FR2916083B1 - Procede de fabrication d'un dispositif a semiconducteur comportant un transistor fet avec grille en t - Google Patents
Procede de fabrication d'un dispositif a semiconducteur comportant un transistor fet avec grille en tInfo
- Publication number
- FR2916083B1 FR2916083B1 FR0851445A FR0851445A FR2916083B1 FR 2916083 B1 FR2916083 B1 FR 2916083B1 FR 0851445 A FR0851445 A FR 0851445A FR 0851445 A FR0851445 A FR 0851445A FR 2916083 B1 FR2916083 B1 FR 2916083B1
- Authority
- FR
- France
- Prior art keywords
- grid
- producing
- semiconductor device
- fet transistor
- fet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0605—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits made of compound material, e.g. AIIIBV
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/8252—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using III-V technology
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Junction Field-Effect Transistors (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007126017A JP5320689B2 (ja) | 2007-05-10 | 2007-05-10 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2916083A1 FR2916083A1 (fr) | 2008-11-14 |
FR2916083B1 true FR2916083B1 (fr) | 2011-11-25 |
Family
ID=39868958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0851445A Expired - Fee Related FR2916083B1 (fr) | 2007-05-10 | 2008-03-05 | Procede de fabrication d'un dispositif a semiconducteur comportant un transistor fet avec grille en t |
Country Status (4)
Country | Link |
---|---|
US (1) | US7625789B2 (fr) |
JP (1) | JP5320689B2 (fr) |
DE (1) | DE102008010328A1 (fr) |
FR (1) | FR2916083B1 (fr) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010067692A (ja) * | 2008-09-09 | 2010-03-25 | Toshiba Corp | 半導体装置及び半導体装置の製造方法 |
US9293379B2 (en) * | 2009-09-03 | 2016-03-22 | Raytheon Company | Semiconductor structure with layers having different hydrogen contents |
US20110053336A1 (en) * | 2009-09-03 | 2011-03-03 | Raytheon Company | Method for selective deposition of dielectric layers on semiconductor structures |
US9082722B2 (en) * | 2013-03-25 | 2015-07-14 | Raytheon Company | Monolithic integrated circuit (MMIC) structure and method for forming such structure |
US9490282B2 (en) * | 2015-03-19 | 2016-11-08 | Omnivision Technologies, Inc. | Photosensitive capacitor pixel for image sensor |
US9478652B1 (en) | 2015-04-10 | 2016-10-25 | Raytheon Company | Monolithic integrated circuit (MMIC) structure having composite etch stop layer and method for forming such structure |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04328867A (ja) * | 1991-04-30 | 1992-11-17 | Sekiyu Sangyo Kasseika Center | 赤外線検出器 |
JPH05129345A (ja) * | 1991-11-08 | 1993-05-25 | Toshiba Corp | マイクロ波集積回路の製造方法 |
JP2522159B2 (ja) | 1993-06-24 | 1996-08-07 | 日本電気株式会社 | 半導体集積回路の製造方法 |
JP2605647B2 (ja) | 1993-12-27 | 1997-04-30 | 日本電気株式会社 | 半導体装置の製造方法 |
JP3226808B2 (ja) * | 1996-11-26 | 2001-11-05 | ルーセント テクノロジーズ インコーポレイテッド | 集積回路チップを製造する方法 |
JP2000138237A (ja) * | 1998-11-02 | 2000-05-16 | Nec Corp | 感光性有機膜を有する半導体装置及びその製造方法 |
KR100827437B1 (ko) * | 2006-05-22 | 2008-05-06 | 삼성전자주식회사 | Mim 커패시터를 구비하는 반도체 집적 회로 장치 및이의 제조 방법 |
-
2007
- 2007-05-10 JP JP2007126017A patent/JP5320689B2/ja not_active Expired - Fee Related
-
2008
- 2008-01-07 US US11/969,990 patent/US7625789B2/en not_active Expired - Fee Related
- 2008-02-21 DE DE102008010328A patent/DE102008010328A1/de not_active Withdrawn
- 2008-03-05 FR FR0851445A patent/FR2916083B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE102008010328A1 (de) | 2008-11-20 |
US7625789B2 (en) | 2009-12-01 |
FR2916083A1 (fr) | 2008-11-14 |
US20080280400A1 (en) | 2008-11-13 |
JP5320689B2 (ja) | 2013-10-23 |
JP2008282997A (ja) | 2008-11-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 8 |
|
ST | Notification of lapse |
Effective date: 20161130 |