FR2838817B1 - Caloduc - Google Patents

Caloduc

Info

Publication number
FR2838817B1
FR2838817B1 FR0212087A FR0212087A FR2838817B1 FR 2838817 B1 FR2838817 B1 FR 2838817B1 FR 0212087 A FR0212087 A FR 0212087A FR 0212087 A FR0212087 A FR 0212087A FR 2838817 B1 FR2838817 B1 FR 2838817B1
Authority
FR
France
Prior art keywords
heat pipe
pipe
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR0212087A
Other languages
English (en)
Other versions
FR2838817A1 (fr
Inventor
Takashi Kobayashi
Takehide Nomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of FR2838817A1 publication Critical patent/FR2838817A1/fr
Application granted granted Critical
Publication of FR2838817B1 publication Critical patent/FR2838817B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B64AIRCRAFT; AVIATION; COSMONAUTICS
    • B64GCOSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
    • B64G1/00Cosmonautic vehicles
    • B64G1/22Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
    • B64G1/46Arrangements or adaptations of devices for control of environment or living conditions
    • B64G1/50Arrangements or adaptations of devices for control of environment or living conditions for temperature control
    • B64G1/506Heat pipes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B64AIRCRAFT; AVIATION; COSMONAUTICS
    • B64GCOSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
    • B64G1/00Cosmonautic vehicles
    • B64G1/22Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
    • B64G1/46Arrangements or adaptations of devices for control of environment or living conditions
    • B64G1/50Arrangements or adaptations of devices for control of environment or living conditions for temperature control
    • B64G1/503Radiator panels
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/26Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being integral with the element

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biodiversity & Conservation Biology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Environmental Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Remote Sensing (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR0212087A 2002-04-22 2002-09-30 Caloduc Expired - Lifetime FR2838817B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002119299A JP3680040B2 (ja) 2002-04-22 2002-04-22 ヒートパイプ

Publications (2)

Publication Number Publication Date
FR2838817A1 FR2838817A1 (fr) 2003-10-24
FR2838817B1 true FR2838817B1 (fr) 2007-04-20

Family

ID=28786744

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0212087A Expired - Lifetime FR2838817B1 (fr) 2002-04-22 2002-09-30 Caloduc

Country Status (3)

Country Link
US (1) US6942016B2 (fr)
JP (1) JP3680040B2 (fr)
FR (1) FR2838817B1 (fr)

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US6824305B1 (en) * 2002-08-16 2004-11-30 The Texas A & M University System Local wall heat flux/temperature meter for convective flow and method of utilizing same
FI20030550A0 (fi) * 2003-04-11 2003-04-11 Pajunen Petri Menetelmä numeerisen ratkaisun tarkkuuden arvioimiseksi
CN2705893Y (zh) * 2004-05-26 2005-06-22 鸿富锦精密工业(深圳)有限公司 相变化散热器
TWM259940U (en) * 2004-05-31 2005-03-21 Glacialtech Inc Heat dissipating device
JP4141462B2 (ja) * 2005-07-07 2008-08-27 日本ペイント株式会社 熱量予測方法及び熱量予測システム並びに熱量予測プログラム
EP1937774A2 (fr) 2005-09-16 2008-07-02 General Electric Company Melanges polymeres de polyaryl-ether-cetone ameliores
US20070066740A1 (en) * 2005-09-16 2007-03-22 Odle Roy R Annular or tubular shaped articles of novel polymer blends
US9006348B2 (en) 2005-09-16 2015-04-14 Sabic Global Technologies B.V. Poly aryl ether ketone polymer blends
TW200728673A (en) * 2006-01-27 2007-08-01 Mitac Technology Corp Heat pipe having directing groove section
US7423877B2 (en) * 2006-09-01 2008-09-09 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
TW200824833A (en) 2007-12-18 2008-06-16 Asia Vital Components Co Ltd Forming method and structure of heat pipe
US8912272B2 (en) 2008-12-19 2014-12-16 Sabic Innovative Plastics Ip B.V. Moisture resistant polyimide compositions
JP4558086B1 (ja) * 2009-06-22 2010-10-06 株式会社東芝 電子機器
US8305761B2 (en) 2009-11-17 2012-11-06 Apple Inc. Heat removal in compact computing systems
CN102079386A (zh) * 2009-11-30 2011-06-01 上海卫星工程研究所 一种用于空间飞行器单机散热的简易热传输装置
CN102092483A (zh) * 2009-12-11 2011-06-15 上海卫星工程研究所 用于空间飞行器单机散热的热传输装置
US9091489B2 (en) * 2010-05-14 2015-07-28 Paragon Space Development Corporation Radiator systems
BR112012030443A2 (pt) * 2010-05-31 2016-08-09 Sanden Corp trocador de calor , e, bomba térmica
JP5254416B2 (ja) * 2011-09-30 2013-08-07 株式会社東芝 電子機器
CN102592024B (zh) * 2012-01-06 2013-04-03 北京航空航天大学 一种确定径向热传导稳态温度极大值的热网络建模方法
US9238513B2 (en) * 2012-03-06 2016-01-19 The Boeing Company Spacecraft radiator panels
CN102914042B (zh) * 2012-10-13 2015-12-02 万建红 辐射平板空调***
US10392135B2 (en) * 2015-03-30 2019-08-27 Worldvu Satellites Limited Satellite radiator panels with combined stiffener/heat pipe
US9868551B2 (en) 2015-03-30 2018-01-16 Worldvu Satellites Limited Passive thermal system comprising combined heat pipe and phase change material and satellites incorporating same
CN105702641B (zh) * 2016-03-18 2018-06-26 中国科学院长春光学精密机械与物理研究所 空间飞行器可变大功率器件散热装置
US10780998B1 (en) * 2017-03-22 2020-09-22 Space Systems/Loral, Llc Spacecraft design with multiple thermal zones
US11781814B2 (en) * 2020-03-16 2023-10-10 The Boeing Company Tapered groove width heat pipe
CN111918535B (zh) * 2020-08-17 2023-04-25 中国科学院微小卫星创新研究院 星载及地面单相流体回路散热***
BE1029461B1 (fr) * 2021-05-31 2023-01-10 Sonaca Sa Structure régulatrice de chaleur par caloduc optimisée pour panneaux supports d'équipements électroniques
US20230322419A1 (en) * 2022-04-11 2023-10-12 Maxar Space Llc Radiating coupling heat pipe

