FR2800087A1 - Bonding different polymers comprises using compatible material, used for silicon chip cards in mobile phones, as intermediate layer between one polymer and adhesive layer applied to the other polymer - Google Patents
Bonding different polymers comprises using compatible material, used for silicon chip cards in mobile phones, as intermediate layer between one polymer and adhesive layer applied to the other polymer Download PDFInfo
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- FR2800087A1 FR2800087A1 FR9913489A FR9913489A FR2800087A1 FR 2800087 A1 FR2800087 A1 FR 2800087A1 FR 9913489 A FR9913489 A FR 9913489A FR 9913489 A FR9913489 A FR 9913489A FR 2800087 A1 FR2800087 A1 FR 2800087A1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
- B29C65/484—Moisture curing adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
- B29C66/026—Chemical pre-treatments
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
- B29C66/712—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined the composition of one of the parts to be joined being different from the composition of the other part
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
- C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
- B29C66/028—Non-mechanical surface pre-treatments, i.e. by flame treatment, electric discharge treatment, plasma treatment, wave energy or particle radiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
- B29C66/7316—Surface properties
- B29C66/73161—Roughness or rugosity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2017/00—Carriers for sound or information
- B29L2017/006—Memory cards, chip cards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Computer Hardware Design (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
PROCÉDÉ ET MOYENS POUR L'AMÉLIORATION DU COLLAGE ENTRE MATÉRIAUX POLYMÈRES, NOTAMMENT POUR CARTE À PUCE La présente invention concerne le collage de matériaux polymères entre eux, en particulier pour une application dans le domaine des cartes électroniques plus communément dénommées cartes à puce, avec contacts affleurants et/ou sans contact. The present invention relates to the bonding of polymeric materials to each other, in particular for an application in the field of electronic cards more commonly known as smart cards, with contacts. flush and / or contactless.
Bien qu'elle concerne de manière générale le collage entre eux de matériaux tels qu'envisagés plus loin, la présente invention sera décrite ci-après, pour simplifier, en référence à son application dans le secteur des cartes à puce. Although it generally relates to the bonding between them of materials as envisaged below, the present invention will be described below, for simplicity, with reference to its application in the sector of smart cards.
Pour la fabrication des cartes à puce avec micromodule, on utilise un matériau diélectrique comme support du micromodule qui, muni d'au moins une puce de circuits intégrés et de ses connexions avec des interfaces de communication, est encarté dans un corps de carte. For the manufacture of chip cards with micromodule, a dielectric material is used as support for the micromodule which, provided with at least one integrated circuit chip and its connections with communication interfaces, is inserted in a card body.
Ce support diélectrique est mis en oeuvre sous la forme d'un film dans lequel sont ensuite découpés les micromodules à reporter dans un corps de carte. This dielectric support is implemented in the form of a film from which the micromodules to be transferred are then cut out from a card body.
Les matériaux polymères que l'on utilise de nos jours pour la fabrication du film sont un polyamide, tel que par exemple le polyamide commercialement dénommé Kapton, et du verre époxy. Ces matériaux sont enduits d'un adhésif pour être laminés avec un film de cuivre, découpé mécaniquement ou chimiquement et sur lequel sont créés les contacts ISO de la carte à puce. The polymeric materials which are used today for the manufacture of the film are a polyamide, such as for example the polyamide commercially known as Kapton, and epoxy glass. These materials are coated with an adhesive to be laminated with a copper film, cut mechanically or chemically and on which the ISO contacts of the smart card are created.
Leur face opposée sert à l'application, après découpe au format d'un micromodule, d'un adhésif de type cyanoacrylate ou de type thermoactivable (également dénommé "hot melt"? pour l'encartage dudit micromodule. I1 faut noter qu'on entend ici par "thermoactivable" un adhésif activé par la chaleur, ce qui inclut les adhésifs plus communément dits thermofusibles et eux aussi englobés dans le concept d'adhésifs hot melt. Their opposite face is used for the application, after cutting in the format of a micromodule, of an adhesive of cyanoacrylate type or of thermoactivable type (also called "hot melt"? For the insertion of said micromodule. It should be noted that here understood by "thermoactivable" a heat activated adhesive, which includes adhesives more commonly known as hot melt and also included in the concept of hot melt adhesives.
or, un polyimide tel que le Kapton n'est pas adapté au collage avec des adhésifs thermoactivables, car sa surface est très lisse et possède un faible pouvoir d'accrochage. Il adhère en revanche bien avec des colles à base de cyanoacrylate. However, a polyimide such as Kapton is not suitable for bonding with heat-activated adhesives, because its surface is very smooth and has a low bonding power. On the other hand, it adheres well with cyanoacrylate adhesives.
