FR2828746B1 - Composition d'elimination de reserve et de sous-produits de gravure et procede d'elimination de reserve utilisant celle-ci - Google Patents
Composition d'elimination de reserve et de sous-produits de gravure et procede d'elimination de reserve utilisant celle-ciInfo
- Publication number
- FR2828746B1 FR2828746B1 FR0210330A FR0210330A FR2828746B1 FR 2828746 B1 FR2828746 B1 FR 2828746B1 FR 0210330 A FR0210330 A FR 0210330A FR 0210330 A FR0210330 A FR 0210330A FR 2828746 B1 FR2828746 B1 FR 2828746B1
- Authority
- FR
- France
- Prior art keywords
- reserve
- etching
- products
- composition
- same
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000006227 byproduct Substances 0.000 title 1
- 238000005530 etching Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/38—Cationic compounds
- C11D1/52—Carboxylic amides, alkylolamides or imides or their condensation products with alkylene oxides
- C11D1/526—Carboxylic amides (R1-CO-NR2R3), where R1, R2 or R3 are polyalkoxylated
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Detergent Compositions (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2001-0049601A KR100434491B1 (ko) | 2001-08-17 | 2001-08-17 | 레지스트 또는 식각 부산물 제거용 조성물 및 이를 이용한레지스트 제거 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2828746A1 FR2828746A1 (fr) | 2003-02-21 |
FR2828746B1 true FR2828746B1 (fr) | 2005-02-04 |
Family
ID=19713293
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0210330A Expired - Fee Related FR2828746B1 (fr) | 2001-08-17 | 2002-08-14 | Composition d'elimination de reserve et de sous-produits de gravure et procede d'elimination de reserve utilisant celle-ci |
Country Status (9)
Country | Link |
---|---|
US (2) | US6713440B2 (fr) |
JP (1) | JP3940634B2 (fr) |
KR (1) | KR100434491B1 (fr) |
CN (1) | CN1256629C (fr) |
DE (1) | DE10237042B4 (fr) |
FR (1) | FR2828746B1 (fr) |
GB (1) | GB2381532B (fr) |
SG (1) | SG128421A1 (fr) |
TW (1) | TWI247976B (fr) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004101849A (ja) * | 2002-09-09 | 2004-04-02 | Mitsubishi Gas Chem Co Inc | 洗浄剤組成物 |
US7166419B2 (en) * | 2002-09-26 | 2007-01-23 | Air Products And Chemicals, Inc. | Compositions substrate for removing etching residue and use thereof |
KR20050017142A (ko) * | 2003-08-08 | 2005-02-22 | 삼성전자주식회사 | 린스 용액 및 이를 이용한 반도체 소자 세정 방법 |
US7587072B2 (en) * | 2003-08-22 | 2009-09-08 | Authentec, Inc. | System for and method of generating rotational inputs |
WO2005040931A1 (fr) * | 2003-10-29 | 2005-05-06 | Nagase Chemtex Corporation | Composition conçue pour separer une photoresine et procede de separation associe |
US8514867B2 (en) * | 2004-01-06 | 2013-08-20 | Hava Corporation | Method of determining broadband content usage within a system |
JP4815771B2 (ja) * | 2004-09-01 | 2011-11-16 | 住友電気工業株式会社 | 電気部品の製造方法 |
KR101117987B1 (ko) * | 2005-06-07 | 2012-03-06 | 엘지디스플레이 주식회사 | 평판표시소자의 제조장치 및 방법 |
KR100705416B1 (ko) * | 2005-06-15 | 2007-04-10 | 삼성전자주식회사 | 포토레지스트 제거용 조성물, 이의 제조방법, 이를 이용한포토레지스트의 제거 방법 및 반도체 장치의 제조 방법 |
KR20090027191A (ko) * | 2006-06-21 | 2009-03-16 | 이데미쓰 고산 가부시키가이샤 | 레지스트 박리제 |
JP2008060238A (ja) * | 2006-08-30 | 2008-03-13 | Toshiba Corp | 半導体装置の製造方法 |
JP5233028B2 (ja) * | 2006-12-19 | 2013-07-10 | ライオン株式会社 | 液体洗浄剤組成物用洗浄溶剤 |
JP5018098B2 (ja) * | 2007-01-19 | 2012-09-05 | 東ソー株式会社 | 配線工程用レジストの剥離方法 |
KR100761012B1 (ko) * | 2007-03-28 | 2007-10-01 | 배지현 | 거치대 |
JP4728997B2 (ja) * | 2007-04-06 | 2011-07-20 | 出光興産株式会社 | レジスト剥離剤及びその製造方法 |
US20100120256A1 (en) * | 2007-05-14 | 2010-05-13 | Basf Se | Method for removing etching residues from semiconductor components |
WO2008138882A1 (fr) * | 2007-05-14 | 2008-11-20 | Basf Se | Procédé d'enlèvement de résidus de gravure à partir de composants semi-conducteurs |
