FR2871022A1 - Electrical and electronic circuits e.g. power circuit, containing case, has heat shield selectively received between power and control circuits, and closing unit formed of cover and resin layer and selectively received between circuits - Google Patents

Electrical and electronic circuits e.g. power circuit, containing case, has heat shield selectively received between power and control circuits, and closing unit formed of cover and resin layer and selectively received between circuits Download PDF

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Publication number
FR2871022A1
FR2871022A1 FR0405625A FR0405625A FR2871022A1 FR 2871022 A1 FR2871022 A1 FR 2871022A1 FR 0405625 A FR0405625 A FR 0405625A FR 0405625 A FR0405625 A FR 0405625A FR 2871022 A1 FR2871022 A1 FR 2871022A1
Authority
FR
France
Prior art keywords
circuits
circuit
selectively received
heat shield
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR0405625A
Other languages
French (fr)
Other versions
FR2871022B1 (en
Inventor
Jean Lexuan
Stephane Tingaud
Eric Bourseau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leoni Wiring Systems France SAS
Original Assignee
Valeo Electronique et Systemes de Liaison SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Electronique et Systemes de Liaison SA filed Critical Valeo Electronique et Systemes de Liaison SA
Priority to FR0405625A priority Critical patent/FR2871022B1/en
Publication of FR2871022A1 publication Critical patent/FR2871022A1/en
Application granted granted Critical
Publication of FR2871022B1 publication Critical patent/FR2871022B1/en
Anticipated expiration legal-status Critical
Active legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
    • B60R16/0239—Electronic boxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/062—Means for thermal insulation, e.g. for protection of parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly

Abstract

The case has a heat shield (14) which is selectively received between a power circuit (2) and a control circuit (3). A closing unit is constituted by a cover (20) and a resin layer (5) and is selectively received between the circuits. The heat shield insulates the circuit (2) from the circuit (3) so that the heat emitted by electronic components of the circuit (2) is not transmitted to the circuit (3).

Description

La présente invention se rapporte à un boîtier pour circuits électroniquesThe present invention relates to a housing for electronic circuits

ou électriques.or electric.

L'invention, vise plus particulièrement, des bol.- tiers destinés à contenir, au moins, deux circuits électroniques, un circuit de puissance dans lequel au moins l'un des composants dégage de la chaleur et un circuit de commande.  The invention relates more particularly to third-party bolts intended to contain, at least, two electronic circuits, a power circuit in which at least one of the components releases heat and a control circuit.

De tels boîtiers sont destinés à être utilisés suivant des positions de montage variées entraînant des protections variables.  Such housings are intended to be used in various mounting positions resulting in variable protections.

L'un des buts de l'invention est de réaliser un 15 boîtier pouvant s'adapter aux différents cas qui peuvent se présenter.  One of the aims of the invention is to provide a housing that can adapt to different cases that may arise.

Le boîtier, selon l'invention, est destiné à contenir des circuits électriques et électroniques et du type constitué d'un corps avec un fond et un bord latéral et agencé pour recevoir au moins deux circuits empilés l'un sur l'autre, un des deux circuits comportant des composants électroniques émettant de la chaleur et est caractérisé en ce qu'il est agencé pour recevoir sélectivement entre les deux circuits un écran thermique et, sélectivement, un organe de fermeture constitué par un couvercle et/ou une nappe de résine.  The housing, according to the invention, is intended to contain electrical and electronic circuits and of the type consisting of a body with a bottom and a side edge and arranged to receive at least two circuits stacked one on the other, a two circuits comprising electronic components emitting heat and is characterized in that it is arranged to receive selectively between the two circuits a heat shield and, selectively, a closure member constituted by a cover and / or a resin sheet .

Ainsi, on peut, suivant les cas, insérer l'écran 30 thermique et obturer le boîtier soit par un couvercle, soit par une nappe de résine, soit par les deux.  Thus, it is possible, depending on the case, to insert the heat shield and to close the housing either with a lid, or with a resin sheet, or with both.

De préférence, le circuit comporte des composants électroniques émettant de la chaleur et disposé au voisinage du fond du boîtier, ce dernier comportant, sur son fond, au droit des composants électroniques dégageant de la chaleur, une épaisseur de résine facilitant un échange thermique avec l'extérieur.  Preferably, the circuit comprises electronic components emitting heat and disposed in the vicinity of the bottom of the housing, the latter comprising, on its bottom, to the right of the electronic components releasing heat, a resin thickness facilitating a heat exchange with the 'outside.