Le verre époxy non traité colle bien avec des adhésifs de type cyanoacrylate, mais un sablage du verre époxy est nécessaire pour un collage avec un adhésif thermoactivable. Untreated epoxy glass sticks well with cyanoacrylate type adhesives, but sandblasting of the epoxy glass is necessary for bonding with a heat-activated adhesive.
Les matériaux susdits étant chers, on a alors envisagé de leur substituer des matériaux moins onéreux, comme par exemple un polyéthylènetéréphtalate (PET) ou un polyéthylènenaphténate (PEN). Mais, malgré la grande tenue des traitements de surface disponibles sur le marché, ces matériaux alternatifs n'offrent pas de surface universelle pouvant être traitée par un adhésif aussi bien de type cyanoacrylate que de type thermoactivable. Since the aforementioned materials are expensive, it has therefore been envisaged to replace them with less expensive materials, such as, for example, a polyethyleneterephthalate (PET) or a polyethylenenaphthenate (PEN). However, despite the high resistance of surface treatments available on the market, these alternative materials do not offer a universal surface which can be treated with an adhesive both of cyanoacrylate type and of heat-activated type.
L'invention propose un procédé et des moyens pour réaliser un contrecollage de matériaux polymères différents, aussi bien par collage avec un cyanoacrylate que par collage de type thermoactivable, ledit procédé et lesdits moyens utilisant une matière de compatibilisation destinée à constituer une couche intermédiaire entre l'un des matériaux polymères concernés et un adhésif de type cyanoacrylate ou de type thermoactivable appliqué sur l'autre matériau polymère. The invention provides a method and means for making a lamination of different polymer materials, both by bonding with a cyanoacrylate and by bonding of the heat-activated type, said method and said means using a compatibilization material intended to constitute an intermediate layer between the one of the polymer materials concerned and an adhesive of cyanoacrylate type or of thermoactivable type applied to the other polymer material.
L'invention a ainsi pour premier objet un tel procédé, comprenant l'intercalation, entre deux matériaux polymères différents à contrecoller, d'une matière de compatibilisation constituant une couche intermédiaire entre un premier matériau polymère et une matière adhésive de type cyanoacrylate ou de type thermoactivable appliquée sur un deuxième matériau polymère pour le contrecollage au premier. The first object of the invention is thus such a method, comprising the intercalation, between two different polymeric materials to be laminated, of a compatibilization material constituting an intermediate layer between a first polymeric material and an adhesive material of cyanoacrylate type or of type thermoactivable applied on a second polymeric material for the lamination to the first.
Dans une forme de réalisation, l'invention a pour objet un procédé tel que susdit pour le contrecollage de deux matériaux polymères différents, dont l'un peut être collé avec un adhésif de type cyanoacrylate ou avec un adhésif thermoactivable, alors que l'autre n'adhère pas bien au même adhésif. In one embodiment, the invention relates to a process as mentioned above for the lamination of two different polymer materials, one of which can be bonded with an adhesive of cyanoacrylate type or with a heat-activated adhesive, while the other does not adhere well to the same adhesive.
Selon l'invention, on applique avantageusement ladite matière de compatibilisation de préférence par enduction sur la face du premier matériau polymère à faire adhérer au deuxième, tandis que l'adhésif du type choisi est appliqué sur la face à contrecoller du deuxième matériau plastique ou, en variante, sur ladite couche d'enduction. L'opération d'enduction peut être réalisée par tout moyen approprié connu de l'homme du métier. According to the invention, said compatibilization material is preferably applied preferably by coating on the face of the first polymer material to be adhered to the second, while the adhesive of the chosen type is applied to the face to be laminated with the second plastic material or, alternatively, on said coating layer. The coating operation can be carried out by any suitable means known to those skilled in the art.