KR20100070557A (ko) * | 2008-12-18 | 2010-06-28 | 주식회사 동부하이텍 | 반도체 소자의 제조 방법 |
CN103586229A (zh) * | 2013-11-08 | 2014-02-19 | 无锡英普林纳米科技有限公司 | 一种提高纳米***抗粘性能的方法 |
CN105676600A (zh) * | 2016-04-06 | 2016-06-15 | 东莞市广华化工有限公司 | 防腐蚀碱性显影液 |
KR102426051B1 (ko) | 2016-05-31 | 2022-07-26 | 삼성전자주식회사 | 반도체 장치 및 이의 제조 방법 |
CN108345189A (zh) * | 2017-01-25 | 2018-07-31 | 东友精细化工有限公司 | 抗蚀剂剥离液组合物 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6242400B1 (en) | 1990-11-05 | 2001-06-05 | Ekc Technology, Inc. | Method of stripping resists from substrates using hydroxylamine and alkanolamine |
US5981454A (en) * | 1993-06-21 | 1999-11-09 | Ekc Technology, Inc. | Post clean treatment composition comprising an organic acid and hydroxylamine |
US6187730B1 (en) | 1990-11-05 | 2001-02-13 | Ekc Technology, Inc. | Hydroxylamine-gallic compound composition and process |
JPH0954442A (ja) * | 1995-08-11 | 1997-02-25 | Mitsubishi Gas Chem Co Inc | フォトレジスト剥離剤組成物及び剥離方法 |
JP2911792B2 (ja) | 1995-09-29 | 1999-06-23 | 東京応化工業株式会社 | レジスト用剥離液組成物 |
JP3476367B2 (ja) * | 1998-07-27 | 2003-12-10 | 東京応化工業株式会社 | レジスト用剥離液組成物およびこれを用いたレジスト剥離方法 |
TW594442B (en) | 1998-08-05 | 2004-06-21 | Samsung Electronics Co Ltd | Resist removing method and apparatus |
KR100335484B1 (ko) | 1998-08-05 | 2002-05-04 | 윤종용 | 알콕시 n-하이드록시알킬 알칸아미드로 된 레지스트 제거제, 레지스트 제거용 조성물, 이들의 제조 방법 및 이를 이용한 레지스트 제거 방법 |
US6274537B1 (en) * | 1998-08-05 | 2001-08-14 | Samsung Electronics Co., Ltd. | Use of alkoxy N-hydroxyalkyl alkanamide as resist removing agent, composition for removing resist, method for preparing the same and resist removing method using the same |
DE19936626B4 (de) * | 1998-08-05 | 2007-12-06 | Samsung Electronics Co., Ltd., Suwon | Resistentfernungsmittel und Resistentfernungsverfahren |
JP2000056480A (ja) * | 1998-08-10 | 2000-02-25 | Tokyo Ohka Kogyo Co Ltd | レジスト用剥離液組成物およびこれを用いたレジスト剥離方法 |
JP4320865B2 (ja) * | 1999-09-27 | 2009-08-26 | 三菱瓦斯化学株式会社 | レジスト剥離剤組成物およびそれを用いた半導体素子の製造方法。 |
KR100360397B1 (ko) * | 1999-11-26 | 2002-11-18 | 삼성전자 주식회사 | 레지스트 제거용 조성물 및 이를 이용한 레지스트 제거 방법 |
KR100363271B1 (ko) | 2000-06-12 | 2002-12-05 | 주식회사 동진쎄미켐 | 포토레지스트 리무버 조성물 |
US7037852B2 (en) * | 2002-09-26 | 2006-05-02 | Samsung Electronics Co., Ltd. | Composition for stripping photoresist and method of preparing the same |
-
2001
- 2001-08-17 KR KR10-2001-0049601A patent/KR100434491B1/ko not_active IP Right Cessation
-
2002
- 2002-01-31 US US10/059,150 patent/US6713440B2/en not_active Expired - Fee Related
- 2002-02-27 TW TW091103677A patent/TWI247976B/zh not_active IP Right Cessation
- 2002-03-21 SG SG200201673A patent/SG128421A1/en unknown
- 2002-03-28 CN CNB021083037A patent/CN1256629C/zh not_active Expired - Fee Related
- 2002-06-06 JP JP2002165960A patent/JP3940634B2/ja not_active Expired - Fee Related
- 2002-08-07 GB GB0218357A patent/GB2381532B/en not_active Expired - Fee Related
- 2002-08-07 DE DE10237042A patent/DE10237042B4/de not_active Expired - Fee Related
- 2002-08-14 FR FR0210330A patent/FR2828746B1/fr not_active Expired - Fee Related
-
2003
- 2003-12-19 US US10/739,203 patent/US7223721B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7223721B2 (en) | 2007-05-29 |
FR2828746A1 (fr) | 2003-02-21 |
US20030078174A1 (en) | 2003-04-24 |
US20040142836A1 (en) | 2004-07-22 |
JP3940634B2 (ja) | 2007-07-04 |
SG128421A1 (en) | 2007-01-30 |
US6713440B2 (en) | 2004-03-30 |
GB2381532A (en) | 2003-05-07 |
CN1407409A (zh) | 2003-04-02 |
TWI247976B (en) | 2006-01-21 |
KR20030015716A (ko) | 2003-02-25 |
CN1256629C (zh) | 2006-05-17 |
DE10237042B4 (de) | 2007-02-01 |
GB2381532B (en) | 2004-02-18 |
JP2003098691A (ja) | 2003-04-04 |
DE10237042A1 (de) | 2003-03-13 |
GB0218357D0 (en) | 2002-09-18 |
KR100434491B1 (ko) | 2004-06-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20150430 |