FR2812224B1 - PROCESS FOR CONTINUOUSLY DEPOSITING A SILICONE LAYER OR BARRIER ON A SUBSTRATE AND INSTALLATION FOR CARRYING OUT SAID METHOD - Google Patents

PROCESS FOR CONTINUOUSLY DEPOSITING A SILICONE LAYER OR BARRIER ON A SUBSTRATE AND INSTALLATION FOR CARRYING OUT SAID METHOD

Info

Publication number
FR2812224B1
FR2812224B1 FR0009849A FR0009849A FR2812224B1 FR 2812224 B1 FR2812224 B1 FR 2812224B1 FR 0009849 A FR0009849 A FR 0009849A FR 0009849 A FR0009849 A FR 0009849A FR 2812224 B1 FR2812224 B1 FR 2812224B1
Authority
FR
France
Prior art keywords
barrier
installation
substrate
carrying
silicone layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0009849A
Other languages
French (fr)
Other versions
FR2812224A1 (en
Inventor
Michel Palumbo
Jean Marc Cotel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MARQUAGE IND SOC
Original Assignee
MARQUAGE IND SOC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MARQUAGE IND SOC filed Critical MARQUAGE IND SOC
Priority to FR0009849A priority Critical patent/FR2812224B1/en
Publication of FR2812224A1 publication Critical patent/FR2812224A1/en
Application granted granted Critical
Publication of FR2812224B1 publication Critical patent/FR2812224B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/481—Insulating layers on insulating parts, with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
FR0009849A 2000-07-27 2000-07-27 PROCESS FOR CONTINUOUSLY DEPOSITING A SILICONE LAYER OR BARRIER ON A SUBSTRATE AND INSTALLATION FOR CARRYING OUT SAID METHOD Expired - Fee Related FR2812224B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0009849A FR2812224B1 (en) 2000-07-27 2000-07-27 PROCESS FOR CONTINUOUSLY DEPOSITING A SILICONE LAYER OR BARRIER ON A SUBSTRATE AND INSTALLATION FOR CARRYING OUT SAID METHOD

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0009849A FR2812224B1 (en) 2000-07-27 2000-07-27 PROCESS FOR CONTINUOUSLY DEPOSITING A SILICONE LAYER OR BARRIER ON A SUBSTRATE AND INSTALLATION FOR CARRYING OUT SAID METHOD

Publications (2)

Publication Number Publication Date
FR2812224A1 FR2812224A1 (en) 2002-02-01
FR2812224B1 true FR2812224B1 (en) 2003-07-25

Family

ID=8852972

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0009849A Expired - Fee Related FR2812224B1 (en) 2000-07-27 2000-07-27 PROCESS FOR CONTINUOUSLY DEPOSITING A SILICONE LAYER OR BARRIER ON A SUBSTRATE AND INSTALLATION FOR CARRYING OUT SAID METHOD

Country Status (1)

Country Link
FR (1) FR2812224B1 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5260168A (en) * 1989-10-13 1993-11-09 The Foxboro Company Application specific tape automated bonding
US5955245A (en) * 1993-10-12 1999-09-21 Occidental Chemical Corporation Method of forming polyimide patterns on substrates
US5554684A (en) * 1993-10-12 1996-09-10 Occidental Chemical Corporation Forming polyimide coating by screen printing
US5784260A (en) * 1996-05-29 1998-07-21 International Business Machines Corporation Structure for constraining the flow of encapsulant applied to an I/C chip on a substrate

Also Published As

Publication number Publication date
FR2812224A1 (en) 2002-02-01

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Legal Events

Date Code Title Description
ST Notification of lapse