FR2944853B1 - LED LIGHTING DEVICE INCORPORATING A SUPPORT FOR THERMAL DISSIPATION. - Google Patents
LED LIGHTING DEVICE INCORPORATING A SUPPORT FOR THERMAL DISSIPATION.Info
- Publication number
- FR2944853B1 FR2944853B1 FR0952735A FR0952735A FR2944853B1 FR 2944853 B1 FR2944853 B1 FR 2944853B1 FR 0952735 A FR0952735 A FR 0952735A FR 0952735 A FR0952735 A FR 0952735A FR 2944853 B1 FR2944853 B1 FR 2944853B1
- Authority
- FR
- France
- Prior art keywords
- support
- lighting device
- led lighting
- device incorporating
- thermal dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
- F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
- F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
- F21V23/0457—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors the sensor sensing the operating status of the lighting device, e.g. to detect failure of a light source or to provide feedback to the device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/745—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades the fins or blades being planar and inclined with respect to the joining surface from which the fins or blades extend
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Thermal Sciences (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0952735A FR2944853B1 (en) | 2009-04-27 | 2009-04-27 | LED LIGHTING DEVICE INCORPORATING A SUPPORT FOR THERMAL DISSIPATION. |
FR0958320A FR2944855A1 (en) | 2009-04-27 | 2009-11-24 | LED LIGHTING DEVICE INCORPORATING IMPROVED MEANS FOR ENHANCED THERMAL DISSIPATION |
PCT/FR2010/050793 WO2010125294A1 (en) | 2009-04-27 | 2010-04-27 | Led lighting device including improved means for promoting heat dissipation |
EP10727041A EP2425180A1 (en) | 2009-04-27 | 2010-04-27 | Led lighting device including improved means for promoting heat dissipation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0952735A FR2944853B1 (en) | 2009-04-27 | 2009-04-27 | LED LIGHTING DEVICE INCORPORATING A SUPPORT FOR THERMAL DISSIPATION. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2944853A1 FR2944853A1 (en) | 2010-10-29 |
FR2944853B1 true FR2944853B1 (en) | 2012-10-12 |
Family
ID=41263975
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0952735A Expired - Fee Related FR2944853B1 (en) | 2009-04-27 | 2009-04-27 | LED LIGHTING DEVICE INCORPORATING A SUPPORT FOR THERMAL DISSIPATION. |
FR0958320A Pending FR2944855A1 (en) | 2009-04-27 | 2009-11-24 | LED LIGHTING DEVICE INCORPORATING IMPROVED MEANS FOR ENHANCED THERMAL DISSIPATION |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0958320A Pending FR2944855A1 (en) | 2009-04-27 | 2009-11-24 | LED LIGHTING DEVICE INCORPORATING IMPROVED MEANS FOR ENHANCED THERMAL DISSIPATION |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2425180A1 (en) |
FR (2) | FR2944853B1 (en) |
WO (1) | WO2010125294A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SK50662009A3 (en) * | 2009-10-29 | 2011-06-06 | Otto Pokorn� | Compact arrangement of LED lamp and compact LED bulb |
JP6108304B2 (en) * | 2013-03-12 | 2017-04-05 | パナソニックIpマネジメント株式会社 | Illumination light source and illumination device |
EP2990723B1 (en) | 2014-09-01 | 2017-08-09 | Energies Alternatives & Solaires Solutions | Lighting device including an improved mounting |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3001105A (en) * | 1956-11-30 | 1961-09-19 | Arthur B Fox | Glass beads as potting material for electronic assemblies |
DE1912635A1 (en) * | 1969-03-13 | 1970-09-24 | Standard Elektrik Lorenz Ag | Silicone rubber for encapsulation of electri - cal components in caps |
US6087200A (en) * | 1998-08-13 | 2000-07-11 | Clear Logic, Inc. | Using microspheres as a stress buffer for integrated circuit prototypes |
US6573536B1 (en) * | 2002-05-29 | 2003-06-03 | Optolum, Inc. | Light emitting diode light source |
JP3804861B2 (en) * | 2002-08-29 | 2006-08-02 | 株式会社デンソー | Electrical device and wiring board |
US6999318B2 (en) * | 2003-07-28 | 2006-02-14 | Honeywell International Inc. | Heatsinking electronic devices |
US7255460B2 (en) * | 2005-03-23 | 2007-08-14 | Nuriplan Co., Ltd. | LED illumination lamp |
DE202005009086U1 (en) * | 2005-06-10 | 2005-11-10 | Hsieh, Chin-Mu, Yungkang | Shield for a luminous diode has an outer surface, first and second openings opposite each other with respective small and larger diameters and a concave recess |
US20070081340A1 (en) * | 2005-10-07 | 2007-04-12 | Chung Huai-Ku | LED light source module with high efficiency heat dissipation |
US20080192436A1 (en) * | 2007-02-09 | 2008-08-14 | Cooler Master Co., Ltd. | Light emitting device |
US20090002996A1 (en) * | 2007-06-28 | 2009-01-01 | Keeper Technology Co., Ltd. | Heat-dissipating device for an LED |
KR200438525Y1 (en) * | 2007-09-10 | 2008-02-26 | 티엠컨버전스주식회사 | Cooling device for led light source using non-conductive liquid |
CN101498435A (en) * | 2008-01-30 | 2009-08-05 | 富士迈半导体精密工业(上海)有限公司 | Luminous diode lighting device and method for reducing heating power thereof |
-
2009
- 2009-04-27 FR FR0952735A patent/FR2944853B1/en not_active Expired - Fee Related
- 2009-11-24 FR FR0958320A patent/FR2944855A1/en active Pending
-
2010
- 2010-04-27 WO PCT/FR2010/050793 patent/WO2010125294A1/en active Application Filing
- 2010-04-27 EP EP10727041A patent/EP2425180A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
FR2944855A1 (en) | 2010-10-29 |
FR2944853A1 (en) | 2010-10-29 |
WO2010125294A1 (en) | 2010-11-04 |
EP2425180A1 (en) | 2012-03-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 7 |
|
ST | Notification of lapse |
Effective date: 20161230 |