FR2859820B1 - Structure multi-zones apte a subir un recuit par irradiation lumineuse et procede de mise en oeuvre de ladite structure - Google Patents

Structure multi-zones apte a subir un recuit par irradiation lumineuse et procede de mise en oeuvre de ladite structure

Info

Publication number
FR2859820B1
FR2859820B1 FR0350562A FR0350562A FR2859820B1 FR 2859820 B1 FR2859820 B1 FR 2859820B1 FR 0350562 A FR0350562 A FR 0350562A FR 0350562 A FR0350562 A FR 0350562A FR 2859820 B1 FR2859820 B1 FR 2859820B1
Authority
FR
France
Prior art keywords
implementing
sufficiently enhanced
luminous irradiation
zone
zone structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0350562A
Other languages
English (en)
Other versions
FR2859820A1 (fr
Inventor
Bernard Andre
Jean Hue
Berangere Hyot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR0350562A priority Critical patent/FR2859820B1/fr
Priority to PCT/FR2004/050430 priority patent/WO2005027209A2/fr
Priority to US10/571,128 priority patent/US20070036994A1/en
Priority to EP04816130A priority patent/EP1665351A2/fr
Publication of FR2859820A1 publication Critical patent/FR2859820A1/fr
Application granted granted Critical
Publication of FR2859820B1 publication Critical patent/FR2859820B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/009Working by laser beam, e.g. welding, cutting or boring using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50Working by transmitting the laser beam through or within the workpiece
    • B23K26/53Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/268Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Toxicology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Recrystallisation Techniques (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
FR0350562A 2003-09-17 2003-09-17 Structure multi-zones apte a subir un recuit par irradiation lumineuse et procede de mise en oeuvre de ladite structure Expired - Fee Related FR2859820B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR0350562A FR2859820B1 (fr) 2003-09-17 2003-09-17 Structure multi-zones apte a subir un recuit par irradiation lumineuse et procede de mise en oeuvre de ladite structure
PCT/FR2004/050430 WO2005027209A2 (fr) 2003-09-17 2004-09-14 Structure multi-zones apte a subir un recuit par irradiation lumineuse et procede de mise en oeuvre de ladite structure
US10/571,128 US20070036994A1 (en) 2003-09-17 2004-09-14 Multiple zone structure capable of light radiation annealing and method using said structure
EP04816130A EP1665351A2 (fr) 2003-09-17 2004-09-14 Structure multi-zones apte a subir un recuit par irradiation lumineuse et procede de mise en oeuvre de ladite structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0350562A FR2859820B1 (fr) 2003-09-17 2003-09-17 Structure multi-zones apte a subir un recuit par irradiation lumineuse et procede de mise en oeuvre de ladite structure

Publications (2)

Publication Number Publication Date
FR2859820A1 FR2859820A1 (fr) 2005-03-18
FR2859820B1 true FR2859820B1 (fr) 2006-06-09

Family

ID=34203558

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0350562A Expired - Fee Related FR2859820B1 (fr) 2003-09-17 2003-09-17 Structure multi-zones apte a subir un recuit par irradiation lumineuse et procede de mise en oeuvre de ladite structure

Country Status (4)

Country Link
US (1) US20070036994A1 (fr)
EP (1) EP1665351A2 (fr)
FR (1) FR2859820B1 (fr)
WO (1) WO2005027209A2 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2921752B1 (fr) * 2007-10-01 2009-11-13 Aplinov Procede de chauffage d'une plaque par un flux lumineux.
US8536054B2 (en) * 2008-01-18 2013-09-17 Miasole Laser polishing of a solar cell substrate
US8546172B2 (en) 2008-01-18 2013-10-01 Miasole Laser polishing of a back contact of a solar cell
US8586398B2 (en) * 2008-01-18 2013-11-19 Miasole Sodium-incorporation in solar cell substrates and contacts
FR2938116B1 (fr) * 2008-11-04 2011-03-11 Aplinov Procede et dispositif de chauffage d'une couche d'une plaque par amorcage et flux lumineux.
US9859121B2 (en) * 2015-06-29 2018-01-02 International Business Machines Corporation Multiple nanosecond laser pulse anneal processes and resultant semiconductor structure
WO2020212736A1 (fr) * 2019-04-17 2020-10-22 Arcelormittal Procédé de fabrication d'un ensemble par soudage au laser
WO2020212737A1 (fr) * 2019-04-17 2020-10-22 Arcelormittal Procédé de fabrication d'un substrat métallique revêtu par dépôt de métal au laser

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4437139A (en) * 1982-12-17 1984-03-13 International Business Machines Corporation Laser annealed dielectric for dual dielectric capacitor
JPH073908B2 (ja) * 1987-07-16 1995-01-18 三菱電機株式会社 半導体発光装置の製造方法
JPH0241785A (ja) * 1988-08-02 1990-02-09 Toyo Seikan Kaisha Ltd レーザマーキング部材
GB9206086D0 (en) * 1992-03-20 1992-05-06 Philips Electronics Uk Ltd Manufacturing electronic devices comprising,e.g.tfts and mims
JP3108797B2 (ja) * 1992-10-26 2000-11-13 富士通株式会社 高誘電率誘電体薄膜の製造方法
US5756369A (en) * 1996-07-11 1998-05-26 Lsi Logic Corporation Rapid thermal processing using a narrowband infrared source and feedback
US6380044B1 (en) * 2000-04-12 2002-04-30 Ultratech Stepper, Inc. High-speed semiconductor transistor and selective absorption process forming same
US6635541B1 (en) * 2000-09-11 2003-10-21 Ultratech Stepper, Inc. Method for annealing using partial absorber layer exposed to radiant energy and article made with partial absorber layer

Also Published As

Publication number Publication date
WO2005027209A3 (fr) 2005-12-08
WO2005027209A2 (fr) 2005-03-24
FR2859820A1 (fr) 2005-03-18
US20070036994A1 (en) 2007-02-15
EP1665351A2 (fr) 2006-06-07

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20080531

D3 Ip right revived
ST Notification of lapse

Effective date: 20130531