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JPS57122551A (en) 1981-01-10 1982-07-30 Sumitomo Light Metal Ind Ltd Manufacture of heat sink for semiconductor device
US4470451A (en) * 1981-03-16 1984-09-11 Grumman Aerospace Corporation Dual axial channel heat pipe
JPS60235989A (ja) 1984-05-09 1985-11-22 Hitachi Ltd ル−ムエアコンの熱交換器
JPS60238681A (ja) 1985-04-26 1985-11-27 Hitachi Ltd フイン管式熱交換器
JPH0650761B2 (ja) * 1986-08-12 1994-06-29 富士通株式会社 半導体装置
GB8623178D0 (en) * 1986-09-26 1987-01-14 Raychem Ltd Circuit protection device
JPS6383586A (ja) * 1986-09-29 1988-04-14 Nippon Telegr & Teleph Corp <Ntt> ヒ−トパイプ埋め込みパネル
JPS6431370A (en) 1987-07-27 1989-02-01 Matsushita Electric Ind Co Ltd Cooling fin for semiconductor component
US4880050A (en) * 1988-06-20 1989-11-14 The Boeing Company Thermal management system
JP2828234B2 (ja) 1992-01-10 1998-11-25 住友金属工業株式会社 ピンフィン型ヒートシンクとその製造方法
JPH06213588A (ja) 1992-12-04 1994-08-02 American Teleph & Telegr Co <Att> 回路パックとそのヒートシンクの構造を最適化する方法
JP3424692B2 (ja) 1993-12-28 2003-07-07 昭和電工株式会社 熱交換器
US5649310A (en) * 1994-06-15 1997-07-15 Space Systems/Loral, Inc. Signal translation and amplification system including a thermal radiation panel coupled thereto
JPH0853100A (ja) 1994-08-10 1996-02-27 Mitsubishi Electric Corp ヒートパイプ埋め込みハニカムサンドイッチパネル
US5625280A (en) * 1995-10-30 1997-04-29 International Business Machines Corp. Voltage regulator bypass circuit
US5806803A (en) * 1995-11-30 1998-09-15 Hughes Electronics Corporation Spacecraft radiator cooling system
US5721656A (en) * 1996-06-10 1998-02-24 Winbond Electronics Corporation Electrostatc discharge protection network
JP3268734B2 (ja) * 1996-11-15 2002-03-25 古河電気工業株式会社 ヒートパイプを用いた電子機器放熱ユニットの製造方法
JP2954153B1 (ja) * 1998-04-07 1999-09-27 日本電気アイシーマイコンシステム株式会社 半導体集積回路
JP3772559B2 (ja) * 1998-12-02 2006-05-10 三菱電機株式会社 ヒートパイプ埋め込みハニカムサンドイッチパネル
DE19908683C2 (de) * 1999-02-26 2001-03-01 Dornier Gmbh Radiatorstruktur eines Satelliten
US6189601B1 (en) * 1999-05-05 2001-02-20 Intel Corporation Heat sink with a heat pipe for spreading of heat
KR19990064907A (ko) 1999-05-20 1999-08-05 주재훈 고효율 열전도 히트씽크의 방열핀구조
JP3345855B2 (ja) 1999-07-14 2002-11-18 古河電気工業株式会社 ヒートシンク
US20010028239A1 (en) * 2000-03-10 2001-10-11 Henri Vanderhenst Triac controller having soft start speed regulation
US6382309B1 (en) * 2000-05-16 2002-05-07 Swales Aerospace Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction
KR100363095B1 (ko) * 2000-12-06 2002-12-05 삼성전자 주식회사 정전기 방전 보호를 위한 액정 표시 장치 드라이버 회로

Also Published As

Publication number Publication date
US6942016B2 (en) 2005-09-13
JP3680040B2 (ja) 2005-08-10
US20030196778A1 (en) 2003-10-23
JP2003314978A (ja) 2003-11-06
FR2838817A1 (fr) 2003-10-24

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