FR2927441B1 - Objet sans contact a circuit integre connecte aux bornes d'un circuit par couplage capacitif - Google Patents

Objet sans contact a circuit integre connecte aux bornes d'un circuit par couplage capacitif

Info

Publication number
FR2927441B1
FR2927441B1 FR0800775A FR0800775A FR2927441B1 FR 2927441 B1 FR2927441 B1 FR 2927441B1 FR 0800775 A FR0800775 A FR 0800775A FR 0800775 A FR0800775 A FR 0800775A FR 2927441 B1 FR2927441 B1 FR 2927441B1
Authority
FR
France
Prior art keywords
terminals
capacitive coupling
integrated circuit
circuit
contactless object
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0800775A
Other languages
English (en)
Other versions
FR2927441A1 (fr
Inventor
Yannick Grasset
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to FR0800775A priority Critical patent/FR2927441B1/fr
Priority to EP09722630A priority patent/EP2243160A2/fr
Priority to US12/867,405 priority patent/US9142485B2/en
Priority to PCT/FR2009/000163 priority patent/WO2009115673A2/fr
Publication of FR2927441A1 publication Critical patent/FR2927441A1/fr
Application granted granted Critical
Publication of FR2927441B1 publication Critical patent/FR2927441B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
FR0800775A 2008-02-13 2008-02-13 Objet sans contact a circuit integre connecte aux bornes d'un circuit par couplage capacitif Expired - Fee Related FR2927441B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR0800775A FR2927441B1 (fr) 2008-02-13 2008-02-13 Objet sans contact a circuit integre connecte aux bornes d'un circuit par couplage capacitif
EP09722630A EP2243160A2 (fr) 2008-02-13 2009-02-13 Objet sans contact a circuit integre connecte aux bornes d'un circuit par couplage capacitif
US12/867,405 US9142485B2 (en) 2008-02-13 2009-02-13 Contactless object with integrated circuit connected to circuit terminals by capacitive coupling
PCT/FR2009/000163 WO2009115673A2 (fr) 2008-02-13 2009-02-13 Objet sans contact a circuit integre connecte aux bornes d'un circuit par couplage capacitif

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0800775A FR2927441B1 (fr) 2008-02-13 2008-02-13 Objet sans contact a circuit integre connecte aux bornes d'un circuit par couplage capacitif

Publications (2)

Publication Number Publication Date
FR2927441A1 FR2927441A1 (fr) 2009-08-14
FR2927441B1 true FR2927441B1 (fr) 2011-06-17

Family

ID=39684596

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0800775A Expired - Fee Related FR2927441B1 (fr) 2008-02-13 2008-02-13 Objet sans contact a circuit integre connecte aux bornes d'un circuit par couplage capacitif

Country Status (4)

Country Link
US (1) US9142485B2 (fr)
EP (1) EP2243160A2 (fr)
FR (1) FR2927441B1 (fr)
WO (1) WO2009115673A2 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2936096B1 (fr) 2008-09-12 2011-01-28 Yannick Grasset Procede de fabrication d'objets portatifs sans contact
US9490768B2 (en) * 2012-06-25 2016-11-08 Knowles Cazenovia Inc. High frequency band pass filter with coupled surface mount transition
US9697455B2 (en) 2014-12-26 2017-07-04 Avery Dennison Retail Information Services, Llc Using reactive coupling of a printed RFID chip on a strap to allow the printed material to be over-laminated with a barrier film against oxygen and moisture ingress
SG11201811465WA (en) 2016-06-24 2019-01-30 Agency Science Tech & Res Semiconductor package and method of forming the same
FR3086082B1 (fr) 2018-09-18 2021-04-30 Smart Packaging Solutions Procede de connexion d'un circuit integre a un circuit electrique
DE102019110840A1 (de) * 2019-04-26 2020-10-29 Infineon Technologies Ag Rf-vorrichtungen mit konformen antennen und verfahren zu deren herstellung

