FR2895567B1 - Microcomposant comportant deux plaquettes interconnectees par des picots et procede d'interconnexion associe - Google Patents
Microcomposant comportant deux plaquettes interconnectees par des picots et procede d'interconnexion associeInfo
- Publication number
- FR2895567B1 FR2895567B1 FR0513197A FR0513197A FR2895567B1 FR 2895567 B1 FR2895567 B1 FR 2895567B1 FR 0513197 A FR0513197 A FR 0513197A FR 0513197 A FR0513197 A FR 0513197A FR 2895567 B1 FR2895567 B1 FR 2895567B1
- Authority
- FR
- France
- Prior art keywords
- picots
- micro component
- interconnection method
- plates interconnected
- associated interconnection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H—ELECTRICITY
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0513197A FR2895567B1 (fr) | 2005-12-22 | 2005-12-22 | Microcomposant comportant deux plaquettes interconnectees par des picots et procede d'interconnexion associe |
EP06831789A EP1964173A1 (fr) | 2005-12-22 | 2006-12-19 | Microcomposant comprenant deux tranches interconnectees par des broches et procede associe d'interconnexion |
PCT/IB2006/003741 WO2007072202A1 (fr) | 2005-12-22 | 2006-12-19 | Microcomposant comprenant deux tranches interconnectees par des broches et procede associe d'interconnexion |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0513197A FR2895567B1 (fr) | 2005-12-22 | 2005-12-22 | Microcomposant comportant deux plaquettes interconnectees par des picots et procede d'interconnexion associe |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2895567A1 FR2895567A1 (fr) | 2007-06-29 |
FR2895567B1 true FR2895567B1 (fr) | 2008-07-11 |
Family
ID=36609517
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0513197A Expired - Fee Related FR2895567B1 (fr) | 2005-12-22 | 2005-12-22 | Microcomposant comportant deux plaquettes interconnectees par des picots et procede d'interconnexion associe |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1964173A1 (fr) |
FR (1) | FR2895567B1 (fr) |
WO (1) | WO2007072202A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2932004B1 (fr) * | 2008-06-03 | 2011-08-05 | Commissariat Energie Atomique | Dispositif electronique empile et procede de realisation d'un tel dispositif electronique |
DE102009013826A1 (de) * | 2009-03-18 | 2011-03-10 | Michalk, Manfred, Dr. | Schaltungsanordnung, Verfahren zum elektrischen und/oder mechanischen Verbinden und Vorrichtung zum Aufbringen von Verbindungselementen |
US10137789B2 (en) * | 2016-07-20 | 2018-11-27 | Ford Global Technologies, Llc | Signal pin arrangement for multi-device power module |
WO2018145968A1 (fr) * | 2017-02-09 | 2018-08-16 | Siemens Aktiengesellschaft | Module de puissance |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5411400A (en) * | 1992-09-28 | 1995-05-02 | Motorola, Inc. | Interconnect system for a semiconductor chip and a substrate |
US6130148A (en) * | 1997-12-12 | 2000-10-10 | Farnworth; Warren M. | Interconnect for semiconductor components and method of fabrication |
JP2001007473A (ja) * | 1999-06-17 | 2001-01-12 | Nec Corp | 集積回路素子の実装構造および方法 |
US6297063B1 (en) * | 1999-10-25 | 2001-10-02 | Agere Systems Guardian Corp. | In-situ nano-interconnected circuit devices and method for making the same |
-
2005
- 2005-12-22 FR FR0513197A patent/FR2895567B1/fr not_active Expired - Fee Related
-
2006
- 2006-12-19 EP EP06831789A patent/EP1964173A1/fr not_active Withdrawn
- 2006-12-19 WO PCT/IB2006/003741 patent/WO2007072202A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
FR2895567A1 (fr) | 2007-06-29 |
EP1964173A1 (fr) | 2008-09-03 |
WO2007072202A1 (fr) | 2007-06-28 |
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