Suivant une caractéristique de détail, le boîtier comporte, sur son fond, des pions pour supporter et centrer 10 le circuit correspondant.  According to a detail characteristic, the housing comprises, on its bottom, pins for supporting and centering the corresponding circuit.

Suivant une caractéristique constructive, le boîtier comporte, sur son fond, des piliers pour supporter le circuit supérieur et centrer celui-ci.  According to a constructive characteristic, the housing comprises, on its bottom, pillars to support the upper circuit and center it.

De préférence, l'écran thermique comporte un re-bord périphérique en saillie sur ses deux faces et dont l'un des bords est destiné à reposer sur le circuit inférieur, tandis que l'autre bord est destiné à porter contre la face inférieure du circuit supérieur. Ainsi, le circuit de puissance est parfaitement isolé du circuit de commande.  Preferably, the heat shield has a peripheral rear edge projecting on its two faces and one of whose edges is intended to rest on the lower circuit, while the other edge is intended to bear against the underside of the upper circuit. Thus, the power circuit is perfectly isolated from the control circuit.

Enfin, le boîtier peut comporter, au moins, une 25 ouverture dans laquelle s'étend une membrane permettant d'évacuer l'humidité interne.  Finally, the housing may comprise, at least, an opening in which extends a membrane for evacuating the internal moisture.

L'invention va maintenant être décrite avec plus de détails en se référant à des modes de réalisation parti- culiers donnés à titre d'exemple seulement et représentés au dessins annexés.  The invention will now be described in more detail with reference to particular embodiments given by way of example only and shown in the accompanying drawings.

Figure 1 est une vue en perspective éclatée d'un boîtier, selon l'invention.  Figure 1 is an exploded perspective view of a housing according to the invention.

Figure 2 est une vue en coupe du boîtier.  Figure 2 is a sectional view of the housing.

Figure 3 est également une vue en coupe du boîtier, sans le couvercle, mais avec une nappe de résine.  Figure 3 is also a sectional view of the housing, without the cover, but with a sheet of resin.

Figure 4 est une vue en coupe du boîtier avec la 10 nappe de résine et le couvercle.  Figure 4 is a sectional view of the housing with the resin web and cover.

Le boîtier 1 représenté aux figures est destiné à recevoir plusieurs cartes électroniques, par exemple, un circuit de puissance 2 et un circuit de commande 3.  The housing 1 shown in the figures is intended to receive several electronic boards, for example a power circuit 2 and a control circuit 3.

Le fond 4 du boîtier 1 comporte, aux endroits correspondant aux composants du circuit qui dégagent de la chaleur, une épaisseur 5 d'une résine facilitant un échange thermique avec l'extérieur.  The bottom 4 of the housing 1 comprises, at the locations corresponding to the components of the circuit which give off heat, a thickness of a resin facilitating a heat exchange with the outside.

A partir du fond 4 du boîtier s'érigent des pions 7 permettant de supporter et de centrer le circuit 2.  From the bottom 4 of the housing there are pins 7 for supporting and centering the circuit 2.

Le fond 4 comporte, également, des piliers 8 des- tinés à traverser le circuit 2 et à supporter et centrer le circuit 3, les piliers présentant un épaulement 9 contre lequel porte la surface inférieure du circuit 3, et, à partir desquels s'érigent des tétons 10 de plus petit diamètre traversant des trous correspondants dudit circuit 3 et destiné à être déformés par exemple par boutrollage à chaud pour présenter une tête 11 s'étendant sur la surface supérieure du circuit 3 pour assurer sa fixation.  The bottom 4 also comprises pillars 8 intended to pass through the circuit 2 and to support and center the circuit 3, the pillars having a shoulder 9 against which the lower surface of the circuit 3 bears, and from which erect nipples 10 of smaller diameter passing through corresponding holes of said circuit 3 and intended to be deformed for example by hot slugging to have a head 11 extending on the upper surface of the circuit 3 to ensure its fixation.

Entre le circuit 2 et le circuit 3, on peut insérer un écran thermique 14 destiné à isoler le circuit 2 du circuit 3 afin que la chaleur émise par les composants du circuit 2 ne soit pas transmise au circuit 3.  Between the circuit 2 and the circuit 3, it is possible to insert a heat shield 14 intended to isolate the circuit 2 of the circuit 3 so that the heat emitted by the components of the circuit 2 is not transmitted to the circuit 3.