La matière de compatibilisation mise en oeuvre dans ce procédé vise à augmenter l'adhésivité d'un matériau à faible énergie de surface, constituant l'un des matériaux à contrecoller. A cette fin, il est avantageux qu'elle apporte aussi bien des sites d'ancrage mécanique que des sites actifs choisis notamment parmi les groupes -C=O, -COOR, =NH et -NH2. The compatibilization material used in this process aims to increase the adhesiveness of a material with low surface energy, constituting one of the materials to be laminated. To this end, it is advantageous that it provides both mechanical anchoring sites and active sites chosen in particular from the groups -C = O, -COOR, = NH and -NH2.
Par l'expression "apte à apporter des sites d'ancrage mécanique", on entend l'aptitude à augmenter la rugosité du matériau ainsi enduit. De tels sites sont présents dans une matière de compatibilisation dont la structure physique comprend au niveau moléculaire des ramifications lui conférant à l'échelle macroscopique un déploiement tridimensionnel avec indentations, donnant à une couche de matière de compatibilisation ainsi constituée une rugosité et/ou un pouvoir d'interpénétration facilitant son ancrage avec un matériau adjacent. Par l'expression "apte à apporter des sites actifs", cri entend l'aptitude à augmenter l'énergie de surface du matériau ainsi enduit, en augmentant le nombre de sites actifs constituant des sites de pontage. By the expression "capable of providing mechanical anchoring sites" is meant the ability to increase the roughness of the material thus coated. Such sites are present in a compatibilization material whose physical structure comprises at the molecular level ramifications conferring on the macroscopic scale a three-dimensional deployment with indentations, giving a layer of compatibilization material thus constituted a roughness and / or a power interpenetration facilitating its anchoring with an adjacent material. By the expression "capable of providing active sites", cry means the ability to increase the surface energy of the material thus coated, by increasing the number of active sites constituting bridging sites.
La matière de compatibilisation mise en oeuvre selon l'invention est de préférence choisie parmi les polymères ou les copolymères dont au moins un monomère a une fonctionnalité strictement supérieure à 2. Les polymères ou les copolymères ainsi constitués ont des fonctions libres, et/ou des fonctions protégées et libérables, aptes à intervenir dans la réticulation des chaînes polymères formant une telle matière de compatibilisation. The compatibilization material used according to the invention is preferably chosen from polymers or copolymers of which at least one monomer has a functionality strictly greater than 2. The polymers or copolymers thus formed have free functions, and / or protected and releasable functions, able to intervene in the crosslinking of the polymer chains forming such a compatibilization material.
Sans vouloir être lié par une quelconque théorie, on estime que les matières de compatibilisation ont pour rôle d'augmenter l'adhésivité d'un matériau à faible énergie de surface, en augmentant cette énergie de surface du dit matériau polymère, de manière à le rendre plus mouillable. En soi, cela pourrait conduire à utiliser un adhésif quelconque, pour lequel le matériau concerné aurait une affinité, seul ou via un primaire spécifique pour ledit matériau. Il s'est cependant avéré que les matières de compatibilisation thermoplastiques ou à phase réticulée généreraient un état poisseux (en anglais "tacle") lors d'une élévation de température. on préfère par conséquent les matières de compatibilisation thermodurcissables, et parmi elles de préférence des matières thermoréticulables et/ou photoréticulables. Without wishing to be bound by any theory, it is believed that the compatibilization materials have the role of increasing the adhesiveness of a material with low surface energy, by increasing this surface energy of said polymer material, so as to make it more wettable. In itself, this could lead to the use of any adhesive, for which the material concerned would have an affinity, alone or via a specific primer for said material. However, it has been found that the thermoplastic or cross-linked compatibilization materials would generate a tacky state (in English "tackle") during a rise in temperature. thermosetting compatibilization materials are therefore preferred, and among them preferably thermosettable and / or photocrosslinkable materials.
