FR2781083B1 - Interconnexion de dispositifs electroniques integres haute tension - Google Patents
Interconnexion de dispositifs electroniques integres haute tensionInfo
- Publication number
- FR2781083B1 FR2781083B1 FR9808820A FR9808820A FR2781083B1 FR 2781083 B1 FR2781083 B1 FR 2781083B1 FR 9808820 A FR9808820 A FR 9808820A FR 9808820 A FR9808820 A FR 9808820A FR 2781083 B1 FR2781083 B1 FR 2781083B1
- Authority
- FR
- France
- Prior art keywords
- interconnection
- high voltage
- electronic devices
- integrated electronic
- voltage integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9808820A FR2781083B1 (fr) | 1998-07-09 | 1998-07-09 | Interconnexion de dispositifs electroniques integres haute tension |
US09/743,148 US6433416B1 (en) | 1998-07-09 | 1999-07-08 | Interconnection for integrated high voltage electronic devices |
PCT/FR1999/001661 WO2000003438A1 (fr) | 1998-07-09 | 1999-07-08 | Interconnexion de dispositifs electroniques integres haute tension |
EP99929441A EP1116272A1 (fr) | 1998-07-09 | 1999-07-08 | Interconnexion de dispositifs electroniques integres haute tension |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9808820A FR2781083B1 (fr) | 1998-07-09 | 1998-07-09 | Interconnexion de dispositifs electroniques integres haute tension |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2781083A1 FR2781083A1 (fr) | 2000-01-14 |
FR2781083B1 true FR2781083B1 (fr) | 2002-09-06 |
Family
ID=9528472
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9808820A Expired - Fee Related FR2781083B1 (fr) | 1998-07-09 | 1998-07-09 | Interconnexion de dispositifs electroniques integres haute tension |
Country Status (4)
Country | Link |
---|---|
US (1) | US6433416B1 (fr) |
EP (1) | EP1116272A1 (fr) |
FR (1) | FR2781083B1 (fr) |
WO (1) | WO2000003438A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106686963B (zh) * | 2016-12-20 | 2019-05-24 | Oppo广东移动通信有限公司 | 功能器件和终端设备 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0274039A (ja) * | 1988-09-09 | 1990-03-14 | Texas Instr Japan Ltd | 電子回路装置 |
EP0482194A4 (en) * | 1989-06-26 | 1992-05-06 | Oki Electric Industry Co., Ltd. | Wiring structure of semiconductor chip |
JP3004083B2 (ja) * | 1991-06-21 | 2000-01-31 | 沖電気工業株式会社 | 半導体装置及びその製造装置 |
US5382831A (en) * | 1992-12-14 | 1995-01-17 | Digital Equipment Corporation | Integrated circuit metal film interconnect having enhanced resistance to electromigration |
US5689139A (en) * | 1995-09-11 | 1997-11-18 | Advanced Micro Devices, Inc. | Enhanced electromigration lifetime of metal interconnection lines |
-
1998
- 1998-07-09 FR FR9808820A patent/FR2781083B1/fr not_active Expired - Fee Related
-
1999
- 1999-07-08 US US09/743,148 patent/US6433416B1/en not_active Expired - Lifetime
- 1999-07-08 WO PCT/FR1999/001661 patent/WO2000003438A1/fr active Application Filing
- 1999-07-08 EP EP99929441A patent/EP1116272A1/fr not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
US6433416B1 (en) | 2002-08-13 |
FR2781083A1 (fr) | 2000-01-14 |
WO2000003438A1 (fr) | 2000-01-20 |
EP1116272A1 (fr) | 2001-07-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20160331 |