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ES2114717T3 (es) * 1995-04-20 1998-06-01 Fuba Automotive Gmbh Disposicion de antenas planas.
KR0175267B1 (ko) * 1995-09-30 1999-04-01 김광호 회전운동을 하는 픽업 툴을 구비하는 다이 본딩 장치
US5786979A (en) * 1995-12-18 1998-07-28 Douglass; Barry G. High density inter-chip connections by electromagnetic coupling
JP3828581B2 (ja) * 1996-12-26 2006-10-04 株式会社日立製作所 半導体装置及びその製造方法
US6310400B1 (en) * 1997-12-29 2001-10-30 Intel Corporation Apparatus for capacitively coupling electronic devices
US6043144A (en) * 1998-05-25 2000-03-28 United Microelectronics Corp. Bonding-pad structure for integrated circuit and method of fabricating the same
JP3167296B2 (ja) * 1998-07-31 2001-05-21 日本特殊陶業株式会社 樹脂製配線基板
US6421013B1 (en) * 1999-10-04 2002-07-16 Amerasia International Technology, Inc. Tamper-resistant wireless article including an antenna
US6559531B1 (en) * 1999-10-14 2003-05-06 Sun Microsystems, Inc. Face to face chips
EP1181666A1 (fr) * 2000-02-14 2002-02-27 Koninklijke Philips Electronics N.V. Transpondeur et dispositif
DE10117929A1 (de) 2001-01-24 2002-08-14 Fraunhofer Ges Forschung Verfahren zum Verbinden eines Chips mit einem Substrat unter Verwendung einer isotropen Verbindungsschicht und Verbundsystem aus Chip und Substrat
DE10133588A1 (de) 2001-07-11 2002-09-05 Infineon Technologies Ag Anordnung eines Chips und einer Leiterstruktur
US6900536B1 (en) * 2002-04-26 2005-05-31 Celis Semiconductor Corporation Method for producing an electrical circuit
JP4023285B2 (ja) * 2002-10-24 2007-12-19 ソニー株式会社 光・電気配線混載ハイブリッド回路基板及びその製造方法並びに光・電気配線混載ハイブリッド回路モジュール及びその製造方法
US7224280B2 (en) 2002-12-31 2007-05-29 Avery Dennison Corporation RFID device and method of forming
US20050045914A1 (en) * 2003-07-09 2005-03-03 Newport Corporation Flip chip device assembly machine
GB2407207B (en) * 2003-10-13 2006-06-07 Micron Technology Inc Structure and method for forming a capacitively coupled chip-to-chip signalling interface
EP2572627A1 (fr) * 2004-01-19 2013-03-27 Olympus Corporation Dispositif d'imagerie pour endoscope et endoscope à capsule
JP4672384B2 (ja) * 2004-04-27 2011-04-20 大日本印刷株式会社 Ｉｃタグ付シートの製造方法、ｉｃタグ付シートの製造装置、ｉｃタグ付シート、ｉｃチップの固定方法、ｉｃチップの固定装置、およびｉｃタグ
US7335556B2 (en) * 2004-06-14 2008-02-26 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
US20060057763A1 (en) * 2004-09-14 2006-03-16 Agency For Science, Technology And Research Method of forming a surface mountable IC and its assembly
US7500307B2 (en) * 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
US7551141B1 (en) * 2004-11-08 2009-06-23 Alien Technology Corporation RFID strap capacitively coupled and method of making same
US7615479B1 (en) * 2004-11-08 2009-11-10 Alien Technology Corporation Assembly comprising functional block deposited therein
US20060261950A1 (en) * 2005-03-29 2006-11-23 Symbol Technologies, Inc. Smart radio frequency identification (RFID) items
US7687327B2 (en) * 2005-07-08 2010-03-30 Kovio, Inc, Methods for manufacturing RFID tags and structures formed therefrom
TW200715645A (en) * 2005-08-02 2007-04-16 Koninkl Philips Electronics Nv Antenna structure, transponder and method of manufacturing an antenna structure
US20070056683A1 (en) * 2005-09-09 2007-03-15 Delaware Capital Formation, Inc. Strap/inlay insertion method and apparatus
FR2894714B1 (fr) * 2005-12-13 2008-02-29 K Sa As Procede de connexion d'une puce electronique sur un dispositif d'identification radiofrequence
JP2009540418A (ja) * 2006-06-07 2009-11-19 エヌエックスピー ビー ヴィ 半導体チップ、トランスポンダおよびトランスポンダの製造方法
US8794531B2 (en) * 2006-07-13 2014-08-05 Confidex Oy Radio frequency identification tag
US7701352B2 (en) * 2006-11-22 2010-04-20 Avery Dennison Corporation RFID label with release liner window, and method of making
US7612676B2 (en) * 2006-12-05 2009-11-03 The Hong Kong University Of Science And Technology RFID tag and antenna
US8381991B2 (en) * 2006-12-18 2013-02-26 Mikoh Company Radio frequency identification tag with privacy and security capabilities
CH698718B1 (de) * 2007-01-31 2009-10-15 Oerlikon Assembly Equipment Ag Vorrichtung für die Montage eines Flipchips auf einem Substrat.
FR2917534B1 (fr) 2007-06-15 2009-10-02 Ask Sa Procede de connexion d'une puce electronique sur un dispositif d'identification radiofrequence
US7943897B2 (en) * 2007-06-20 2011-05-17 Sharp Kabushiki Kaisha Optical encoder and electronic equipment
US20090128332A1 (en) * 2007-11-15 2009-05-21 Claridy Solutions, Inc. Rfid-enabled hologram laser tag
US8102021B2 (en) * 2008-05-12 2012-01-24 Sychip Inc. RF devices
FR2936096B1 (fr) * 2008-09-12 2011-01-28 Yannick Grasset Procede de fabrication d'objets portatifs sans contact

Also Published As

Publication number Publication date
US20110139878A1 (en) 2011-06-16
WO2009115673A2 (fr) 2009-09-24
EP2243160A2 (fr) 2010-10-27
FR2927441A1 (fr) 2009-08-14
WO2009115673A3 (fr) 2009-11-19
US9142485B2 (en) 2015-09-22

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Legal Events

Date Code Title Description
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Year of fee payment: 8

ST Notification of lapse

Effective date: 20161028