FR2877142B1 - Procede de transfert d'au moins un objet de taille micrometrique ou millimetrique au moyen d'une poignee en polymere. - Google Patents
Procede de transfert d'au moins un objet de taille micrometrique ou millimetrique au moyen d'une poignee en polymere.Info
- Publication number
- FR2877142B1 FR2877142B1 FR0452393A FR0452393A FR2877142B1 FR 2877142 B1 FR2877142 B1 FR 2877142B1 FR 0452393 A FR0452393 A FR 0452393A FR 0452393 A FR0452393 A FR 0452393A FR 2877142 B1 FR2877142 B1 FR 2877142B1
- Authority
- FR
- France
- Prior art keywords
- micrometric
- transferring
- size object
- polymer handle
- millimetric size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920000642 polymer Polymers 0.000 title 1
Classifications
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Micromachines (AREA)
- Apparatus Associated With Microorganisms And Enzymes (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Die Bonding (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0452393A FR2877142B1 (fr) | 2004-10-21 | 2004-10-21 | Procede de transfert d'au moins un objet de taille micrometrique ou millimetrique au moyen d'une poignee en polymere. |
EP05815527A EP1803152A2 (fr) | 2004-10-21 | 2005-10-18 | Procede de transfert d'au moins un objet de taille micrometrique ou millimetrique au moyen d'une poignee en polymere |
PCT/FR2005/050863 WO2006043000A2 (fr) | 2004-10-21 | 2005-10-18 | Procede de transfert d'au moins un objet de taille micrometrique ou millimetrique au moyen d'une poignee en polymere |
US11/576,136 US20080020547A1 (en) | 2004-10-21 | 2005-10-18 | Method Of Transferring At Least One Object Of Micrometric Or Millimetric Size By Means Of A Polymer Handle |
JP2007537349A JP2008517474A (ja) | 2004-10-21 | 2005-10-18 | ポリマーハンドルを用いてマイクロメートル級またはミリメートル級のサイズの少なくとも1つの対象物を運搬するための方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0452393A FR2877142B1 (fr) | 2004-10-21 | 2004-10-21 | Procede de transfert d'au moins un objet de taille micrometrique ou millimetrique au moyen d'une poignee en polymere. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2877142A1 FR2877142A1 (fr) | 2006-04-28 |
FR2877142B1 true FR2877142B1 (fr) | 2007-05-11 |
Family
ID=34949788
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0452393A Expired - Fee Related FR2877142B1 (fr) | 2004-10-21 | 2004-10-21 | Procede de transfert d'au moins un objet de taille micrometrique ou millimetrique au moyen d'une poignee en polymere. |
Country Status (5)
Country | Link |
---|---|
US (1) | US20080020547A1 (fr) |
EP (1) | EP1803152A2 (fr) |
JP (1) | JP2008517474A (fr) |
FR (1) | FR2877142B1 (fr) |
WO (1) | WO2006043000A2 (fr) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2773261B1 (fr) | 1997-12-30 | 2000-01-28 | Commissariat Energie Atomique | Procede pour le transfert d'un film mince comportant une etape de creation d'inclusions |
EP1891479B1 (fr) * | 2005-05-10 | 2014-04-09 | Dow Corning Corporation | Lithographie par transfert de décalcomanies submicroniques |
US8030132B2 (en) * | 2005-05-31 | 2011-10-04 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device including peeling step |
FR2925221B1 (fr) * | 2007-12-17 | 2010-02-19 | Commissariat Energie Atomique | Procede de transfert d'une couche mince |
FR2947098A1 (fr) * | 2009-06-18 | 2010-12-24 | Commissariat Energie Atomique | Procede de transfert d'une couche mince sur un substrat cible ayant un coefficient de dilatation thermique different de celui de la couche mince |
FR2975985B1 (fr) * | 2011-05-30 | 2016-02-12 | Univ Paris Sud 11 | Procede pour la realisation de supports fonctionnels souples. |
FR2993096B1 (fr) | 2012-07-03 | 2015-03-27 | Commissariat Energie Atomique | Dispositif et procede de support individuel de composants |
