FR2929482B1 - Calculateur a l'agencement simplifie, destine a l'aeronautique - Google Patents
Calculateur a l'agencement simplifie, destine a l'aeronautiqueInfo
- Publication number
- FR2929482B1 FR2929482B1 FR0801788A FR0801788A FR2929482B1 FR 2929482 B1 FR2929482 B1 FR 2929482B1 FR 0801788 A FR0801788 A FR 0801788A FR 0801788 A FR0801788 A FR 0801788A FR 2929482 B1 FR2929482 B1 FR 2929482B1
- Authority
- FR
- France
- Prior art keywords
- aeronautics
- computer
- simplified arrangement
- simplified
- arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
- H05K7/1452—Mounting of connectors; Switching; Reinforcing of back panels
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0801788A FR2929482B1 (fr) | 2008-04-01 | 2008-04-01 | Calculateur a l'agencement simplifie, destine a l'aeronautique |
US12/415,074 US8000096B2 (en) | 2008-04-01 | 2009-03-31 | Computer with simplified layout, designed for aviation |
DE102009015704A DE102009015704A1 (de) | 2008-04-01 | 2009-03-31 | Rechner mit vereinfachter Anordnung, bestimmt für Luftfahzeuge |
GB0905682.1A GB2458809B (en) | 2008-04-01 | 2009-04-01 | Computer with simplified layout, designed for aviation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0801788A FR2929482B1 (fr) | 2008-04-01 | 2008-04-01 | Calculateur a l'agencement simplifie, destine a l'aeronautique |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2929482A1 FR2929482A1 (fr) | 2009-10-02 |
FR2929482B1 true FR2929482B1 (fr) | 2013-07-05 |
Family
ID=39832622
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0801788A Active FR2929482B1 (fr) | 2008-04-01 | 2008-04-01 | Calculateur a l'agencement simplifie, destine a l'aeronautique |
Country Status (4)
Country | Link |
---|---|
US (1) | US8000096B2 (fr) |
DE (1) | DE102009015704A1 (fr) |
FR (1) | FR2929482B1 (fr) |
GB (1) | GB2458809B (fr) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2958829B1 (fr) * | 2010-04-13 | 2012-09-21 | Airbus Operations Sas | Ensemble modulaire de fixation de modules electroniques |
FR2963198B1 (fr) * | 2010-07-21 | 2018-02-16 | Thales | Circuit imprime possedant des pistes protegees, calculateur et procede |
DE102010062653A1 (de) * | 2010-12-08 | 2012-06-14 | Robert Bosch Gmbh | Steuermodul und Verfahren zu seiner Herstellung |
CN102810001B (zh) * | 2011-06-02 | 2015-02-11 | 赛恩倍吉科技顾问(深圳)有限公司 | 散热*** |
US9161475B2 (en) * | 2012-10-31 | 2015-10-13 | Hewlett-Packard Development Company, L.P. | Multi-function module for insertion into a networking chassis slot |
US9470720B2 (en) | 2013-03-08 | 2016-10-18 | Sandisk Technologies Llc | Test system with localized heating and method of manufacture thereof |
US9313874B2 (en) | 2013-06-19 | 2016-04-12 | SMART Storage Systems, Inc. | Electronic system with heat extraction and method of manufacture thereof |
US10013033B2 (en) | 2013-06-19 | 2018-07-03 | Sandisk Technologies Llc | Electronic assembly with thermal channel and method of manufacture thereof |
US9898056B2 (en) | 2013-06-19 | 2018-02-20 | Sandisk Technologies Llc | Electronic assembly with thermal channel and method of manufacture thereof |
US20160234964A1 (en) | 2013-09-24 | 2016-08-11 | Ge Intelligent Platforms, Inc. | An improved enclosure for hermetical encapsulated electronics |
US9549457B2 (en) | 2014-02-12 | 2017-01-17 | Sandisk Technologies Llc | System and method for redirecting airflow across an electronic assembly |
US9497889B2 (en) | 2014-02-27 | 2016-11-15 | Sandisk Technologies Llc | Heat dissipation for substrate assemblies |
US9348377B2 (en) * | 2014-03-14 | 2016-05-24 | Sandisk Enterprise Ip Llc | Thermal isolation techniques |
US9519319B2 (en) | 2014-03-14 | 2016-12-13 | Sandisk Technologies Llc | Self-supporting thermal tube structure for electronic assemblies |
US9485851B2 (en) | 2014-03-14 | 2016-11-01 | Sandisk Technologies Llc | Thermal tube assembly structures |
FR3040582B1 (fr) * | 2015-08-31 | 2017-10-06 | Thales Sa | Calculateur avionique et procede de montage |
CN108738269B (zh) * | 2017-09-26 | 2020-02-11 | 新华三技术有限公司 | 一种通信设备单板及通信设备 |