L'écran thermique 14 est constitué par une plaque présentant des ouvertures 15 pour le passage d'éléments de connexion 16 s'érigeant à la surface du circuit 2. 10 L'écran thermique 14 est solidaire d'un rebord périphérique 17 qui fait saillie du côté des deux faces dudit écran 14 de manière, d'une part, à assurer un certain isolement du circuit 2, et, d'autre part, à constituer avec les épaulements 9, une assise pour le circuit 3.  The heat shield 14 is constituted by a plate having openings 15 for the passage of connecting elements 16 which are erected on the surface of the circuit 2. The heat shield 14 is integral with a peripheral rim 17 which protrudes on the side of the two faces of said screen 14 so as, on the one hand, to ensure a certain isolation of the circuit 2, and, on the other hand, to form with the shoulders 9, a seat for the circuit 3.

Le circuit 3 comporte différents composants électroniques et de connexion 18 et est percé d'ouvertures 19 pour le passage des éléments de connexion 16.  The circuit 3 comprises various electronic and connection components 18 and is pierced with openings 19 for the passage of the connection elements 16.

Le boîtier 1 peut être fermé par un simple couvercle 20 emboîté dans le boîtier 1 et présentant un bord 21 destiné à coopérer avec la surface interne du bord libre dudit boîtier qui est amincie et reliée audit bord par un épaulement 22 qui est destiné à supporter le circuit 3.  The housing 1 can be closed by a simple cover 20 fitted in the housing 1 and having an edge 21 intended to cooperate with the internal surface of the free edge of said housing which is thinned and connected to said edge by a shoulder 22 which is intended to support the circuit 3.

Le bord du couvercle 21 comporte une saillie périphérique 23 destinée à s'engager dans le boîtier 1 et à bloquer le circuit 3.  The edge of the cover 21 has a peripheral projection 23 intended to engage in the housing 1 and to block the circuit 3.

Le couvercle 20 est percé d'ouvertures 25 pour le passage des différents éléments 16 et 18. Le couvercle peut être clipsé, collé ou soudé (voir figure 1).  The lid 20 is pierced with openings 25 for the passage of the various elements 16 and 18. The lid can be clipped, glued or welded (see Figure 1).

Sous le couvercle 20, on peut couler une nappe de résine d'étanchéité 28 qui porte contre l'épaulement 22 (voir figure 4).  Under the cover 20, a sealing resin web 28 may be cast which bears against the shoulder 22 (see FIG. 4).

Dans certains cas (voir figure 3), la fermeture du boîtier 1 peut être assurée par la nappe 28, le couvercle étant supprimé.  In some cases (see Figure 3), the closure of the housing 1 can be provided by the web 28, the cover being removed.

L'une des parois latérales du boîtier 1 est percée d'une ouverture 29 dans laquelle s'étend une membrane 30 permettant d'évacuer l'humidité interne du boîtier 1, cette ouverture peut également être pratiquée dans le fond 4 du boîtier 1.  One of the side walls of the housing 1 is pierced by an opening 29 in which extends a membrane 30 for discharging the internal moisture of the housing 1, this opening can also be made in the bottom 4 of the housing 1.

Un tel boîtier permet, en fonction des impératifs d'utilisation, de moduler la fabrication.  Such a housing makes it possible, according to the requirements of use, to modulate the manufacture.

Bien entendu, l'invention n'est pas limitée aux modes de réalisation qui viennent d'être décrits et repré- sentés. On pourra y apporter de nombreuses modifications de détail sans sortir pour cela du cadre de l'invention.  Of course, the invention is not limited to the embodiments which have just been described and shown. It will be possible to make many changes in detail without departing from the scope of the invention.

