FR2789224B1 - TRAINING ON BOARD OF A SEMICONDUCTOR WAFER - Google Patents
TRAINING ON BOARD OF A SEMICONDUCTOR WAFERInfo
- Publication number
- FR2789224B1 FR2789224B1 FR9901122A FR9901122A FR2789224B1 FR 2789224 B1 FR2789224 B1 FR 2789224B1 FR 9901122 A FR9901122 A FR 9901122A FR 9901122 A FR9901122 A FR 9901122A FR 2789224 B1 FR2789224 B1 FR 2789224B1
- Authority
- FR
- France
- Prior art keywords
- training
- board
- semiconductor wafer
- wafer
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02021—Edge treatment, chamfering
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9901122A FR2789224B1 (en) | 1999-01-28 | 1999-01-28 | TRAINING ON BOARD OF A SEMICONDUCTOR WAFER |
PCT/FR2000/000168 WO2000045428A1 (en) | 1999-01-28 | 2000-01-25 | Method for levelling the edge of a semiconductor wafer and corresponding levelling machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9901122A FR2789224B1 (en) | 1999-01-28 | 1999-01-28 | TRAINING ON BOARD OF A SEMICONDUCTOR WAFER |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2789224A1 FR2789224A1 (en) | 2000-08-04 |
FR2789224B1 true FR2789224B1 (en) | 2003-10-03 |
Family
ID=9541456
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9901122A Expired - Fee Related FR2789224B1 (en) | 1999-01-28 | 1999-01-28 | TRAINING ON BOARD OF A SEMICONDUCTOR WAFER |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR2789224B1 (en) |
WO (1) | WO2000045428A1 (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH566643A5 (en) * | 1973-10-11 | 1975-09-15 | Bbc Brown Boveri & Cie | |
JPS62287625A (en) * | 1986-06-06 | 1987-12-14 | Hitachi Ltd | Spin type etching device |
JPH02130922A (en) * | 1988-11-11 | 1990-05-18 | Toshiba Corp | Etching equipment for semiconductor substrate |
JPH0661215A (en) * | 1992-08-06 | 1994-03-04 | Mitsubishi Electric Corp | Treatment device for thin board body like wafer |
JP3111300B2 (en) * | 1993-10-20 | 2000-11-20 | 株式会社日立製作所 | Sealed spin etching system for semiconductor devices |
-
1999
- 1999-01-28 FR FR9901122A patent/FR2789224B1/en not_active Expired - Fee Related
-
2000
- 2000-01-25 WO PCT/FR2000/000168 patent/WO2000045428A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
FR2789224A1 (en) | 2000-08-04 |
WO2000045428A1 (en) | 2000-08-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20070930 |