FR2823633B1 - Procede de connexion pour structure a electrodes implantable - Google Patents
Procede de connexion pour structure a electrodes implantableInfo
- Publication number
- FR2823633B1 FR2823633B1 FR0105053A FR0105053A FR2823633B1 FR 2823633 B1 FR2823633 B1 FR 2823633B1 FR 0105053 A FR0105053 A FR 0105053A FR 0105053 A FR0105053 A FR 0105053A FR 2823633 B1 FR2823633 B1 FR 2823633B1
- Authority
- FR
- France
- Prior art keywords
- electrode structure
- connection method
- implantable electrode
- implantable
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
- A61B5/25—Bioelectric electrodes therefor
- A61B5/279—Bioelectric electrodes therefor specially adapted for particular uses
- A61B5/28—Bioelectric electrodes therefor specially adapted for particular uses for electrocardiography [ECG]
- A61B5/282—Holders for multiple electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/22—Arrangements of medical sensors with cables or leads; Connectors or couplings specifically adapted for medical sensors
- A61B2562/221—Arrangements of sensors with cables or leads, e.g. cable harnesses
- A61B2562/222—Electrical cables or leads therefor, e.g. coaxial cables or ribbon cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/053—Tails
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10477—Inverted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10666—Plated through-hole for surface mounting on PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Heart & Thoracic Surgery (AREA)
- Molecular Biology (AREA)
- Biophysics (AREA)
- Pathology (AREA)
- Biomedical Technology (AREA)
- Cardiology (AREA)
- Medical Informatics (AREA)
- Physics & Mathematics (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Electrotherapy Devices (AREA)
- Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0105053A FR2823633B1 (fr) | 2001-04-12 | 2001-04-12 | Procede de connexion pour structure a electrodes implantable |
EP02732808A EP1378151A1 (fr) | 2001-04-12 | 2002-04-11 | Procede de connexion pour structure a electrodes implantable |
US10/474,332 US7090505B2 (en) | 2001-04-12 | 2002-04-11 | Connecting method for structure with implantable electrodes |
PCT/FR2002/001269 WO2002085085A1 (fr) | 2001-04-12 | 2002-04-11 | Procede de connexion pour structure a electrodes implantable |
JP2002582674A JP4075615B2 (ja) | 2001-04-12 | 2002-04-11 | 埋込型電極を備える構造体のための接続方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0105053A FR2823633B1 (fr) | 2001-04-12 | 2001-04-12 | Procede de connexion pour structure a electrodes implantable |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2823633A1 FR2823633A1 (fr) | 2002-10-18 |
FR2823633B1 true FR2823633B1 (fr) | 2003-09-12 |
Family
ID=8862294
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0105053A Expired - Fee Related FR2823633B1 (fr) | 2001-04-12 | 2001-04-12 | Procede de connexion pour structure a electrodes implantable |
Country Status (5)
Country | Link |
---|---|
US (1) | US7090505B2 (fr) |
EP (1) | EP1378151A1 (fr) |
JP (1) | JP4075615B2 (fr) |
FR (1) | FR2823633B1 (fr) |
WO (1) | WO2002085085A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7253808B2 (en) * | 2002-11-18 | 2007-08-07 | Lg.Philips Lcd Co., Ltd. | Touch screen system and display device using the same |
US7400513B2 (en) * | 2003-04-22 | 2008-07-15 | Nihon Dempa Kogyo Co., Ltd. | Conductive printed board, multicore cable and ultrasonic probe using the same |
JP4983259B2 (ja) * | 2007-01-09 | 2012-07-25 | 船井電機株式会社 | フレキシブル基板の接続構造 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4353372A (en) * | 1980-02-11 | 1982-10-12 | Bunker Ramo Corporation | Medical cable set and electrode therefor |
JPS57205179U (fr) * | 1981-06-24 | 1982-12-27 | ||
US4815990A (en) * | 1987-04-10 | 1989-03-28 | Rogers Corporation | Flexible circuit having termination features and method of making the same |
JPH045844A (ja) * | 1990-04-23 | 1992-01-09 | Nippon Mektron Ltd | Ic搭載用多層回路基板及びその製造法 |
DE4327560A1 (de) * | 1993-08-17 | 1995-02-23 | Hottinger Messtechnik Baldwin | Verfahren zum Kontaktieren von Leiterbahnanordnungen und Kontaktanordnung |
