FR2898906B1 - CHEMICAL MECANO POLISHING COMPOSITION INCLUDING ALKYLXANTHATE, PROCESS FOR PREPARATION AND USE - Google Patents
CHEMICAL MECANO POLISHING COMPOSITION INCLUDING ALKYLXANTHATE, PROCESS FOR PREPARATION AND USEInfo
- Publication number
- FR2898906B1 FR2898906B1 FR0602464A FR0602464A FR2898906B1 FR 2898906 B1 FR2898906 B1 FR 2898906B1 FR 0602464 A FR0602464 A FR 0602464A FR 0602464 A FR0602464 A FR 0602464A FR 2898906 B1 FR2898906 B1 FR 2898906B1
- Authority
- FR
- France
- Prior art keywords
- mecano
- alkylxanthate
- chemical
- preparation
- polishing composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title 1
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/7684—Smoothing; Planarisation
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0602464A FR2898906B1 (en) | 2006-03-21 | 2006-03-21 | CHEMICAL MECANO POLISHING COMPOSITION INCLUDING ALKYLXANTHATE, PROCESS FOR PREPARATION AND USE |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0602464A FR2898906B1 (en) | 2006-03-21 | 2006-03-21 | CHEMICAL MECANO POLISHING COMPOSITION INCLUDING ALKYLXANTHATE, PROCESS FOR PREPARATION AND USE |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2898906A1 FR2898906A1 (en) | 2007-09-28 |
FR2898906B1 true FR2898906B1 (en) | 2008-05-16 |
Family
ID=37441394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0602464A Expired - Fee Related FR2898906B1 (en) | 2006-03-21 | 2006-03-21 | CHEMICAL MECANO POLISHING COMPOSITION INCLUDING ALKYLXANTHATE, PROCESS FOR PREPARATION AND USE |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2898906B1 (en) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4944836A (en) * | 1985-10-28 | 1990-07-31 | International Business Machines Corporation | Chem-mech polishing method for producing coplanar metal/insulator films on a substrate |
US6136714A (en) * | 1998-12-17 | 2000-10-24 | Siemens Aktiengesellschaft | Methods for enhancing the metal removal rate during the chemical-mechanical polishing process of a semiconductor |
US6630433B2 (en) * | 1999-07-19 | 2003-10-07 | Honeywell International Inc. | Composition for chemical mechanical planarization of copper, tantalum and tantalum nitride |
US6153935A (en) * | 1999-09-30 | 2000-11-28 | International Business Machines Corporation | Dual etch stop/diffusion barrier for damascene interconnects |
US6355075B1 (en) * | 2000-02-11 | 2002-03-12 | Fujimi Incorporated | Polishing composition |
JP3456466B2 (en) * | 2000-04-27 | 2003-10-14 | 三菱住友シリコン株式会社 | Polishing agent for silicon wafer and polishing method therefor |
-
2006
- 2006-03-21 FR FR0602464A patent/FR2898906B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2898906A1 (en) | 2007-09-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB2426008B (en) | Treatment process for concrete | |
GB0619941D0 (en) | Chemical process | |
PT2120604E (en) | Method for fractionating oat, products thus obtained, and use thereof | |
HK1136523A1 (en) | Reactor for performing biochemical processes | |
NL1036290A1 (en) | Lithographic apparatus. | |
GB0619942D0 (en) | Chemical process | |
GB0720891D0 (en) | Chemical process | |
EG25323A (en) | Processes and apparatus for making detergent rangealkylbenzenes using transalkylation. | |
FR2966823B1 (en) | CA-POLY-TYPE GEOPOLYMER CEMENT (FERRO-SIALATE) AND PROCESS FOR OBTAINING SAME | |
DK1943240T3 (en) | Chemical Process | |
CL2007002727A1 (en) | ANASTROZOL PREPARATION PROCESS; AND INTERMEDIATE COMPOUNDS. | |
DE112006001407A5 (en) | New fermentation process | |
GB2471802B (en) | Chemical process | |
ZA200706067B (en) | Production process for NSAID-containing lozenges, their compositions, their medicinal use | |
FR2890658B1 (en) | CHEMICAL MECANO POLISHING COMPOSITION, PROCESS FOR PREPARATION AND USE | |
PT1849360E (en) | New use for 2-hydroxy-4-methylthiobutanoic acid (hmtb) | |
FR2898906B1 (en) | CHEMICAL MECANO POLISHING COMPOSITION INCLUDING ALKYLXANTHATE, PROCESS FOR PREPARATION AND USE | |
FR2915482B1 (en) | PROCESS FOR THE PREPARATION OF 2- (N-BUTYL) -5-NITROBENZOFURANE | |
GB0521302D0 (en) | Apparatus for laboratory ware | |
FR2872823B1 (en) | CHEMICAL MECANO POLISHING COMPOSITION, PROCESS FOR PREPARATION, AND USE | |
RU68177U8 (en) | REACTOR (OPTIONS) | |
HU3595U (en) | Biological sewage purifying apparatus | |
HUP0700440A2 (en) | Chemical process | |
GB0618832D0 (en) | Chemical process | |
GB201017988D0 (en) | Chemical process |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 10 |
|
ST | Notification of lapse |
Effective date: 20161130 |