FR2819979B1 - Structure de blindage pour des elements de circuits electroniques - Google Patents

Structure de blindage pour des elements de circuits electroniques

Info

Publication number
FR2819979B1
FR2819979B1 FR0110023A FR0110023A FR2819979B1 FR 2819979 B1 FR2819979 B1 FR 2819979B1 FR 0110023 A FR0110023 A FR 0110023A FR 0110023 A FR0110023 A FR 0110023A FR 2819979 B1 FR2819979 B1 FR 2819979B1
Authority
FR
France
Prior art keywords
electronic circuit
circuit elements
shielding structure
shielding
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0110023A
Other languages
English (en)
Other versions
FR2819979A1 (fr
Inventor
Masaaki Okada
Hitoshi Matsudaira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of FR2819979A1 publication Critical patent/FR2819979A1/fr
Application granted granted Critical
Publication of FR2819979B1 publication Critical patent/FR2819979B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H05K9/0028—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet with retainers or specific soldering features
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10787—Leads having protrusions, e.g. for retention or insert stop
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10795—Details of lead tips, e.g. pointed
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S174/00—Electricity: conductors and insulators
    • Y10S174/35—Box or housing mounted on substrate or PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
FR0110023A 2001-01-19 2001-07-26 Structure de blindage pour des elements de circuits electroniques Expired - Fee Related FR2819979B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001012146A JP3792518B2 (ja) 2001-01-19 2001-01-19 電子回路部品のシールド構造

Publications (2)

Publication Number Publication Date
FR2819979A1 FR2819979A1 (fr) 2002-07-26
FR2819979B1 true FR2819979B1 (fr) 2003-09-05

Family

ID=18879195

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0110023A Expired - Fee Related FR2819979B1 (fr) 2001-01-19 2001-07-26 Structure de blindage pour des elements de circuits electroniques

Country Status (3)

Country Link
US (1) US6593523B2 (fr)
JP (1) JP3792518B2 (fr)
FR (1) FR2819979B1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1445999B1 (fr) * 2003-02-07 2007-10-03 Sony Ericsson Mobile Communications AB Procédé pour munir un circuit imprimé d'un boîtier de blindage et le circuit imprimé pour ce
TWM289575U (en) * 2005-11-04 2006-04-11 Hon Hai Prec Ind Co Ltd Electromagnetic interference shield device
TWM323131U (en) * 2007-04-23 2007-12-01 Hon Hai Prec Ind Co Ltd Electrical card connector
EP2208408B1 (fr) * 2007-11-12 2012-06-27 Thomson Licensing Logement de syntoniseur
TWI355881B (en) * 2008-10-13 2012-01-01 Askey Computer Corp Circuit board for communication product and manufa
TWI375509B (en) * 2008-10-13 2012-10-21 Askey Computer Corp A circuit board having an isolation cover and a method for assembling
ITRM20090070A1 (it) * 2009-02-17 2010-08-18 Motorola Inc Schermatura per circuito integrato.
CN102378562A (zh) * 2010-08-19 2012-03-14 深圳富泰宏精密工业有限公司 电磁屏蔽罩及印刷电路板装置
WO2012176646A1 (fr) * 2011-06-23 2012-12-27 Ｎｅｃカシオモバイルコミュニケーションズ株式会社 Châssis de blindage, structure de montage de cadre scellé de manière étanche, et dispositif portable électronique
CN106132183B (zh) * 2016-06-28 2018-07-10 广东欧珀移动通信有限公司 Pcb板组件和具有其的移动终端

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4370515A (en) * 1979-12-26 1983-01-25 Rockwell International Corporation Electromagnetic interference
JPH07240591A (ja) 1994-03-02 1995-09-12 Sanyo Electric Co Ltd シールドケースを有するプリント基板及びその製造方法
JPH07249925A (ja) * 1994-03-10 1995-09-26 Murata Mfg Co Ltd アンテナ及びアンテナ装置
JPH0818265A (ja) 1994-06-29 1996-01-19 Molex Inc プリント回路基板上での電磁波等のシ−ルド方法 及びその為のシ−ルドカバ−
US5559676A (en) * 1995-06-07 1996-09-24 Gessaman; Martin J. Self-contained drop-in component
JPH0927691A (ja) 1995-07-13 1997-01-28 Fuji Electric Co Ltd プリント基板へのシールドケース取付構造
JP3410312B2 (ja) 1996-12-25 2003-05-26 アルプス電気株式会社 ユニット部品の取付構造
US6136131A (en) 1998-06-02 2000-10-24 Instrument Specialties Company, Inc. Method of shielding and obtaining access to a component on a printed circuit board

Also Published As

Publication number Publication date
JP3792518B2 (ja) 2006-07-05
US6593523B2 (en) 2003-07-15
US20020096344A1 (en) 2002-07-25
FR2819979A1 (fr) 2002-07-26
JP2002217580A (ja) 2002-08-02

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20080331