DE19530353C2 (de) * | 1995-08-18 | 2001-04-05 | Mannesmann Vdo Ag | Verfahren zum Lötverbinden der Leiterbahnen mit einer flexiblen gedruckten Leitung oder Schaltung mit den zugeordneten Anschlußflächen einer Leiterplatte |
JP3215796B2 (ja) * | 1996-04-19 | 2001-10-09 | 株式会社東海理化電機製作所 | 医療用圧力プローブにおける配線フィルムの接続構造 |
JPH09312453A (ja) * | 1996-05-20 | 1997-12-02 | Nikon Corp | 熱圧着用回路基板 |
US6024702A (en) * | 1997-09-03 | 2000-02-15 | Pmt Corporation | Implantable electrode manufactured with flexible printed circuit |
US6245047B1 (en) * | 1998-12-10 | 2001-06-12 | Photoelectron Corporation | X-Ray probe sheath apparatus |
-
2001
- 2001-04-12 FR FR0105053A patent/FR2823633B1/fr not_active Expired - Fee Related
-
2002
- 2002-04-11 US US10/474,332 patent/US7090505B2/en not_active Expired - Fee Related
- 2002-04-11 JP JP2002582674A patent/JP4075615B2/ja not_active Expired - Fee Related
- 2002-04-11 WO PCT/FR2002/001269 patent/WO2002085085A1/fr active Application Filing
- 2002-04-11 EP EP02732808A patent/EP1378151A1/fr not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
US7090505B2 (en) | 2006-08-15 |
US20040163841A1 (en) | 2004-08-26 |
JP2004521507A (ja) | 2004-07-15 |
JP4075615B2 (ja) | 2008-04-16 |
WO2002085085A1 (fr) | 2002-10-24 |
EP1378151A1 (fr) | 2004-01-07 |
FR2823633A1 (fr) | 2002-10-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU2001296470A1 (en) | Fringe-field capacitor electrode for electrochemical device | |
AU2002234999A8 (en) | Method for producing membrane electrode assembly | |
IL145700A0 (en) | Electrode system for neural applications | |
AU2003220519A1 (en) | Electrode geometries for efficient neural stimulation | |
AU2003230184A8 (en) | Electrode assembly for nerve control | |
ES1047774Y (es) | Estructura de electrodo | |
EP1450426A4 (fr) | Procede de fabrication d'electrode de pile a combustible | |
EP1701366A4 (fr) | Procede de production d'une electrode destinee a une capacite | |
FR2824668B1 (fr) | Accumulateur au lithium et procede de fabrication d'une electrode positive pour celui-ci | |
EP1229597A3 (fr) | Procédé de fabrication de feuilles d'électrodes | |
AU2002211652A1 (en) | Method of making an electrode | |
EP1699062A4 (fr) | Condensateur electrochimique, procede de fabrication d'electrode pour condensateur electrochimique, et dispositif de fabrication d'electrode pour condensateur electrochimique | |
AU4761401A (en) | Lithium ion-selective electrode for clinical applications | |
FI20021224A0 (fi) | Parannettu menetelmä päätelaitekeskustelun toteuttamiseksi ja menetelmää hyödyntävä päätelaite | |
FR2819647B1 (fr) | Procede pour fabriquer une electrode pour bougie d'allumage | |
AU2003285806A1 (en) | Method for preparing electrode for electrochemical capacitor | |
FR2802345B1 (fr) | Structure de connexion pour fil electrique et borne, procede de connexion associe, et appareil de connexion de borne | |
FR2823633B1 (fr) | Procede de connexion pour structure a electrodes implantable | |
AU2003245799A1 (en) | System for fixing a biomedical electrode | |
FR2826730B1 (fr) | Procede de charge d'une structure comportant un corps isolant | |
EP1699061A4 (fr) | Electrode pour condensateur electrochimique, procede de fabrication, et dispositif de fabrication d'electrode pour condensateur electrochimique | |
FR2819106B1 (fr) | Electrode pour generateur electrochimique rechargeable au lithium et son procede de fabrication | |
AU2003278672A1 (en) | An apparatus for manufacturing an electrode | |
FR2819358B1 (fr) | Procede de gestion d'annuaire de terminaux | |
EP1548152A4 (fr) | Procede de formation d'electrode |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TP | Transmission of property |
Owner name: THIERRY JEAN HERVE, FR Effective date: 20140129 |
|
TP | Transmission of property |
Owner name: ICROVITAE TECHNOLOGIES, FR Effective date: 20140317 |
|
PLFP | Fee payment |
Year of fee payment: 15 |
|
PLFP | Fee payment |
Year of fee payment: 16 |
|
ST | Notification of lapse |
Effective date: 20161230 |
|
RN | Application for restoration |
Effective date: 20170131 |
|
FC | Decision of inpi director general to approve request for restoration |
Effective date: 20170227 |
|
PLFP | Fee payment |
Year of fee payment: 17 |
|
PLFP | Fee payment |
Year of fee payment: 18 |