En pratique, ladite matière de compatibilisation peut être choisie notamment, mais non limitativement, parmi les résines de type amide, les résines phénoliques, les résines époxy, qui sont thermoréticulables, et les résines de type acrylamide, acrylate et polyméthylméthacrylate, qui sont photo- réticulables seules ou en présence d'activateur UV, les résines phénoliques réticulées, et les compositions d'acrylonitrile-butadiène-styrène (ABS) en phase solvant, ainsi que leurs mélanges. In practice, said compatibilization material can be chosen in particular, but not limited to, from amide-type resins, phenolic resins, epoxy resins, which are heat-crosslinkable, and acrylamide, acrylate and polymethylmethacrylate type resins, which are photo- crosslinkable alone or in the presence of UV activator, crosslinked phenolic resins, and acrylonitrile-butadiene-styrene (ABS) compositions in solvent phase, as well as their mixtures.
En variante, on peut combiner avec une autre matière de compatibilisation d'un type susdit une ou plusieurs autres matières ayant d'autres fonctions, telles que par exemple de l'ABS en phase solvant, permettant une bonne compatibilité avec un corps de carte qui serait lui même en ABS. As a variant, it is possible to combine with another compatibilization material of the aforementioned type one or more other materials having other functions, such as for example ABS in the solvent phase, allowing good compatibility with a card body which would be ABS itself.
La quantité ou la proportion de matière de compatibilisation à mettre en oeuvre n'est pas critique et dépend de chaque cas concret d'application. Elle peut être déterminée par l'homme du métier au moyen d'essais préalables, réalisés selon des méthodologies connues et permettant de définir une gamme efficace et des gammes avantageuses, tant en terme d'efficacité qu'en terme de coût En pratique, il est recommandé que la couche de matière de compatibilisation appliquée selon l'invention ait une épaisseur d'environ 1 à 5 gym, de préférence une épaisseur d'environ 1 gym, dans l'application illustrative considérée ici. The quantity or the proportion of compatibilization material to be used is not critical and depends on each concrete application case. It can be determined by a person skilled in the art by means of preliminary tests, carried out according to known methodologies and making it possible to define an effective range and advantageous ranges, both in terms of efficiency and in terms of cost. It is recommended that the layer of compatibilization material applied according to the invention has a thickness of approximately 1 to 5 gym, preferably a thickness of approximately 1 gym, in the illustrative application considered here.
Dans une forme de mise en oeuvre préférée, ladite matière de compatibilisation est réticulée. On évite ainsi d'éventuels problèmes d'adhérence, notamment lors des différentes opérations d'assemblage de l'électronique des cartes à puce, qui nécessitent pour la plupart une mise en température de l'ensemble. Cette réticulation peut être effectuée de façon connue, soit par activation thermique, soit par activation photonique, par exemple au moyen d'un rayonnement UV ou autre. Une telle activation induit un pontage chimique entre plusieurs chaînes de polymère, par condensation ou complexation faisant intervenir les groupes présents sur les sites actifs susdits. In a preferred embodiment, said compatibilization material is crosslinked. This avoids possible adhesion problems, in particular during the various assembly operations of the electronics of the smart cards, which for the most part require a temperature setting of the assembly. This crosslinking can be carried out in a known manner, either by thermal activation, or by photonic activation, for example by means of UV or other radiation. Such activation induces a chemical bridging between several polymer chains, by condensation or complexation involving the groups present on the aforementioned active sites.
Dans une variante de réalisation, la matière de compatibilisation peut être appliquée sur les deux faces à contrecoller, sous forme non-réticulée sur l'une, et sous forme non-réticulée ou de préférence réticulée sur l'autre, tandis que l'adhésif du type choisi est ensuite appliqué sur l'une des surfaces ainsi traitées. En variante, on peut également utiliser une telle matière non-réticulable, mais ne présentant pas d'adhésivité ou caractère collant aux températures auxquelles est mis en oeuvre le processus d'assemblage pour contrecollage. In an alternative embodiment, the compatibilization material can be applied to the two faces to be laminated, in non-crosslinked form on one, and in non-crosslinked form or preferably crosslinked on the other, while the adhesive of the chosen type is then applied to one of the surfaces thus treated. As a variant, it is also possible to use such a non-crosslinkable material, but having no tackiness or stickiness at the temperatures at which the assembly process for laminating is carried out.