US10554029B2 (en) * | 2017-11-08 | 2020-02-04 | Bentek Corporation | Enclosure |
FR3074011B1 (fr) * | 2017-11-21 | 2019-12-20 | Safran Electronics & Defense | Module electrique de puissance |
US10912195B2 (en) * | 2019-01-02 | 2021-02-02 | The Boeing Company | Multi-embedded radio frequency board and mobile device including the same |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5063475A (en) * | 1990-03-19 | 1991-11-05 | International Business Machines Corporation | Multileveled electronic assembly with cooling means |
US5497288A (en) * | 1994-08-31 | 1996-03-05 | International Business Machines Corporation | Apparatus for tilted serial cooling in an electronic system |
US5751549A (en) * | 1996-06-26 | 1998-05-12 | Sun Microsystems, Inc. | Hard disk drive assembly which has a plenum chamber and a fan assembly that is perpendicular to a rack chamber |
JPH11329639A (ja) * | 1998-05-22 | 1999-11-30 | Hitachi Ltd | コントローラの実装方法 |
JP2000123892A (ja) * | 1998-10-19 | 2000-04-28 | Japan Aviation Electronics Industry Ltd | 基板接続用コネクタ |
US6046912A (en) * | 1999-06-03 | 2000-04-04 | Micron Electronics, Inc. | Computer system having riser board expansion capability |
FR2819111B1 (fr) * | 2000-12-28 | 2003-03-07 | Thomson Csf | Module d'interconnexion pour fond de boitier d'appareillage electrique |
US6532154B2 (en) * | 2001-01-09 | 2003-03-11 | Rockwell Automation Technologies, Inc. | Stack assembly housing |
US6910897B2 (en) * | 2001-01-12 | 2005-06-28 | Litton Systems, Inc. | Interconnection system |
US6728104B1 (en) * | 2002-10-23 | 2004-04-27 | Cisco Technology, Inc. | Methods and apparatus for cooling a circuit board component |
US7072186B2 (en) * | 2003-11-25 | 2006-07-04 | Hewlett-Packard Development Company, L.P. | Computer chassis |
US7280356B2 (en) * | 2004-12-14 | 2007-10-09 | Amphenol Corporation | Air cooling architecture for orthogonal board architectures |
US7193847B2 (en) * | 2005-03-31 | 2007-03-20 | Quanta Computer Inc. | Blade server system |
US7458815B2 (en) * | 2006-03-30 | 2008-12-02 | Intel Corporation | Module to couple to a plurality of backplanes in a chassis |
TW200741470A (en) * | 2006-04-19 | 2007-11-01 | Tyan Computer Corp | Multi-processor system and tubelike computer architecture thereof |
FR2900506B1 (fr) * | 2006-04-28 | 2009-07-03 | Thales Sa | Dispositif de connexion de carte electronique et procede de montage associe |
US7320609B1 (en) * | 2006-07-31 | 2008-01-22 | Fci Americas Technology, Inc. | Backplane connector |
US7773382B2 (en) * | 2007-08-22 | 2010-08-10 | Rockwell Automation Technologies, Inc. | System and method for supporting one or more heat-generating electrical devices |
-
2008
- 2008-04-01 FR FR0801788A patent/FR2929482B1/fr active Active
-
2009
- 2009-03-31 US US12/415,074 patent/US8000096B2/en not_active Expired - Fee Related
- 2009-03-31 DE DE102009015704A patent/DE102009015704A1/de not_active Withdrawn
- 2009-04-01 GB GB0905682.1A patent/GB2458809B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US8000096B2 (en) | 2011-08-16 |
GB0905682D0 (en) | 2009-05-20 |
FR2929482A1 (fr) | 2009-10-02 |
US20090244831A1 (en) | 2009-10-01 |
GB2458809A (en) | 2009-10-07 |
GB2458809B (en) | 2012-10-31 |
DE102009015704A1 (de) | 2009-10-08 |
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Legal Events
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PLFP | Fee payment |
Year of fee payment: 9 |
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PLFP | Fee payment |
Year of fee payment: 10 |
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Year of fee payment: 11 |
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Year of fee payment: 13 |
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Year of fee payment: 14 |
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PLFP | Fee payment |
Year of fee payment: 15 |
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PLFP | Fee payment |
Year of fee payment: 16 |
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PLFP | Fee payment |
Year of fee payment: 17 |