DE102014014422A1 (de) | 2014-09-29 | 2016-03-31 | Siltectra Gmbh | Kombiniertes Waferherstellungsverfahren mit einer Löcher aufweisenden Aufnahmeschicht |
KR101723436B1 (ko) * | 2015-01-13 | 2017-04-05 | 엘지전자 주식회사 | 반도체 발광소자를 이용한 디스플레이 장치의 제조방법 |
WO2018128471A1 (fr) * | 2017-01-05 | 2018-07-12 | 엘지이노텍 주식회사 | Procédé de fabrication de dispositif d'affichage |
US20190186041A1 (en) | 2017-12-20 | 2019-06-20 | International Business Machines Corporation | Three-dimensionally stretchable single crystalline semiconductor membrane |
KR102113200B1 (ko) | 2017-12-22 | 2020-06-03 | 엘씨스퀘어(주) | 변형필름을 이용한 전사방법 |
CN108376838A (zh) * | 2018-04-11 | 2018-08-07 | 中北大学 | 基于pdms封装技术的微流体超材料结构 |
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GB1335201A (en) * | 1970-05-21 | 1973-10-24 | Lucas Industries Ltd | Method of manufacturing semi-conductor devices |
JPS5617029A (en) * | 1979-07-20 | 1981-02-18 | Toshiba Corp | Installation of semiconductor pellet |
JPS5752143A (en) * | 1980-09-16 | 1982-03-27 | Toshiba Corp | Mounting method and device for semiconductor pellet |
JPS6063940A (ja) * | 1984-07-26 | 1985-04-12 | Sanken Electric Co Ltd | 半導体ペレツトのダイボンデイング方法 |
DE68925922T2 (de) * | 1988-05-30 | 1996-09-05 | Canon Kk | Elektrischer Schaltungsapparat |
JPH0346242A (ja) * | 1989-07-13 | 1991-02-27 | Fujitsu Ltd | 半導体装置の製造方法 |
US6500694B1 (en) * | 2000-03-22 | 2002-12-31 | Ziptronix, Inc. | Three dimensional device integration method and integrated device |
US6214733B1 (en) * | 1999-11-17 | 2001-04-10 | Elo Technologies, Inc. | Process for lift off and handling of thin film materials |
JP4675451B2 (ja) * | 2000-04-14 | 2011-04-20 | 株式会社ディスコ | 切削装置 |
FR2823012B1 (fr) * | 2001-04-03 | 2004-05-21 | Commissariat Energie Atomique | Procede de transfert selectif d'au moins un element d'un support initial sur un support final |
JP4669162B2 (ja) * | 2001-06-28 | 2011-04-13 | 株式会社ディスコ | 半導体ウェーハの分割システム及び分割方法 |
DE10158563C1 (de) * | 2001-11-29 | 2003-07-17 | Infineon Technologies Ag | Verfahren zur Herstellung eines Bauelementmoduls |
JP4211256B2 (ja) * | 2001-12-28 | 2009-01-21 | セイコーエプソン株式会社 | 半導体集積回路、半導体集積回路の製造方法、電気光学装置、電子機器 |
US6709953B2 (en) * | 2002-01-31 | 2004-03-23 | Infineon Technologies Ag | Method of applying a bottom surface protective coating to a wafer, and wafer dicing method |
FR2837620B1 (fr) * | 2002-03-25 | 2005-04-29 | Commissariat Energie Atomique | Procede de transfert d'elements de substrat a substrat |
US6805809B2 (en) * | 2002-08-28 | 2004-10-19 | Board Of Trustees Of University Of Illinois | Decal transfer microfabrication |
JP2004126153A (ja) * | 2002-10-01 | 2004-04-22 | Seiko Epson Corp | フラットパネルディスプレイおよび電子機器 |
WO2004077551A1 (fr) * | 2003-02-24 | 2004-09-10 | Infineon Technologies Ag | Procede ameliore et appareil de positionnement de circuits integres sur des languettes de connexion |
JP4794810B2 (ja) * | 2003-03-20 | 2011-10-19 | シャープ株式会社 | 半導体装置の製造方法 |
-
2004
- 2004-10-21 FR FR0452393A patent/FR2877142B1/fr not_active Expired - Fee Related
-
2005
- 2005-10-18 JP JP2007537349A patent/JP2008517474A/ja not_active Ceased
- 2005-10-18 US US11/576,136 patent/US20080020547A1/en not_active Abandoned
- 2005-10-18 WO PCT/FR2005/050863 patent/WO2006043000A2/fr active Application Filing
- 2005-10-18 EP EP05815527A patent/EP1803152A2/fr not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
JP2008517474A (ja) | 2008-05-22 |
US20080020547A1 (en) | 2008-01-24 |
FR2877142A1 (fr) | 2006-04-28 |
EP1803152A2 (fr) | 2007-07-04 |
WO2006043000A3 (fr) | 2006-12-21 |
WO2006043000A2 (fr) | 2006-04-27 |
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