Claims (6)

REVENDICATIONS 1. Boîtier destiné à contenir des circuits électriques et électroniques et du type constitué d'un corps (1) avec un fond et un bord latéral et agencé pour recevoir au moins deux circuits empilés l'un sur l'autre (2 et 3), l'un des circuits comportant des composants électroniques émettant de la chaleur, caractérisé en ce qu'il est agencé pour recevoir sélectivement entre les circuits un écran thermique (14) et, sélectivement, un organe de fermeture constitué par un couvercle (20) et/ou une nappe de résine (28).  Housing intended to contain electrical and electronic circuits and of the type consisting of a body (1) with a bottom and a lateral edge and arranged to receive at least two circuits stacked one on the other (2 and 3) , one of the circuits comprising electronic components emitting heat, characterized in that it is arranged to receive selectively between the circuits a heat shield (14) and, selectively, a closure member constituted by a lid (20) and / or a resin web (28). 2. Boîtier, selon la revendication 1, caractérisé en ce que le circuit (2) comportant des composants électroniques émettant de la chaleur est disposé au voisinage du fond (4), ce dernier au droit des composants électroniques dégageant de la chaleur comporte une épaisseur de résine (5) facilitant un échange thermique avec l'extérieur.  2. Housing according to claim 1, characterized in that the circuit (2) comprising electronic components emitting heat is disposed near the bottom (4), the latter to the right of the electronic components generating heat has a thickness resin (5) facilitating a heat exchange with the outside. 3. Boîtier, selon la revendication 1, caractérisé en ce qu'il comporte sur son fond des pions pour supporter et centrer le circuit correspondant (2).  3. Housing according to claim 1, characterized in that it comprises on its bottom pins to support and center the corresponding circuit (2). 4. Boîtier, selon la revendication 1, caractérisé en ce qu'il comporte sur son fond des piliers (8) pour sup-porter et centrer le circuit supérieur (3).  4. Housing according to claim 1, characterized in that it comprises on its bottom pillars (8) to support and center the upper circuit (3). 5. Boîtier, selon la revendication 1, caractérisé en ce que l'écran thermique (14) comporte un rebord périphérique (17) en saillie sur ses deux faces et dont l'un des bords est destiné à reposer sur le circuit inférieur (2), tandis que l'autre bord est destiné à porter contre la face inférieure du circuit supérieur (3).  5. Housing according to claim 1, characterized in that the heat shield (14) has a peripheral rim (17) projecting on its two faces and one of whose edges is intended to rest on the lower circuit (2). ), while the other edge is intended to bear against the lower face of the upper circuit (3). 6. Boîtier, selon la revendication 1, caractérisé en ce qu'il comporte au moins une ouverture (29) dans laquelle s'étend une membrane (30) permettant d'évacuer l'humidité interne.  6. Housing according to claim 1, characterized in that it comprises at least one opening (29) in which extends a membrane (30) for discharging the internal moisture. 15 20 2515 20 25
FR0405625A 2004-05-25 2004-05-25 HOUSING FOR ELECTRIC OR ELECTRONIC CIRCUITS Active FR2871022B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0405625A FR2871022B1 (en) 2004-05-25 2004-05-25 HOUSING FOR ELECTRIC OR ELECTRONIC CIRCUITS

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0405625A FR2871022B1 (en) 2004-05-25 2004-05-25 HOUSING FOR ELECTRIC OR ELECTRONIC CIRCUITS

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FR2871022A1 true FR2871022A1 (en) 2005-12-02
FR2871022B1 FR2871022B1 (en) 2006-11-03

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2914531A1 (en) * 2007-03-27 2008-10-03 Valeo Electronique Sys Liaison Control or power printed circuit board receiving case for automobile field, has auxiliary lateral wall forming shady space with main lateral wall, where extension of direction of space is higher than extension of direction of opening
EP1883285A3 (en) * 2006-07-27 2009-04-29 Deere & Company Cantilever mounted electronic module with rigid center backbone
EP2348798A3 (en) * 2006-08-31 2011-10-12 Daikin Industries, Limited Power conversion apparatus
ITTO20100565A1 (en) * 2010-06-30 2011-12-31 St Microelectronics Srl METHOD OF MANUFACTURE OF A WATERPROOFED ELECTRONIC DEVICE AND WATERPROOF ELECTRONIC DEVICE
WO2012122230A2 (en) 2011-03-09 2012-09-13 Thompson Licensing Set top box or server having snap-in heat sink and smart card reader
FR2979177A1 (en) * 2011-08-19 2013-02-22 Valeo Sys Controle Moteur Sas POWER BLOCK FOR ELECTRIC VEHICLE INVERTER
US9220185B2 (en) 2010-05-19 2015-12-22 Thomson Licensing Set-top box having dissipating thermal loads
WO2016012666A1 (en) * 2014-07-23 2016-01-28 Valeo Equipements Electriques Moteur Electrical supercharger
US9485884B2 (en) 2011-07-14 2016-11-01 Thomson Licensing Set top box having snap-in heat sink and smart card reader with a hold down for retaining the heat sink
US9578783B2 (en) 2010-02-25 2017-02-21 Thomson Licensing Miniature multilayer radiative cooling case wtih hidden quick release snaps
EP3288358A1 (en) * 2016-08-26 2018-02-28 Deere & Company Electronic inverter assembly

