FR2801815B1 - Dispositif de rincage de plaquettes semiconductrices - Google Patents

Dispositif de rincage de plaquettes semiconductrices

Info

Publication number
FR2801815B1
FR2801815B1 FR9915436A FR9915436A FR2801815B1 FR 2801815 B1 FR2801815 B1 FR 2801815B1 FR 9915436 A FR9915436 A FR 9915436A FR 9915436 A FR9915436 A FR 9915436A FR 2801815 B1 FR2801815 B1 FR 2801815B1
Authority
FR
France
Prior art keywords
semiconductor wafers
rinsing semiconductor
rinsing
wafers
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9915436A
Other languages
English (en)
Other versions
FR2801815A1 (fr
Inventor
Patrick Massicot
Jean Pierre Martin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Priority to FR9915436A priority Critical patent/FR2801815B1/fr
Priority to US09/731,578 priority patent/US20010015215A1/en
Publication of FR2801815A1 publication Critical patent/FR2801815A1/fr
Application granted granted Critical
Publication of FR2801815B1 publication Critical patent/FR2801815B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
FR9915436A 1999-12-07 1999-12-07 Dispositif de rincage de plaquettes semiconductrices Expired - Fee Related FR2801815B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR9915436A FR2801815B1 (fr) 1999-12-07 1999-12-07 Dispositif de rincage de plaquettes semiconductrices
US09/731,578 US20010015215A1 (en) 1999-12-07 2000-12-06 Semiconductor wafer rinse device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9915436A FR2801815B1 (fr) 1999-12-07 1999-12-07 Dispositif de rincage de plaquettes semiconductrices

Publications (2)

Publication Number Publication Date
FR2801815A1 FR2801815A1 (fr) 2001-06-08
FR2801815B1 true FR2801815B1 (fr) 2002-02-15

Family

ID=9552989

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9915436A Expired - Fee Related FR2801815B1 (fr) 1999-12-07 1999-12-07 Dispositif de rincage de plaquettes semiconductrices

Country Status (2)

Country Link
US (1) US20010015215A1 (fr)
FR (1) FR2801815B1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3550507B2 (ja) * 1999-03-25 2004-08-04 Ｎｅｃエレクトロニクス株式会社 被洗浄体のすすぎ方法およびその装置
US8522473B2 (en) * 2006-01-23 2013-09-03 Yoz-Ami Corporation Colored yarn object, process for producing the same, and fishing line
JP5029539B2 (ja) * 2007-09-04 2012-09-19 三菱マテリアル株式会社 多結晶シリコンの洗浄方法及び多結晶シリコンの製造方法
US20100024847A1 (en) * 2008-08-01 2010-02-04 Breese Ronald G Semiconductor wafer cleaning with dilute acids
KR101332922B1 (ko) * 2008-12-26 2013-11-26 미쓰비시 마테리알 가부시키가이샤 다결정 실리콘의 세정 방법 및 세정 장치 그리고 다결정 실리콘의 제조 방법
CN112599441A (zh) * 2020-11-30 2021-04-02 硅密芯镀(海宁)半导体技术有限公司 清洗***、晶圆清洗设备及晶圆浸润水洗方法
CN115945434B (zh) * 2022-12-28 2024-06-04 安徽富乐德长江半导体材料股份有限公司 一种可对去离子水进行回收的晶圆清洗快排槽

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03237717A (ja) * 1990-02-14 1991-10-23 Matsushita Electron Corp 半導体基板洗浄装置
US5730162A (en) * 1995-01-12 1998-03-24 Tokyo Electron Limited Apparatus and method for washing substrates
US6045624A (en) * 1996-09-27 2000-04-04 Tokyo Electron Limited Apparatus for and method of cleaning objects to be processed

Also Published As

Publication number Publication date
US20010015215A1 (en) 2001-08-23
FR2801815A1 (fr) 2001-06-08

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20070831