Dans une forme de réalisation avantageuse, on peut soumettre celui des matériaux plastiques qui est destiné à recevoir directement la matière de compatibilisation à un traitement par effet corona avant son enduction avec ladite matière. On améliore ainsi encore l'adhérence de ladite matière sur le matériau plastique concerné, ce qui permet par exemple de traiter selon l'invention des surfaces plus difficiles à soumettre au contrecollage envisagé, comme par exemple du PET non-traité. In an advantageous embodiment, that of plastic materials which is intended to directly receive the compatibilization material can be subjected to a treatment by corona effect before its coating with said material. This further improves the adhesion of said material on the plastic material concerned, which allows for example to treat according to the invention surfaces more difficult to subject to the envisaged lamination, such as untreated PET.
Selon une autre variante, on peut soumettre à une attaque chimique la surface destinée à recevoir la matière de compatibilisation selon l'invention. According to another variant, the surface intended to receive the compatibilization material according to the invention can be subjected to a chemical attack.
Dans une forme préférée de réalisation du procédé selon l'invention, on effectue ladite enduction de la matière de compatibilisation en coordination avec une enduction telle que susmentionnée de l'autre face du dit matériau. In a preferred embodiment of the method according to the invention, said coating of the compatibilization material is carried out in coordination with a coating as mentioned above on the other face of said material.
L'invention permet en outre de conserver un matériau de type polyamide, tel que le produit dénommé Kapton, pour le film de base à coller sur un autre matériau plastique. Dans l'application envisagée à titre illustratif, ledit polyamide, ou en alternative un verre époxy, est en pratique le matériau d'un film diélectrique destiné à constituer le support d'un module à encarter par collage sur un corps de carte à puce qui, lui, peut être en ABS, PVC, composites ABS-PVC, polycarbonate, composites ABS-polycarbonate, ou autres. Si une technique conforme à l'invention avait été envisagée, on aurait raisonnablement pu s'attendre à ce qu'il en résulte un coût supplémentaire et des contraintes techniques rendant l'ensemble du procédé moins économique. The invention also makes it possible to keep a polyamide-type material, such as the product called Kapton, for the base film to be bonded to another plastic material. In the application envisaged by way of illustration, said polyamide, or alternatively an epoxy glass, is in practice the material of a dielectric film intended to constitute the support of a module to be inserted by gluing on a smart card body which , it can be ABS, PVC, ABS-PVC composites, polycarbonate, ABS-polycarbonate composites, or others. If a technique in accordance with the invention had been envisaged, it could reasonably have been expected to result in additional cost and technical constraints making the whole process less economical.
Au contraire, il s'est avéré que l'ajout de matière de compatibilisation selon l'invention apporte sa contribution propre à cet ensemble et autorise une réduction de l'épaisseur du film de base. Cette diminution d'épaisseur d'un des matériaux polymères peut être compensée par la couche de matière de compatibilisation, et cela permet de réaliser une économie substantielle sur ledit matériau polymère, qui est dans ce cas un matériau coûteux. On the contrary, it turned out that the addition of compatibilization material according to the invention makes its own contribution to this set and allows a reduction in the thickness of the base film. This reduction in thickness of one of the polymer materials can be compensated for by the layer of compatibilization material, and this makes it possible to achieve a substantial saving on said polymer material, which in this case is an expensive material.
La technique selon l'invention procure ainsi une solution économique pour contrecoller deux matériaux plastiques différents, dont l'un au moins possède une faible énergie de surface, respectivement avec un adhésif de type cyanoacrylate ou avec un adhésif de type thermoactivable. Plus particulièrement, pour ce qui est de l'application aux cartes à puce avec micromodule, on peut ainsi obtenir selon l'invention une surface du support de module pouvant être collée correctement aussi bien avec une colle liquide au cyanoacrylate qu'avec un adhésif thermoactivable. De façon plus avantageuse encore, l'invention permet d'atteindre une efficacité et une qualité de collage inhabituelles, avec un tel traitement peu coûteux et même avec des matériaux, notamment des matériaux de support du module de carte à puce, bon marché. The technique according to the invention thus provides an economical solution for laminating two different plastic materials, at least one of which has a low surface energy, respectively with an adhesive of cyanoacrylate type or with an adhesive of heat-activated type. More particularly, as regards the application to smart cards with micromodule, it is thus possible according to the invention to obtain a surface of the module support which can be correctly bonded both with a cyanoacrylate liquid adhesive and with a heat-activated adhesive. . Even more advantageously, the invention makes it possible to achieve an unusual efficiency and quality of bonding, with such an inexpensive treatment and even with materials, in particular support materials for the chip card module, inexpensive.