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1239715A2 (en) * 2001-03-07 2002-09-11 Yazaki Corporation Holding and heat dissipation structure for heat generation part
EP1239713A2 (en) * 2001-03-07 2002-09-11 Yazaki Corporation Substrate-stacking structure

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1239715A2 (en) * 2001-03-07 2002-09-11 Yazaki Corporation Holding and heat dissipation structure for heat generation part
EP1239713A2 (en) * 2001-03-07 2002-09-11 Yazaki Corporation Substrate-stacking structure

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1883285A3 (en) * 2006-07-27 2009-04-29 Deere & Company Cantilever mounted electronic module with rigid center backbone
EP2348798A3 (en) * 2006-08-31 2011-10-12 Daikin Industries, Limited Power conversion apparatus
FR2914531A1 (en) * 2007-03-27 2008-10-03 Valeo Electronique Sys Liaison Control or power printed circuit board receiving case for automobile field, has auxiliary lateral wall forming shady space with main lateral wall, where extension of direction of space is higher than extension of direction of opening
WO2008142224A2 (en) * 2007-03-27 2008-11-27 Valeo Etudes Electroniques Sealed printed circuit case
WO2008142224A3 (en) * 2007-03-27 2009-03-12 Valeo Etudes Electroniques Sealed printed circuit case
US9578783B2 (en) 2010-02-25 2017-02-21 Thomson Licensing Miniature multilayer radiative cooling case wtih hidden quick release snaps
US9220185B2 (en) 2010-05-19 2015-12-22 Thomson Licensing Set-top box having dissipating thermal loads
ITTO20100565A1 (en) * 2010-06-30 2011-12-31 St Microelectronics Srl METHOD OF MANUFACTURE OF A WATERPROOFED ELECTRONIC DEVICE AND WATERPROOF ELECTRONIC DEVICE
US20120002381A1 (en) * 2010-06-30 2012-01-05 Stmicroelectronics S.R.L. Method for manufacturing a liquid-tight electronic device, and liquid-tight electronic device
EP2684375A4 (en) * 2011-03-09 2015-08-05 Thompson Licensing Set top box or server having snap-in heat sink and smart card reader
US9392317B2 (en) 2011-03-09 2016-07-12 Thomson Licensing Set top box or server having snap-in heat sink and smart card reader
WO2012122230A2 (en) 2011-03-09 2012-09-13 Thompson Licensing Set top box or server having snap-in heat sink and smart card reader
US9485884B2 (en) 2011-07-14 2016-11-01 Thomson Licensing Set top box having snap-in heat sink and smart card reader with a hold down for retaining the heat sink
WO2013026969A1 (en) * 2011-08-19 2013-02-28 Valeo Systemes De Controle Moteur Power unit for an electric vehicle inverter, inverter and electric vehicle including said unit
FR2979177A1 (en) * 2011-08-19 2013-02-22 Valeo Sys Controle Moteur Sas POWER BLOCK FOR ELECTRIC VEHICLE INVERTER
US9648769B2 (en) 2011-08-19 2017-05-09 Valeo Systemes De Controle Moteur Power unit for electric vehicle inverter
WO2016012666A1 (en) * 2014-07-23 2016-01-28 Valeo Equipements Electriques Moteur Electrical supercharger
WO2016012688A1 (en) * 2014-07-23 2016-01-28 Valeo Equipements Electriques Moteur Electronic device of an electric supercharger
FR3024319A1 (en) * 2014-07-23 2016-01-29 Valeo Equip Electr Moteur ELECTRONIC DEVICE OF AN ELECTRICAL POWER SUPPLY COMPRESSOR
EP3288358A1 (en) * 2016-08-26 2018-02-28 Deere & Company Electronic inverter assembly
US9979320B2 (en) 2016-08-26 2018-05-22 Deere & Company Electronic inverter assembly

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