FR2813216B1 - Dispositif de remplissage de trous debouchants dans un substrat - Google Patents

Dispositif de remplissage de trous debouchants dans un substrat

Info

Publication number
FR2813216B1
FR2813216B1 FR0010984A FR0010984A FR2813216B1 FR 2813216 B1 FR2813216 B1 FR 2813216B1 FR 0010984 A FR0010984 A FR 0010984A FR 0010984 A FR0010984 A FR 0010984A FR 2813216 B1 FR2813216 B1 FR 2813216B1
Authority
FR
France
Prior art keywords
substrate
filling opening
opening holes
holes
filling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0010984A
Other languages
English (en)
Other versions
FR2813216A1 (fr
Inventor
Francis Bourrieres
Clement Kaiser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novatec SA
Original Assignee
Novatec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Novatec SA filed Critical Novatec SA
Priority to FR0010984A priority Critical patent/FR2813216B1/fr
Priority to PCT/FR2001/002422 priority patent/WO2002019782A1/fr
Priority to AU2001285976A priority patent/AU2001285976A1/en
Priority to EP01965309A priority patent/EP1314341A1/fr
Priority to US10/343,941 priority patent/US20030170387A1/en
Publication of FR2813216A1 publication Critical patent/FR2813216A1/fr
Application granted granted Critical
Publication of FR2813216B1 publication Critical patent/FR2813216B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
FR0010984A 2000-08-28 2000-08-28 Dispositif de remplissage de trous debouchants dans un substrat Expired - Fee Related FR2813216B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR0010984A FR2813216B1 (fr) 2000-08-28 2000-08-28 Dispositif de remplissage de trous debouchants dans un substrat
PCT/FR2001/002422 WO2002019782A1 (fr) 2000-08-28 2001-07-25 Procede collectif de remplissage affleurant de trous debouchants dans un substrat
AU2001285976A AU2001285976A1 (en) 2000-08-28 2001-07-25 Collective method for flush filling of through holes in a substrate
EP01965309A EP1314341A1 (fr) 2000-08-28 2001-07-25 Procede collectif de remplissage affleurant de trous debouchants dans un substrat
US10/343,941 US20030170387A1 (en) 2000-08-28 2001-07-25 Collective method for flush filling of through holes in a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0010984A FR2813216B1 (fr) 2000-08-28 2000-08-28 Dispositif de remplissage de trous debouchants dans un substrat

Publications (2)

Publication Number Publication Date
FR2813216A1 FR2813216A1 (fr) 2002-03-01
FR2813216B1 true FR2813216B1 (fr) 2003-03-21

Family

ID=8853762

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0010984A Expired - Fee Related FR2813216B1 (fr) 2000-08-28 2000-08-28 Dispositif de remplissage de trous debouchants dans un substrat

Country Status (5)

Country Link
US (1) US20030170387A1 (fr)
EP (1) EP1314341A1 (fr)
AU (1) AU2001285976A1 (fr)
FR (1) FR2813216B1 (fr)
WO (1) WO2002019782A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2895125B1 (fr) 2005-12-21 2008-12-12 Novatec Sa Procede d'authentification de documents et dispositif de lecture desdits documents a des fins d'enregistrement pour preuve
US7410090B2 (en) * 2006-04-21 2008-08-12 International Business Machines Corporation Conductive bonding material fill techniques
US9314864B2 (en) 2007-07-09 2016-04-19 International Business Machines Corporation C4NP compliant solder fill head seals
EP2421343B1 (fr) * 2010-08-06 2013-03-20 Mass GmbH Installation et procédé destinés à traiter des plaquettes
AT13434U1 (de) * 2012-02-21 2013-12-15 Austria Tech & System Tech Verfahren zur Herstellung einer Leiterplatte und Verwendung eines derartigen Verfahrens
EP2844044A1 (fr) 2013-09-03 2015-03-04 Mass GmbH Installation et procédé de remplissage de trous dans une plaquette
DE102017213841A1 (de) * 2017-08-08 2019-02-14 Continental Automotive Gmbh Druckschablone zur Verwendung in einem Verfahren zur Durchkontaktierung einer Leiterplatte und Verwendung solch einer Druckschablone in einem solchen Verfahren
EP4328028A1 (fr) * 2022-08-23 2024-02-28 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Remplissage des trous d'une structure de support de composants avec un applicateur de support mobile contrôlable et alignable

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3514093A1 (de) * 1985-04-16 1986-10-23 Kaspar 5241 Gebhardshain Eidenberg Verfahren zum verschliessen von in einer leiterplatte vorgesehenen bohrungen
JPS6293999A (ja) * 1985-10-19 1987-04-30 大日本スクリ−ン製造株式会社 プリント基板のスル−ホ−ル穴埋め方法
JPH03240292A (ja) * 1990-02-19 1991-10-25 Matsushita Electric Ind Co Ltd プリント配線板の製造方法
JPH0494592A (ja) * 1990-08-10 1992-03-26 Cmk Corp プリント配線板におけるスルーホールに対する充填材の充填方法
US5587119A (en) * 1994-09-14 1996-12-24 E-Systems, Inc. Method for manufacturing a coaxial interconnect
FR2754473B1 (fr) * 1996-10-15 1999-02-26 Novatec Procede de realisation de depots de produit visqueux et/ou pateux sur un substrat a travers les ouvertures d'un pochoir et dispositif distributeur de produit
FR2754474B1 (fr) * 1996-10-15 1999-04-30 Novatec Dispositif pour le depot d'un produit visqueux ou pateux sur un substrat a travers les ouvertures d'un pochoir

Also Published As

Publication number Publication date
FR2813216A1 (fr) 2002-03-01
WO2002019782A1 (fr) 2002-03-07
AU2001285976A1 (en) 2002-03-13
US20030170387A1 (en) 2003-09-11
EP1314341A1 (fr) 2003-05-28

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20140430