FR2781082B1 - Structure semiconductrice en couche mince comportant une couche de repartition de chaleur - Google Patents
Structure semiconductrice en couche mince comportant une couche de repartition de chaleurInfo
- Publication number
- FR2781082B1 FR2781082B1 FR9808919A FR9808919A FR2781082B1 FR 2781082 B1 FR2781082 B1 FR 2781082B1 FR 9808919 A FR9808919 A FR 9808919A FR 9808919 A FR9808919 A FR 9808919A FR 2781082 B1 FR2781082 B1 FR 2781082B1
- Authority
- FR
- France
- Prior art keywords
- layer
- heat
- semiconductor thin
- distributing
- layer structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Element Separation (AREA)
- Recrystallisation Techniques (AREA)
- Thin Film Transistor (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9808919A FR2781082B1 (fr) | 1998-07-10 | 1998-07-10 | Structure semiconductrice en couche mince comportant une couche de repartition de chaleur |
KR1020017000370A KR100662694B1 (ko) | 1998-07-10 | 1999-07-08 | 열 분산층을 포함하는 박막 반도체 구조 |
PCT/FR1999/001659 WO2000003429A1 (fr) | 1998-07-10 | 1999-07-08 | Structure semiconductrice en couche mince comportant une couche de repartition de chaleur |
JP2000559589A JP2002525839A (ja) | 1998-07-10 | 1999-07-08 | 熱伝導層を有する薄膜層型半導体構造体 |
EP99929439A EP1103072A1 (fr) | 1998-07-10 | 1999-07-08 | Structure semiconductrice en couche mince comportant une couche de repartition de chaleur |
US10/093,889 US20020089016A1 (en) | 1998-07-10 | 2002-03-11 | Thin layer semi-conductor structure comprising a heat distribution layer |
US10/928,057 US7300853B2 (en) | 1998-07-10 | 2004-09-02 | Thin layer semi-conductor structure comprising a heat distribution layer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9808919A FR2781082B1 (fr) | 1998-07-10 | 1998-07-10 | Structure semiconductrice en couche mince comportant une couche de repartition de chaleur |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2781082A1 FR2781082A1 (fr) | 2000-01-14 |
FR2781082B1 true FR2781082B1 (fr) | 2002-09-20 |
Family
ID=9528546
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9808919A Expired - Fee Related FR2781082B1 (fr) | 1998-07-10 | 1998-07-10 | Structure semiconductrice en couche mince comportant une couche de repartition de chaleur |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1103072A1 (fr) |
JP (1) | JP2002525839A (fr) |
KR (1) | KR100662694B1 (fr) |
FR (1) | FR2781082B1 (fr) |
WO (1) | WO2000003429A1 (fr) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2809867B1 (fr) * | 2000-05-30 | 2003-10-24 | Commissariat Energie Atomique | Substrat fragilise et procede de fabrication d'un tel substrat |
FR2816445B1 (fr) | 2000-11-06 | 2003-07-25 | Commissariat Energie Atomique | Procede de fabrication d'une structure empilee comprenant une couche mince adherant a un substrat cible |
US6956268B2 (en) | 2001-05-18 | 2005-10-18 | Reveo, Inc. | MEMS and method of manufacturing MEMS |
US7045878B2 (en) | 2001-05-18 | 2006-05-16 | Reveo, Inc. | Selectively bonded thin film layer and substrate layer for processing of useful devices |
FR2826378B1 (fr) * | 2001-06-22 | 2004-10-15 | Commissariat Energie Atomique | Structure composite a orientation cristalline uniforme et procede de controle de l'orientation cristalline d'une telle structure |