De plus, pour la mise en oeuvre du procédé selon l'invention pour l'encartage de modules de cartes à puce avec ou sans contacts affleurants, on peut utiliser une ligne d'enduction classiquement employée pour ces produits. Dans tous les cas, l'enduction d'une matière de compatibilisation selon l'invention peut être faite en même temps que le traitement classique éventuel de l'autre face du matériau sur lequel cette matière est appliquée, à savoir l'enduction de cette autre face avec un adhésif non-réticulé avant lamination avec un film de cuivre dans le cas de la fabrication des modules de cartes à puce avec contacts affleurants. In addition, for the implementation of the method according to the invention for the insertion of smart card modules with or without flush contacts, it is possible to use a coating line conventionally used for these products. In all cases, the coating of a compatibilization material according to the invention can be done at the same time as the possible conventional treatment of the other face of the material to which this material is applied, namely the coating of this material. other side with a non-crosslinked adhesive before lamination with a copper film in the case of the manufacture of smart card modules with flush contacts.
Dans la variante évoquée plus haut mettant en oeuvre un traitement par effet corona, on profite pleinement de ce traitement corona, puisqu'il peut être réalisé immédiatement avant l'enduction de matière de compatibilisation et permet alors le traitement de surfaces plus difficiles à traiter. Le traitement de surface ainsi réalisé est stable dans le temps, contrairement au traitement de surface par simple effet corona classique, qui ne l'est pas et dont l'effet diminue avec le temps. In the variant mentioned above implementing a treatment by corona effect, this corona treatment is fully taken advantage of, since it can be carried out immediately before the coating of compatibilization material and then allows the treatment of surfaces which are more difficult to treat. The surface treatment thus produced is stable over time, unlike the surface treatment by simple conventional corona effect, which is not and whose effect decreases over time.
Le traitement de surface avant contrecollage selon l'invention est économique, puisqu'il peut être effectué en ligne, comme on l'a indiqué plus haut, contrairement aux traitements classiques par sablage ou avec un plasma, qui nécessitent une étape et un équipement spécifiques. The surface treatment before laminating according to the invention is economical, since it can be carried out online, as indicated above, unlike conventional treatments by sandblasting or with a plasma, which require a specific step and equipment. .
L'invention a également pour objet une matière de compatibilisation telle que définie plus haut, pour améliorer le contrecollage de deux matériaux plastiques différents, consistant en une matière de compatibilisation apte à former une couche intermédiaire adhérente entre un premier matériau plastique et une matière adhésive de type cyanoacrylate ou de type thermoactivable appliquée sur le deuxième matériau plastique à faire adhérer au premier. The subject of the invention is also a compatibilization material as defined above, to improve the lamination of two different plastic materials, consisting of a compatibilization material capable of forming an adherent intermediate layer between a first plastic material and an adhesive material of cyanoacrylate type or thermoactivable type applied to the second plastic material to adhere to the first.
Selon une forme de réalisation préférée, ladite matière de compatibilisation est réticulée de façon à ne pas posséder d'adhérence propre dans les conditions de l'assem',olaae des deux matériaux plastiques l'un contre l'autre. I-L a réticulation de cette matière peut s'effectuer par exemple par apport thermique ou par un rayonnement ùV. According to a preferred embodiment, said compatibilization material is crosslinked so as not to have its own adhesion under the conditions of the assembly, olaae of the two plastic materials against each other. I-L crosslinking of this material can be done for example by thermal input or by UV radiation.
