en
Priority to EP10727041A priority patent/EP2425180A1/en
Publication of FR2944853A1 publication Critical patent/FR2944853A1/en
Application granted granted Critical
Publication of FR2944853B1 publication Critical patent/FR2944853B1/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/04Arrangement of electric circuit elements in or on lighting devices the elements being switches
    • F21V23/0442Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/04Arrangement of electric circuit elements in or on lighting devices the elements being switches
    • F21V23/0442Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
    • F21V23/0457Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors the sensor sensing the operating status of the lighting device, e.g. to detect failure of a light source or to provide feedback to the device
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/745Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades the fins or blades being planar and inclined with respect to the joining surface from which the fins or blades extend
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0209External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0204Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10151Sensor

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Thermal Sciences (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
FR0952735A 2009-04-27 2009-04-27 LED LIGHTING DEVICE INCORPORATING A SUPPORT FOR THERMAL DISSIPATION. Expired - Fee Related FR2944853B1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR0952735A FR2944853B1 (en) 2009-04-27 2009-04-27 LED LIGHTING DEVICE INCORPORATING A SUPPORT FOR THERMAL DISSIPATION.
FR0958320A FR2944855A1 (en) 2009-04-27 2009-11-24 LED LIGHTING DEVICE INCORPORATING IMPROVED MEANS FOR ENHANCED THERMAL DISSIPATION
PCT/FR2010/050793 WO2010125294A1 (en) 2009-04-27 2010-04-27 Led lighting device including improved means for promoting heat dissipation
EP10727041A EP2425180A1 (en) 2009-04-27 2010-04-27 Led lighting device including improved means for promoting heat dissipation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0952735A FR2944853B1 (en) 2009-04-27 2009-04-27 LED LIGHTING DEVICE INCORPORATING A SUPPORT FOR THERMAL DISSIPATION.

Publications (2)

Publication Number Publication Date
FR2944853A1 FR2944853A1 (en) 2010-10-29
FR2944853B1 true FR2944853B1 (en) 2012-10-12

Family

ID=41263975

Family Applications (2)

Application Number Title Priority Date Filing Date
FR0952735A Expired - Fee Related FR2944853B1 (en) 2009-04-27 2009-04-27 LED LIGHTING DEVICE INCORPORATING A SUPPORT FOR THERMAL DISSIPATION.
FR0958320A Pending FR2944855A1 (en) 2009-04-27 2009-11-24 LED LIGHTING DEVICE INCORPORATING IMPROVED MEANS FOR ENHANCED THERMAL DISSIPATION

Family Applications After (1)

Application Number Title Priority Date Filing Date
FR0958320A Pending FR2944855A1 (en) 2009-04-27 2009-11-24 LED LIGHTING DEVICE INCORPORATING IMPROVED MEANS FOR ENHANCED THERMAL DISSIPATION

Country Status (3)

Country Link
EP (1) EP2425180A1 (en)
FR (2) FR2944853B1 (en)
WO (1) WO2010125294A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SK50662009A3 (en) * 2009-10-29 2011-06-06 Otto Pokorn� Compact arrangement of LED lamp and compact LED bulb
JP6108304B2 (en) * 2013-03-12 2017-04-05 パナソニックIpマネジメント株式会社 Illumination light source and illumination device
EP2990723B1 (en) 2014-09-01 2017-08-09 Energies Alternatives & Solaires Solutions Lighting device including an improved mounting

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3001105A (en) * 1956-11-30 1961-09-19 Arthur B Fox Glass beads as potting material for electronic assemblies
DE1912635A1 (en) * 1969-03-13 1970-09-24 Standard Elektrik Lorenz Ag Silicone rubber for encapsulation of electri - cal components in caps
US6087200A (en) * 1998-08-13 2000-07-11 Clear Logic, Inc. Using microspheres as a stress buffer for integrated circuit prototypes
US6573536B1 (en) * 2002-05-29 2003-06-03 Optolum, Inc. Light emitting diode light source
JP3804861B2 (en) * 2002-08-29 2006-08-02 株式会社デンソー Electrical device and wiring board
US6999318B2 (en) * 2003-07-28 2006-02-14 Honeywell International Inc. Heatsinking electronic devices
US7255460B2 (en) * 2005-03-23 2007-08-14 Nuriplan Co., Ltd. LED illumination lamp
DE202005009086U1 (en) * 2005-06-10 2005-11-10 Hsieh, Chin-Mu, Yungkang Shield for a luminous diode has an outer surface, first and second openings opposite each other with respective small and larger diameters and a concave recess
US20070081340A1 (en) * 2005-10-07 2007-04-12 Chung Huai-Ku LED light source module with high efficiency heat dissipation
US20080192436A1 (en) * 2007-02-09 2008-08-14 Cooler Master Co., Ltd. Light emitting device
US20090002996A1 (en) * 2007-06-28 2009-01-01 Keeper Technology Co., Ltd. Heat-dissipating device for an LED
KR200438525Y1 (en) * 2007-09-10 2008-02-26 티엠컨버전스주식회사 Cooling device for led light source using non-conductive liquid
CN101498435A (en) * 2008-01-30 2009-08-05 富士迈半导体精密工业(上海)有限公司 Luminous diode lighting device and method for reducing heating power thereof

Also Published As

Publication number Publication date
FR2944855A1 (en) 2010-10-29
FR2944853A1 (en) 2010-10-29
WO2010125294A1 (en) 2010-11-04
EP2425180A1 (en) 2012-03-07

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Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 7

ST Notification of lapse

Effective date: 20161230