FR2861217B1 - Dispositif optique pour boitier semi-conducteur optique et procede de fabrication. - Google Patents

Dispositif optique pour boitier semi-conducteur optique et procede de fabrication.

Info

Publication number
FR2861217B1
FR2861217B1 FR0312305A FR0312305A FR2861217B1 FR 2861217 B1 FR2861217 B1 FR 2861217B1 FR 0312305 A FR0312305 A FR 0312305A FR 0312305 A FR0312305 A FR 0312305A FR 2861217 B1 FR2861217 B1 FR 2861217B1
Authority
FR
France
Prior art keywords
pastille
lens
casing
front face
annular part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0312305A
Other languages
English (en)
Other versions
FR2861217A1 (fr
Inventor
Blanc Emmanuelle Vigier
Jonathan Hurwitz
Ewan Findlay
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Priority to FR0312305A priority Critical patent/FR2861217B1/fr
Priority to US10/968,457 priority patent/US7245834B2/en
Publication of FR2861217A1 publication Critical patent/FR2861217A1/fr
Application granted granted Critical
Publication of FR2861217B1 publication Critical patent/FR2861217B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Lens Barrels (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
FR0312305A 2003-10-21 2003-10-21 Dispositif optique pour boitier semi-conducteur optique et procede de fabrication. Expired - Fee Related FR2861217B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR0312305A FR2861217B1 (fr) 2003-10-21 2003-10-21 Dispositif optique pour boitier semi-conducteur optique et procede de fabrication.
US10/968,457 US7245834B2 (en) 2003-10-21 2004-10-19 Optical device for optical semiconductor package and fabrication method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0312305A FR2861217B1 (fr) 2003-10-21 2003-10-21 Dispositif optique pour boitier semi-conducteur optique et procede de fabrication.

Publications (2)

Publication Number Publication Date
FR2861217A1 FR2861217A1 (fr) 2005-04-22
FR2861217B1 true FR2861217B1 (fr) 2006-03-17

Family

ID=34385354

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0312305A Expired - Fee Related FR2861217B1 (fr) 2003-10-21 2003-10-21 Dispositif optique pour boitier semi-conducteur optique et procede de fabrication.

Country Status (2)

Country Link
US (1) US7245834B2 (fr)
FR (1) FR2861217B1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2899384A1 (fr) * 2006-03-29 2007-10-05 St Microelectronics Sa Boitier semi-conducteur a cage coulissante
EP1870936A1 (fr) 2006-06-19 2007-12-26 STMicroelectronics (Rousset) SAS Procédé de fabrication de lentilles, notamment pour imageur intégré
EP1935609B1 (fr) * 2006-12-22 2010-03-03 Mold-Masters (2007) Limited Système de moulage par injection doté d'un bus
EP2265978A1 (fr) * 2008-03-27 2010-12-29 Tessera North America, Inc. Dispositif optique comprenant au moins une surface répliquée et procédés associés
EP2329315A4 (fr) * 2008-09-01 2012-01-18 Lensvector Inc Fabrication au niveau tranche de dispositifs optoélectroniques à cristaux liquides
US8265487B2 (en) * 2009-07-29 2012-09-11 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Half-duplex, single-fiber (S-F) optical transceiver module and method
JP6137839B2 (ja) * 2013-01-15 2017-05-31 三菱電機株式会社 受信光学系

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19508222C1 (de) * 1995-03-08 1996-06-05 Siemens Ag Optoelektronischer Wandler und Herstellverfahren
US5925898A (en) * 1996-07-18 1999-07-20 Siemens Aktiengesellschaft Optoelectronic transducer and production methods
DE19958229B4 (de) * 1998-12-09 2007-05-31 Fuji Electric Co., Ltd., Kawasaki Optisches Halbleiter-Sensorbauelement
DE10023353A1 (de) * 2000-05-12 2001-11-29 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung
WO2001091193A2 (fr) * 2000-05-23 2001-11-29 Atmel Corporation Boitier de puce a circuit integre pour de capteur d'image electronique
US7304684B2 (en) * 2000-11-14 2007-12-04 Kabushiki Kaisha Toshiba Image pickup apparatus, method of making, and electric apparatus having image pickup apparatus
TW548843B (en) * 2001-02-28 2003-08-21 Fujitsu Ltd Semiconductor device and method for making the same
US20040012698A1 (en) * 2001-03-05 2004-01-22 Yasuo Suda Image pickup model and image pickup device
FR2822326B1 (fr) * 2001-03-16 2003-07-04 Atmel Grenoble Sa Camera electronique a faible cout en technologie des circuits integres

Also Published As

Publication number Publication date
FR2861217A1 (fr) 2005-04-22
US20050141107A1 (en) 2005-06-30
US7245834B2 (en) 2007-07-17

Similar Documents

Publication Publication Date Title
CN108734073B (zh) 一种检测装置及终端设备
EP1443755B1 (fr) Dispositif de prise d'images et lentille de prise d'images
TW200618220A (en) Method of making camera module in wafer level
JP2007523568A5 (fr)
KR20140105711A (ko) 광 전자 모듈 및 이를 포함하는 장치
DE60324739D1 (de) Bildaufnahmelinseneinheit und tragbares Endgerät
JP2009124515A (ja) 撮像モジュールおよびその製造方法、電子情報機器
FR2861217B1 (fr) Dispositif optique pour boitier semi-conducteur optique et procede de fabrication.
US7894143B2 (en) Image capture lens
CN109889705B (zh) 光学影像感测模组
US7668322B2 (en) Device for detecting pressure fluctuations, display device, recording device and sound reproduction system
CN110140074B (zh) 摄像装置用透镜组件及其制造方法
JP2011120269A (ja) 撮像モジュールおよびその製造方法、電子情報機器
CN107544176A (zh) 显示装置
US20240192409A1 (en) Electronic device
WO2020093312A1 (fr) Ensemble lentille, appareil de reconnaissance d'empreintes digitales, et dispositif électronique
JP2010157971A (ja) 撮像モジュールおよびその製造方法、電子情報機器
JPS5783080A (en) Semiconductor laser module device
JP4637884B2 (ja) 光デジタイザ
TW202001319A (zh) 相機模組
TW202346960A (zh) 鏡頭組件、攝像頭模組及電子設備
KR101288281B1 (ko) 렌즈 모듈 및 그 제조방법
EP3916296A1 (fr) Composant optique, module de rétroéclairage, équipement électronique et procédé de fabrication d'un composant optique
TWI623778B (zh) Reflective optical large receiving angle ultraviolet index device
TW202427012A (zh) 用於晶圓組裝的晶片立方體相機的多元件寬視場透鏡

Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20090630