FR2935621B1 - Technique de brasage par laser holographie. - Google Patents

Technique de brasage par laser holographie.

Info

Publication number
FR2935621B1
FR2935621B1 FR0804877A FR0804877A FR2935621B1 FR 2935621 B1 FR2935621 B1 FR 2935621B1 FR 0804877 A FR0804877 A FR 0804877A FR 0804877 A FR0804877 A FR 0804877A FR 2935621 B1 FR2935621 B1 FR 2935621B1
Authority
FR
France
Prior art keywords
brazing technique
laser holography
holography
laser
brazing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0804877A
Other languages
English (en)
Other versions
FR2935621A1 (fr
Inventor
John Sanjay Swamidas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to FR0804877A priority Critical patent/FR2935621B1/fr
Publication of FR2935621A1 publication Critical patent/FR2935621A1/fr
Application granted granted Critical
Publication of FR2935621B1 publication Critical patent/FR2935621B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR0804877A 2008-09-05 2008-09-05 Technique de brasage par laser holographie. Expired - Fee Related FR2935621B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0804877A FR2935621B1 (fr) 2008-09-05 2008-09-05 Technique de brasage par laser holographie.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0804877A FR2935621B1 (fr) 2008-09-05 2008-09-05 Technique de brasage par laser holographie.

Publications (2)

Publication Number Publication Date
FR2935621A1 FR2935621A1 (fr) 2010-03-12
FR2935621B1 true FR2935621B1 (fr) 2011-10-14

Family

ID=40547851

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0804877A Expired - Fee Related FR2935621B1 (fr) 2008-09-05 2008-09-05 Technique de brasage par laser holographie.

Country Status (1)

Country Link
FR (1) FR2935621B1 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62263862A (ja) * 1986-05-12 1987-11-16 Toshiba Corp レ−ザ加工装置
DE3831743A1 (de) * 1988-09-17 1990-03-29 Philips Patentverwaltung Vorrichtung zur bearbeitung eines werkstueckes mit laserlicht und verwendung dieser vorrichtung
JP3775410B2 (ja) * 2003-02-03 2006-05-17 セイコーエプソン株式会社 レーザー加工方法、レーザー溶接方法並びにレーザー加工装置
US20080047939A1 (en) * 2006-08-25 2008-02-28 Stefan Hummelt Process and apparatus for joining at least two elements

Also Published As

Publication number Publication date
FR2935621A1 (fr) 2010-03-12

Similar Documents

Publication Publication Date Title
BRPI0814466A2 (pt) Método.
BRPI0918430A2 (pt) 4-fenil-1h-pirazóis inseticidas.
IT1392848B1 (it) Motociclo.
BRPI0918433A2 (pt) combinação herbicida compreendendo difluormetano sulfonilanildas substittuídas por demetoxitriazinila.
BRPI0919011A2 (pt) embalagem de produto consumível.
DK2344471T3 (da) 7-piperidinalkyl-3,4-dihydroquinolon-derivat
BRPI0917446A2 (pt) derivados de acilaminobenzamida.
BRPI0909488A2 (pt) brocha
FR2928371B1 (fr) Derive de cysteine.
IT1396406B1 (it) Stantuffo.
IT1391351B1 (it) Unità di marcatura laser di pacchetti.
FR2911693B3 (fr) Telemetre laser
BRPI0906714A2 (pt) Derivados de oxazepinopirimidona heteroarilamida substituídos.
BRPI0922070A2 (pt) turbina.
BRPI0912716A2 (pt) composto.
IT1393579B1 (it) Motociclo.
BRPI0912251A2 (pt) aço de elevadas características para peças maciças.
BRPI0816679A2 (pt) Derivados de ftalazinona.
DE502007000476D1 (de) Verbundlenkerachse
FR2911692B3 (fr) Telemetre laser
FR2951392B1 (fr) Installation de soudage au laser
NL1036334A1 (nl) Slm calibration.
FR2936492B1 (fr) Nacelle pour turboreacteur.
BRPI0912331A2 (pt) distribuidor.
IT1396642B1 (it) Statore.

Legal Events

Date Code Title Description
RT Complete renunciation

Effective date: 20131030

ST Notification of lapse

Effective date: 20140530