FR2875334B1 - Procede de fabrication d'un transistor realise en couches minces - Google Patents

Procede de fabrication d'un transistor realise en couches minces

Info

Publication number
FR2875334B1
FR2875334B1 FR0409637A FR0409637A FR2875334B1 FR 2875334 B1 FR2875334 B1 FR 2875334B1 FR 0409637 A FR0409637 A FR 0409637A FR 0409637 A FR0409637 A FR 0409637A FR 2875334 B1 FR2875334 B1 FR 2875334B1
Authority
FR
France
Prior art keywords
manufacturing
thin film
film transistor
transistor
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0409637A
Other languages
English (en)
Other versions
FR2875334A1 (fr
Inventor
Maud Vinet
Pascal Besson
Bernard Previtali
Christian Vizioz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA, STMicroelectronics SA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR0409637A priority Critical patent/FR2875334B1/fr
Priority to US11/223,089 priority patent/US7491644B2/en
Publication of FR2875334A1 publication Critical patent/FR2875334A1/fr
Application granted granted Critical
Publication of FR2875334B1 publication Critical patent/FR2875334B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742Thin film unipolar transistors
    • H01L29/66772Monocristalline silicon transistors on insulating substrates, e.g. quartz substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/49Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
    • H01L29/4908Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
FR0409637A 2004-09-10 2004-09-10 Procede de fabrication d'un transistor realise en couches minces Expired - Fee Related FR2875334B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR0409637A FR2875334B1 (fr) 2004-09-10 2004-09-10 Procede de fabrication d'un transistor realise en couches minces
US11/223,089 US7491644B2 (en) 2004-09-10 2005-09-09 Manufacturing process for a transistor made of thin layers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0409637A FR2875334B1 (fr) 2004-09-10 2004-09-10 Procede de fabrication d'un transistor realise en couches minces

Publications (2)

Publication Number Publication Date
FR2875334A1 FR2875334A1 (fr) 2006-03-17
FR2875334B1 true FR2875334B1 (fr) 2007-02-23

Family

ID=34949630

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0409637A Expired - Fee Related FR2875334B1 (fr) 2004-09-10 2004-09-10 Procede de fabrication d'un transistor realise en couches minces

Country Status (1)

Country Link
FR (1) FR2875334B1 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61129872A (ja) * 1984-11-29 1986-06-17 Fujitsu Ltd 半導体装置の製造方法
EP0575280A3 (en) * 1992-06-18 1995-10-04 Ibm Cmos transistor with two-layer inverse-t tungsten gate structure
JP3326644B2 (ja) * 1993-11-16 2002-09-24 ソニー株式会社 シリコン系材料層の加工方法
US6261934B1 (en) * 1998-03-31 2001-07-17 Texas Instruments Incorporated Dry etch process for small-geometry metal gates over thin gate dielectric

Also Published As

Publication number Publication date
FR2875334A1 (fr) 2006-03-17

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