FR2823633B1 - Procede de connexion pour structure a electrodes implantable - Google Patents

Procede de connexion pour structure a electrodes implantable

Info

Publication number
FR2823633B1
FR2823633B1 FR0105053A FR0105053A FR2823633B1 FR 2823633 B1 FR2823633 B1 FR 2823633B1 FR 0105053 A FR0105053 A FR 0105053A FR 0105053 A FR0105053 A FR 0105053A FR 2823633 B1 FR2823633 B1 FR 2823633B1
Authority
FR
France
Prior art keywords
electrode structure
connection method
implantable electrode
implantable
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0105053A
Other languages
English (en)
Other versions
FR2823633A1 (fr
Inventor
Thierry Herve
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Icrovitae Technologies Fr
Original Assignee
Universite Joseph Fourier Grenoble 1
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Universite Joseph Fourier Grenoble 1 filed Critical Universite Joseph Fourier Grenoble 1
Priority to FR0105053A priority Critical patent/FR2823633B1/fr
Priority to EP02732808A priority patent/EP1378151A1/fr
Priority to US10/474,332 priority patent/US7090505B2/en
Priority to PCT/FR2002/001269 priority patent/WO2002085085A1/fr
Priority to JP2002582674A priority patent/JP4075615B2/ja
Publication of FR2823633A1 publication Critical patent/FR2823633A1/fr
Application granted granted Critical
Publication of FR2823633B1 publication Critical patent/FR2823633B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
    • A61B5/25—Bioelectric electrodes therefor
    • A61B5/279—Bioelectric electrodes therefor specially adapted for particular uses
    • A61B5/28—Bioelectric electrodes therefor specially adapted for particular uses for electrocardiography [ECG]
    • A61B5/282—Holders for multiple electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/22—Arrangements of medical sensors with cables or leads; Connectors or couplings specifically adapted for medical sensors
    • A61B2562/221—Arrangements of sensors with cables or leads, e.g. cable harnesses
    • A61B2562/222—Electrical cables or leads therefor, e.g. coaxial cables or ribbon cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/053—Tails
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10666—Plated through-hole for surface mounting on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Molecular Biology (AREA)
  • Biophysics (AREA)
  • Pathology (AREA)
  • Biomedical Technology (AREA)
  • Cardiology (AREA)
  • Medical Informatics (AREA)
  • Physics & Mathematics (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Electrotherapy Devices (AREA)
  • Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
FR0105053A 2001-04-12 2001-04-12 Procede de connexion pour structure a electrodes implantable Expired - Fee Related FR2823633B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR0105053A FR2823633B1 (fr) 2001-04-12 2001-04-12 Procede de connexion pour structure a electrodes implantable
EP02732808A EP1378151A1 (fr) 2001-04-12 2002-04-11 Procede de connexion pour structure a electrodes implantable
US10/474,332 US7090505B2 (en) 2001-04-12 2002-04-11 Connecting method for structure with implantable electrodes
PCT/FR2002/001269 WO2002085085A1 (fr) 2001-04-12 2002-04-11 Procede de connexion pour structure a electrodes implantable
JP2002582674A JP4075615B2 (ja) 2001-04-12 2002-04-11 埋込型電極を備える構造体のための接続方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0105053A FR2823633B1 (fr) 2001-04-12 2001-04-12 Procede de connexion pour structure a electrodes implantable

Publications (2)

Publication Number Publication Date
FR2823633A1 FR2823633A1 (fr) 2002-10-18
FR2823633B1 true FR2823633B1 (fr) 2003-09-12

Family

ID=8862294

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0105053A Expired - Fee Related FR2823633B1 (fr) 2001-04-12 2001-04-12 Procede de connexion pour structure a electrodes implantable

Country Status (5)

Country Link
US (1) US7090505B2 (fr)
EP (1) EP1378151A1 (fr)
JP (1) JP4075615B2 (fr)
FR (1) FR2823633B1 (fr)
WO (1) WO2002085085A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7253808B2 (en) * 2002-11-18 2007-08-07 Lg.Philips Lcd Co., Ltd. Touch screen system and display device using the same
US7400513B2 (en) * 2003-04-22 2008-07-15 Nihon Dempa Kogyo Co., Ltd. Conductive printed board, multicore cable and ultrasonic probe using the same
JP4983259B2 (ja) * 2007-01-09 2012-07-25 船井電機株式会社 フレキシブル基板の接続構造

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4353372A (en) * 1980-02-11 1982-10-12 Bunker Ramo Corporation Medical cable set and electrode therefor
JPS57205179U (fr) * 1981-06-24 1982-12-27
US4815990A (en) * 1987-04-10 1989-03-28 Rogers Corporation Flexible circuit having termination features and method of making the same
JPH045844A (ja) * 1990-04-23 1992-01-09 Nippon Mektron Ltd Ｉｃ搭載用多層回路基板及びその製造法
DE4327560A1 (de) * 1993-08-17 1995-02-23 Hottinger Messtechnik Baldwin Verfahren zum Kontaktieren von Leiterbahnanordnungen und Kontaktanordnung
DE19530353C2 (de) * 1995-08-18 2001-04-05 Mannesmann Vdo Ag Verfahren zum Lötverbinden der Leiterbahnen mit einer flexiblen gedruckten Leitung oder Schaltung mit den zugeordneten Anschlußflächen einer Leiterplatte
JP3215796B2 (ja) * 1996-04-19 2001-10-09 株式会社東海理化電機製作所 医療用圧力プローブにおける配線フィルムの接続構造
JPH09312453A (ja) * 1996-05-20 1997-12-02 Nikon Corp 熱圧着用回路基板
US6024702A (en) * 1997-09-03 2000-02-15 Pmt Corporation Implantable electrode manufactured with flexible printed circuit
US6245047B1 (en) * 1998-12-10 2001-06-12 Photoelectron Corporation X-Ray probe sheath apparatus

Also Published As

Publication number Publication date
US7090505B2 (en) 2006-08-15
US20040163841A1 (en) 2004-08-26
JP2004521507A (ja) 2004-07-15
JP4075615B2 (ja) 2008-04-16
WO2002085085A1 (fr) 2002-10-24
EP1378151A1 (fr) 2004-01-07
FR2823633A1 (fr) 2002-10-18

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Legal Events

Date Code Title Description
TP Transmission of property

Owner name: THIERRY JEAN HERVE, FR

Effective date: 20140129

TP Transmission of property

Owner name: ICROVITAE TECHNOLOGIES, FR

Effective date: 20140317

PLFP Fee payment

Year of fee payment: 15

PLFP Fee payment

Year of fee payment: 16

ST Notification of lapse

Effective date: 20161230

RN Application for restoration

Effective date: 20170131

FC Decision of inpi director general to approve request for restoration

Effective date: 20170227

PLFP Fee payment

Year of fee payment: 17

PLFP Fee payment

Year of fee payment: 18