FR2837733B1 - METHOD AND DEVICE FOR ABLATION OF A COVER LAYER COVERING A SURFACE TO BE BORN - Google Patents
METHOD AND DEVICE FOR ABLATION OF A COVER LAYER COVERING A SURFACE TO BE BORNInfo
- Publication number
- FR2837733B1 FR2837733B1 FR0203949A FR0203949A FR2837733B1 FR 2837733 B1 FR2837733 B1 FR 2837733B1 FR 0203949 A FR0203949 A FR 0203949A FR 0203949 A FR0203949 A FR 0203949A FR 2837733 B1 FR2837733 B1 FR 2837733B1
- Authority
- FR
- France
- Prior art keywords
- ablation
- born
- cover layer
- layer covering
- covering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000002679 ablation Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0203949A FR2837733B1 (en) | 2002-03-28 | 2002-03-28 | METHOD AND DEVICE FOR ABLATION OF A COVER LAYER COVERING A SURFACE TO BE BORN |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0203949A FR2837733B1 (en) | 2002-03-28 | 2002-03-28 | METHOD AND DEVICE FOR ABLATION OF A COVER LAYER COVERING A SURFACE TO BE BORN |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2837733A1 FR2837733A1 (en) | 2003-10-03 |
FR2837733B1 true FR2837733B1 (en) | 2005-01-14 |
Family
ID=27839306
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0203949A Expired - Lifetime FR2837733B1 (en) | 2002-03-28 | 2002-03-28 | METHOD AND DEVICE FOR ABLATION OF A COVER LAYER COVERING A SURFACE TO BE BORN |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2837733B1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4766874B2 (en) | 2004-01-14 | 2011-09-07 | 臼井国際産業株式会社 | Method for removing resin layer of resin-coated metal tube |
CN100455397C (en) * | 2004-01-14 | 2009-01-28 | 臼井国际产业株式会社 | Method for removing resin layer from resin-coated metal tube |
US11069537B2 (en) | 2019-10-18 | 2021-07-20 | Hamilton Sundstrand Corporation | Method for delidding a hermetically sealed circuit package |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2661371A1 (en) * | 1990-04-25 | 1991-10-31 | Aron Rosa Daniele | Method and device for restoring a work of art |
US5656186A (en) * | 1994-04-08 | 1997-08-12 | The Regents Of The University Of Michigan | Method for controlling configuration of laser induced breakdown and ablation |
US5736709A (en) * | 1996-08-12 | 1998-04-07 | Armco Inc. | Descaling metal with a laser having a very short pulse width and high average power |
US6335208B1 (en) * | 1999-05-10 | 2002-01-01 | Intersil Americas Inc. | Laser decapsulation method |
-
2002
- 2002-03-28 FR FR0203949A patent/FR2837733B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
FR2837733A1 (en) | 2003-10-03 |
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Legal Events
Date | Code | Title | Description |
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PLFP | Fee payment |
Year of fee payment: 15 |
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PLFP | Fee payment |
Year of fee payment: 16 |
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PLFP | Fee payment |
Year of fee payment: 17 |
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PLFP | Fee payment |
Year of fee payment: 19 |
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PLFP | Fee payment |
Year of fee payment: 20 |