FR2828570B1 - METHOD FOR MANUFACTURING CONTACTLESS AND / OR MIXED CHIP CARDS - Google Patents

METHOD FOR MANUFACTURING CONTACTLESS AND / OR MIXED CHIP CARDS

Info

Publication number
FR2828570B1
FR2828570B1 FR0110629A FR0110629A FR2828570B1 FR 2828570 B1 FR2828570 B1 FR 2828570B1 FR 0110629 A FR0110629 A FR 0110629A FR 0110629 A FR0110629 A FR 0110629A FR 2828570 B1 FR2828570 B1 FR 2828570B1
Authority
FR
France
Prior art keywords
chip cards
mixed chip
manufacturing contactless
contactless
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0110629A
Other languages
French (fr)
Other versions
FR2828570A1 (en
Inventor
Patrick Jacquouton
Marc Hervigo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cybernetix SAS
Original Assignee
Cybernetix SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cybernetix SAS filed Critical Cybernetix SAS
Priority to FR0110629A priority Critical patent/FR2828570B1/en
Priority to DE10236666A priority patent/DE10236666A1/en
Publication of FR2828570A1 publication Critical patent/FR2828570A1/en
Application granted granted Critical
Publication of FR2828570B1 publication Critical patent/FR2828570B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10575—Insulating foil under component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
FR0110629A 2001-08-09 2001-08-09 METHOD FOR MANUFACTURING CONTACTLESS AND / OR MIXED CHIP CARDS Expired - Fee Related FR2828570B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR0110629A FR2828570B1 (en) 2001-08-09 2001-08-09 METHOD FOR MANUFACTURING CONTACTLESS AND / OR MIXED CHIP CARDS
DE10236666A DE10236666A1 (en) 2001-08-09 2002-08-09 Method for producing contactless and / or mixed chip cards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0110629A FR2828570B1 (en) 2001-08-09 2001-08-09 METHOD FOR MANUFACTURING CONTACTLESS AND / OR MIXED CHIP CARDS

Publications (2)

Publication Number Publication Date
FR2828570A1 FR2828570A1 (en) 2003-02-14
FR2828570B1 true FR2828570B1 (en) 2003-10-31

Family

ID=8866405

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0110629A Expired - Fee Related FR2828570B1 (en) 2001-08-09 2001-08-09 METHOD FOR MANUFACTURING CONTACTLESS AND / OR MIXED CHIP CARDS

Country Status (2)

Country Link
DE (1) DE10236666A1 (en)
FR (1) FR2828570B1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007503634A (en) * 2003-08-26 2007-02-22 ミュールバウアー アーゲー Module bridge for smart labels
EP1658582A1 (en) * 2003-08-26 2006-05-24 Mühlbauer AG Method for producing bridge modules
CN101002218B (en) * 2004-07-29 2010-05-12 Nxp股份有限公司 Module base unit with strain relief means
JP4855849B2 (en) 2006-06-30 2012-01-18 富士通株式会社 RFID tag manufacturing method and RFID tag
DE102010028444B4 (en) * 2010-04-30 2016-06-23 Bundesdruckerei Gmbh Document with a chip and method of making a document
DE102012212332A1 (en) * 2012-07-13 2014-01-16 Smartrac Ip B.V. Transponder layer and method for its production
DE102022003764A1 (en) * 2022-10-12 2024-04-18 Giesecke+Devrient ePayments GmbH Module carrier tape

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1131784A (en) * 1997-07-10 1999-02-02 Rohm Co Ltd Non-contact ic card
KR100460473B1 (en) * 1999-03-02 2004-12-08 모토로라 인코포레이티드 Electronic tag assembly and method therefor

Also Published As

Publication number Publication date
DE10236666A1 (en) 2003-02-20
FR2828570A1 (en) 2003-02-14

Similar Documents

Publication Publication Date Title
FR2867589B1 (en) METHOD FOR MANUFACTURING CONTACTLESS CHIP CARD AND NON-CONTACT CHIP CARD
FR2769390B1 (en) METHOD FOR MANUFACTURING CHIP CARDS SUITABLE FOR PROVIDING CONTACT AND NON-CONTACT OPERATION, AND CONTACTLESS CHIP CARDS
FR2798209B1 (en) METHOD FOR MANUFACTURING CHIP CARDS
DE60209036D1 (en) CONTACTLESS CHIP CARD
HK1048198B (en) Variable capacitance coupling antenna and fabrication method thereof, as well as chip card with out contact
FR2824939B1 (en) METHOD FOR MANUFACTURING A CONTACTLESS CHIP CARD USING TRANSFER PAPER AND CHIP CARD OBTAINED FROM THIS PROCESS
FR2768880B1 (en) DEMODULATOR FOR CONTACTLESS CHIP CARD
SG125057A1 (en) Non-contacting type ic card and method for fabricating the same
DE60227225D1 (en) CONTACTLESS CHIP CARD
DE50004245D1 (en) CONTACTLESS CHIP CARD
DE60323006D1 (en) Contactless / contact chip card
DE60217194D1 (en) Contactless chip card, response method and corresponding program
DE60213320D1 (en) IC card with contact and contactless interface
FI20010719A (en) A smart card web and a method for making it
FR2776796B1 (en) METHOD FOR MANUFACTURING CHIP CARDS
FR2838850B1 (en) METHOD FOR PACKAGING ELECTRONIC MICROCIRCUITS FOR A CHIP CARD AND ELECTRONIC MICROCIRCUIT THUS OBTAINED
SG91325A1 (en) Non-contact type ic card and process for manufacturing same
FR2828570B1 (en) METHOD FOR MANUFACTURING CONTACTLESS AND / OR MIXED CHIP CARDS
FR2786902B1 (en) CONTACTLESS ELECTRONIC MODULE, CHIP CARD COMPRISING SUCH A MODULE, AND METHODS OF MAKING SAME
FR2781298B1 (en) METHOD FOR MANUFACTURING AN ELECTRONIC CHIP CARD AND ELECTRONIC CHIP CARD
FR2764414B1 (en) NON-CONTACT CHIP CARD MANUFACTURING PROCESS
FR2793331B1 (en) METHOD FOR MANUFACTURING A MICROCIRCUIT CARD
FR2835119B1 (en) DYNAMIC LARGE DEMODULATOR FOR NON-CONTACT CHIP CARDS OR LABELS
FR2810435B1 (en) ELECTRONIC CHIP CARD PORTFOLIO
FR2795202B1 (en) CARD AND METHOD FOR MANUFACTURING CARDS HAVING CONTACT AND CONTACTLESS COMMUNICATION INTERFACE

Legal Events

Date Code Title Description
TP Transmission of property
TP Transmission of property
GC Lien (pledge) constituted
ST Notification of lapse

Effective date: 20110502