US7163826B2 (en) | 2001-09-12 | 2007-01-16 | Reveo, Inc | Method of fabricating multi layer devices on buried oxide layer substrates |
US6875671B2 (en) | 2001-09-12 | 2005-04-05 | Reveo, Inc. | Method of fabricating vertical integrated circuits |
JP5032743B2 (ja) * | 2002-09-18 | 2012-09-26 | ソワテク | バッファ層を有しないウエハからの緩和された有用層の形成 |
FR2851079B1 (fr) * | 2003-02-12 | 2005-08-26 | Soitec Silicon On Insulator | Structure semi-conductrice sur substrat a forte rugosite |
US6982210B2 (en) | 2003-07-10 | 2006-01-03 | S.O.I.Tec Silicon On Insulator Technologies S.A. | Method for manufacturing a multilayer semiconductor structure that includes an irregular layer |
JP4641817B2 (ja) * | 2005-02-09 | 2011-03-02 | 株式会社神戸製鋼所 | 半導体装置用積層基板の製造方法及び半導体装置 |
KR101233105B1 (ko) | 2008-08-27 | 2013-02-15 | 소이텍 | 선택되거나 제어된 격자 파라미터들을 갖는 반도체 물질층들을 이용하여 반도체 구조물들 또는 소자들을 제조하는 방법 |
EP2502266B1 (fr) | 2009-11-18 | 2020-03-04 | Soitec | Procédés de fabrication de structures semi-conductrices et dispositifs à semi-conducteurs au moyen de couches de liaison de verre, et structures semi-conductrices et dispositifs à semi-conducteurs formés par de tels procédés |
JP4956649B2 (ja) * | 2010-07-06 | 2012-06-20 | 三井造船株式会社 | 炭化珪素基板、半導体装置およびsoiウエハ |
FR2967812B1 (fr) * | 2010-11-19 | 2016-06-10 | S O I Tec Silicon On Insulator Tech | Dispositif electronique pour applications radiofrequence ou de puissance et procede de fabrication d'un tel dispositif |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH067594B2 (ja) * | 1987-11-20 | 1994-01-26 | 富士通株式会社 | 半導体基板の製造方法 |
SE465492B (sv) * | 1990-01-24 | 1991-09-16 | Asea Brown Boveri | Halvledarkomponent innehaallande ett diamantskikt som aer anordnat mellan ett substrat och ett aktivt skikt och foerfarande foer dess framstaellning |
JPH05217824A (ja) * | 1992-01-31 | 1993-08-27 | Canon Inc | 半導体ウエハ及びその製造方法 |
US5276338A (en) * | 1992-05-15 | 1994-01-04 | International Business Machines Corporation | Bonded wafer structure having a buried insulation layer |
DE69225911T2 (de) * | 1992-12-18 | 1999-02-11 | Harris Corp | Silizium-auf-diamant-schaltungsstruktur und herstellungsverfahren dafür |
IT1268123B1 (it) * | 1994-10-13 | 1997-02-20 | Sgs Thomson Microelectronics | Fetta di materiale semiconduttore per la fabbricazione di dispositivi integrati e procedimento per la sua fabbricazione. |
US5543637A (en) * | 1994-11-14 | 1996-08-06 | North Carolina State University | Silicon carbide semiconductor devices having buried silicon carbide conduction barrier layers therein |
US5773151A (en) * | 1995-06-30 | 1998-06-30 | Harris Corporation | Semi-insulating wafer |
-
1998
- 1998-07-10 FR FR9808919A patent/FR2781082B1/fr not_active Expired - Fee Related
-
1999
- 1999-07-08 WO PCT/FR1999/001659 patent/WO2000003429A1/fr active IP Right Grant
- 1999-07-08 EP EP99929439A patent/EP1103072A1/fr not_active Ceased
- 1999-07-08 KR KR1020017000370A patent/KR100662694B1/ko not_active IP Right Cessation
- 1999-07-08 JP JP2000559589A patent/JP2002525839A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP1103072A1 (fr) | 2001-05-30 |
FR2781082A1 (fr) | 2000-01-14 |
JP2002525839A (ja) | 2002-08-13 |
KR100662694B1 (ko) | 2006-12-28 |
WO2000003429A1 (fr) | 2000-01-20 |
KR20010071813A (ko) | 2001-07-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20100331 |