Dans la présente description, on envisage pour simplifier deux matériaux différents à contrecoller. I1 est cependant clair pour l'homme du métier que le cas de plus de deux matériaux est également envisageable. Il suffit alors d'appliquer le traitement selon l'invention à une ou plusieurs des paires de matériaux constituant de tels matériaux multiples. In the present description, it is envisaged to simplify two different materials to be laminated. It is however clear to a person skilled in the art that the case of more than two materials is also possible. It then suffices to apply the treatment according to the invention to one or more of the pairs of materials constituting such multiple materials.
L'invention a ainsi également pour objet un module à circuit intégré comportant un film diélectrique et un circuit intégré solidaire du film diélectrique, destiné à être fixé par collage avec un support polymère, ledit module étant muni d'une couche de matière de compatibilisation apte à adhérer à au moins un adhésif choisi parmi un adhésif de type cyanoacrylate et un adhésif de type thermoactivable, tandis que ladite matière de compatibilisation est de préférence telle que définie plus haut. The invention therefore also relates to an integrated circuit module comprising a dielectric film and an integrated circuit integral with the dielectric film, intended to be fixed by bonding with a polymer support, said module being provided with a layer of compatibilization material suitable to adhere to at least one adhesive chosen from an adhesive of cyanoacrylate type and an adhesive of thermoactivable type, while said compatibilization material is preferably as defined above.
Dans une forme de réalisation avantageuse du dit module, ladite matière de compatibilisation est réticulée, de façon à ne pas posséder d'adhérence propre dans les conditions de l'assemblage l'un contre l'autre, par l'intermédiaire d'un adhésif, des deux matériaux polymères respectivement du module et du support polymère formant corps de carte. In an advantageous embodiment of said module, said compatibilization material is crosslinked, so as not to have its own adhesion under the conditions of assembly against each other, by means of an adhesive , of the two polymer materials respectively of the module and of the polymer support forming the card body.
L'invention a en outre pour objet une carte à puce comportant un tel module de circuit intégré, fixé par collage au moyen d'un adhésif de type cyanoacrylate ou de type thermoactivable. The invention further relates to a smart card comprising such an integrated circuit module, fixed by bonding by means of an adhesive of cyanoacrylate type or of thermoactivable type.
A titre illustratif, on a réalisé des cartes à puce par encartage d'un module électronique comportant support en polyimide de dénomination commerciale Kapton, avec un adhésif respectivement de type cyanoacrylate et thermoac-ivable, dans un corps de carte en PET thermostabilisé (produit commercialisé par la société Autotype sous la dénomination Autotex), en mettant en oeuvre selon l'invention une matière de compatibilisation de type acrylate photoréticulable, sur une épaisseur d'environ 1 gym. On a obtenu des très bons résultats aussi bien en encartage de type cyanoacrylate (bonne cinétique et force d'arrachement élevée) qu'en encartage thermoactivable. By way of illustration, smart cards have been produced by inserting an electronic module comprising a polyimide support with the commercial name Kapton, with an adhesive of cyanoacrylate and thermoac-ivable type respectively, in a body of thermostabilized PET card (product sold by the company Autotype under the name Autotex), using according to the invention a compatibilization material of photocrosslinkable acrylate type, over a thickness of approximately 1 gym. Very good results have been obtained both in cyanoacrylate type inserting (good kinetics and high tearing force) as in thermoactivable inserting.
On peut également appliquer le procédé selon l'invention avec de très bons résultats sur des matériaux polymères de type polyétherimide (PEI), polybutyltéréphtalate (PBT), polyamide (PI), polyamide (PA), polyalcool vinylique) (PVA), ou encore des copolymères de cyclo-oléfines (COC, comme par exemple le produit commercialisé par la société Hoechst sous la dénomination Topas COC), entre autres. The process according to the invention can also be applied with very good results on polymer materials of the polyetherimide (PEI), polybutylterephthalate (PBT), polyamide (PI), polyamide (PA), polyvinyl alcohol) (PVA) type, or else cyclo-olefin copolymers (COC, such as for example the product sold by the company Hoechst under the name Topas COC), among others.
