FR2873887B1 - Procede de fabrication de composants electroniques realises en ceramique et recouverts d'une couche de verre et composition de masquage pour la mise en oeuvre dudit procede - Google Patents

Procede de fabrication de composants electroniques realises en ceramique et recouverts d'une couche de verre et composition de masquage pour la mise en oeuvre dudit procede

Info

Publication number
FR2873887B1
FR2873887B1 FR0408515A FR0408515A FR2873887B1 FR 2873887 B1 FR2873887 B1 FR 2873887B1 FR 0408515 A FR0408515 A FR 0408515A FR 0408515 A FR0408515 A FR 0408515A FR 2873887 B1 FR2873887 B1 FR 2873887B1
Authority
FR
France
Prior art keywords
ceramic
covered
carrying
electronic components
glass layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR0408515A
Other languages
English (en)
Other versions
FR2873887A1 (fr
Inventor
Roland Wittmann
Alain Beauger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TPC
Original Assignee
TPC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TPC filed Critical TPC
Priority to FR0408515A priority Critical patent/FR2873887B1/fr
Priority to PCT/FR2005/001997 priority patent/WO2006024766A1/fr
Publication of FR2873887A1 publication Critical patent/FR2873887A1/fr
Priority to FR1552647A priority patent/FR3019183B1/fr
Application granted granted Critical
Publication of FR2873887B1 publication Critical patent/FR2873887B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/5022—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials with vitreous materials
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/86—Glazes; Cold glazes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/008—Temporary coatings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/003—Apparatus or processes for encapsulating capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/006—Apparatus or processes for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/12—Protection against corrosion
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Glass Compositions (AREA)
  • Thermistors And Varistors (AREA)
FR0408515A 2004-08-02 2004-08-02 Procede de fabrication de composants electroniques realises en ceramique et recouverts d'une couche de verre et composition de masquage pour la mise en oeuvre dudit procede Expired - Lifetime FR2873887B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR0408515A FR2873887B1 (fr) 2004-08-02 2004-08-02 Procede de fabrication de composants electroniques realises en ceramique et recouverts d'une couche de verre et composition de masquage pour la mise en oeuvre dudit procede
PCT/FR2005/001997 WO2006024766A1 (fr) 2004-08-02 2005-07-29 Procede de fabrication de composants electroniques realises en ceramique et recouverts d’une couche de verre
FR1552647A FR3019183B1 (fr) 2004-08-02 2015-03-30 Procede de fabrication de composants electroniques realises en ceramique et recouverts d'une couche de verre et composition de masquage pour la mise en oeuvre dudit procede

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0408515A FR2873887B1 (fr) 2004-08-02 2004-08-02 Procede de fabrication de composants electroniques realises en ceramique et recouverts d'une couche de verre et composition de masquage pour la mise en oeuvre dudit procede

Publications (2)

Publication Number Publication Date
FR2873887A1 FR2873887A1 (fr) 2006-02-03
FR2873887B1 true FR2873887B1 (fr) 2015-07-24

Family

ID=34949834

Family Applications (2)

Application Number Title Priority Date Filing Date
FR0408515A Expired - Lifetime FR2873887B1 (fr) 2004-08-02 2004-08-02 Procede de fabrication de composants electroniques realises en ceramique et recouverts d'une couche de verre et composition de masquage pour la mise en oeuvre dudit procede
FR1552647A Active FR3019183B1 (fr) 2004-08-02 2015-03-30 Procede de fabrication de composants electroniques realises en ceramique et recouverts d'une couche de verre et composition de masquage pour la mise en oeuvre dudit procede

Family Applications After (1)

Application Number Title Priority Date Filing Date
FR1552647A Active FR3019183B1 (fr) 2004-08-02 2015-03-30 Procede de fabrication de composants electroniques realises en ceramique et recouverts d'une couche de verre et composition de masquage pour la mise en oeuvre dudit procede

Country Status (2)

Country Link
FR (2) FR2873887B1 (fr)
WO (1) WO2006024766A1 (fr)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3773704A (en) * 1971-11-08 1973-11-20 Tektronix Inc Water soluble protective coating
US4632846A (en) * 1984-09-17 1986-12-30 Kyocera Corporation Process for preparation of glazed ceramic substrate and glazing composition used therefor
US4561954A (en) * 1985-01-22 1985-12-31 Avx Corporation Method of applying terminations to ceramic bodies
US4741077A (en) * 1987-05-15 1988-05-03 Sfe Technologies End terminations for capacitors
US4940608A (en) * 1988-11-07 1990-07-10 Okuno Chemical Industry Co., Ltd. Local electroless plating process for plastics
JPH06151109A (ja) * 1992-10-30 1994-05-31 Rohm Co Ltd 面実装用ｎｔｃサーミスタ
JP3082575B2 (ja) * 1994-07-05 2000-08-28 株式会社村田製作所 セラミック電子部品の製造方法
JPH0982504A (ja) * 1995-09-11 1997-03-28 Mitsubishi Materials Corp チップ型サーミスタ及びその製造方法
JP2001126946A (ja) * 1999-10-28 2001-05-11 Murata Mfg Co Ltd 積層セラミック電子部品及びその製造方法
KR100476158B1 (ko) * 2000-12-11 2005-03-15 주식회사 아모텍 글래스 코팅막을 갖는 세라믹 칩 소자 및 그의 제조방법
JP2015151333A (ja) * 2014-02-10 2015-08-24 株式会社ウイングターフ 多孔質セラミック表面コーティング粒子の製造方法、ならびに、それを利用した複合材料及び絶縁材の製造方法

Also Published As

Publication number Publication date
FR3019183A1 (fr) 2015-10-02
WO2006024766A1 (fr) 2006-03-09
FR2873887A1 (fr) 2006-02-03
FR3019183B1 (fr) 2017-08-11

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