L'invention peut s'appliquer à des cartes à puce avec contacts affleurants, à des cartes avec module d'identification d'abonné pour téléphones portables, dites cartes SIM ("Subscriber Identity Module") et plus communément dénommées "plugs", ainsi qu'à des cartes sans contact ou à des cartes de type hybride.The invention can be applied to smart cards with flush contacts, to cards with subscriber identification module for mobile phones, called SIM cards ("Subscriber Identity Module") and more commonly known as "plugs", as well than contactless cards or hybrid type cards.
Claims (27)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9913489A FR2800087A1 (en) | 1999-10-26 | 1999-10-26 | Bonding different polymers comprises using compatible material, used for silicon chip cards in mobile phones, as intermediate layer between one polymer and adhesive layer applied to the other polymer |
AU76723/00A AU7672300A (en) | 1999-10-26 | 2000-10-04 | Method and means for improving bonding between polymer materials, in particular for chip card |
PCT/FR2000/002749 WO2001030929A1 (en) | 1999-10-26 | 2000-10-04 | Method and means for improving bonding between polymer materials, in particular for chip card |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9913489A FR2800087A1 (en) | 1999-10-26 | 1999-10-26 | Bonding different polymers comprises using compatible material, used for silicon chip cards in mobile phones, as intermediate layer between one polymer and adhesive layer applied to the other polymer |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2800087A1 true FR2800087A1 (en) | 2001-04-27 |
Family
ID=9551466
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9913489A Withdrawn FR2800087A1 (en) | 1999-10-26 | 1999-10-26 | Bonding different polymers comprises using compatible material, used for silicon chip cards in mobile phones, as intermediate layer between one polymer and adhesive layer applied to the other polymer |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU7672300A (en) |
FR (1) | FR2800087A1 (en) |
WO (1) | WO2001030929A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2919741A1 (en) * | 2007-08-03 | 2009-02-06 | Arjowiggins Licensing Soc Par | METHOD FOR MANUFACTURING AN INSERT COMPRISING AN RFID DEVICE |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5135598A (en) * | 1987-08-13 | 1992-08-04 | Minnesota Mining And Manufacturing Company | Priming polymeric surfaces for cyanoacrylate adhesives |
EP0527438A2 (en) * | 1991-08-14 | 1993-02-17 | Orga Kartensysteme GmbH | Record carrier with adhesively applied circuit carrier |
WO1995025138A1 (en) * | 1994-03-14 | 1995-09-21 | Henkel Kommanditgesellschaft Auf Aktien | Aqueous polyurethane primer |
WO1998006062A1 (en) * | 1996-08-05 | 1998-02-12 | Gemplus S.C.A. | Improvement to a method for making smart cards, and resulting cards |
-
1999
- 1999-10-26 FR FR9913489A patent/FR2800087A1/en not_active Withdrawn
-
2000
- 2000-10-04 WO PCT/FR2000/002749 patent/WO2001030929A1/en active Application Filing
- 2000-10-04 AU AU76723/00A patent/AU7672300A/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5135598A (en) * | 1987-08-13 | 1992-08-04 | Minnesota Mining And Manufacturing Company | Priming polymeric surfaces for cyanoacrylate adhesives |
EP0527438A2 (en) * | 1991-08-14 | 1993-02-17 | Orga Kartensysteme GmbH | Record carrier with adhesively applied circuit carrier |
WO1995025138A1 (en) * | 1994-03-14 | 1995-09-21 | Henkel Kommanditgesellschaft Auf Aktien | Aqueous polyurethane primer |
WO1998006062A1 (en) * | 1996-08-05 | 1998-02-12 | Gemplus S.C.A. | Improvement to a method for making smart cards, and resulting cards |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2919741A1 (en) * | 2007-08-03 | 2009-02-06 | Arjowiggins Licensing Soc Par | METHOD FOR MANUFACTURING AN INSERT COMPRISING AN RFID DEVICE |
WO2009022078A2 (en) * | 2007-08-03 | 2009-02-19 | Arjowiggins Security | Method for producing an insert including an rfid device |
WO2009022078A3 (en) * | 2007-08-03 | 2009-04-09 | Arjowiggins Licensing Sas | Method for producing an insert including an rfid device |
Also Published As
Publication number | Publication date |
---|---|
AU7672300A (en) | 2001-05-08 |
WO2001030929A1 (en) | 2001-05-03 |
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