FR2771666B1 - Systeme et procede de metrologie in situ - Google Patents
Systeme et procede de metrologie in situInfo
- Publication number
- FR2771666B1 FR2771666B1 FR9815143A FR9815143A FR2771666B1 FR 2771666 B1 FR2771666 B1 FR 2771666B1 FR 9815143 A FR9815143 A FR 9815143A FR 9815143 A FR9815143 A FR 9815143A FR 2771666 B1 FR2771666 B1 FR 2771666B1
- Authority
- FR
- France
- Prior art keywords
- metrology system
- situ metrology
- situ
- metrology
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/015—Temperature control
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
- G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/982,236 US6301009B1 (en) | 1997-12-01 | 1997-12-01 | In-situ metrology system and method |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2771666A1 FR2771666A1 (fr) | 1999-06-04 |
FR2771666B1 true FR2771666B1 (fr) | 2004-08-06 |
Family
ID=25528970
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9815143A Expired - Lifetime FR2771666B1 (fr) | 1997-12-01 | 1998-12-01 | Systeme et procede de metrologie in situ |
Country Status (4)
Country | Link |
---|---|
US (1) | US6301009B1 (fr) |
JP (1) | JP4393608B2 (fr) |
DE (1) | DE19855455B4 (fr) |
FR (1) | FR2771666B1 (fr) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001094881A1 (fr) * | 2000-06-02 | 2001-12-13 | Gsi Lumonics Corporation | Systeme de fabrication de substrats paralleles plans avec des trajets optiques uniformes |
US6609946B1 (en) * | 2000-07-14 | 2003-08-26 | Advanced Micro Devices, Inc. | Method and system for polishing a semiconductor wafer |
DE10059886A1 (de) * | 2000-12-01 | 2002-06-20 | Basf Coatings Ag | Verwendung von wässrigen, physikalisch härtbaren Beschichtungsstoffen auf Polyurethanbasis als Haftgrundierung von Lackierungen |
GB2373466B (en) * | 2001-03-22 | 2004-05-19 | Unova Uk Ltd | Method of reducing thermal distortion in grinding machines |
JP2002346899A (ja) * | 2001-03-23 | 2002-12-04 | Ricoh Co Ltd | 曲面加工法及び加工装置 |
NL1018943C2 (nl) * | 2001-09-13 | 2003-03-14 | Tno | Werkwijze en inrichting voor het polijsten van een werkstukoppervlak. |
NL1022293C2 (nl) * | 2002-12-31 | 2004-07-15 | Tno | Inrichting en werkwijze voor het vervaardigen of bewerken van optische elementen en/of optische vormelementen, alsmede dergelijke elementen. |
US6770494B1 (en) | 2003-01-15 | 2004-08-03 | Fairchild Semiconductor Corporation | Process of compensating for layer thickness by determining device parameters on different surface areas of a substrate |
US7009714B2 (en) * | 2003-02-26 | 2006-03-07 | Hitachi High-Technologies Corporation | Method of dry etching a sample and dry etching system |
NL1026526C2 (nl) * | 2004-06-30 | 2005-05-31 | Tno | Inrichting en werkwijze voor het vervaardigen of bewerken van optische elementen en/of optische vormelementen, alsmede dergelijke elementen. |
EP1643209B1 (fr) * | 2004-09-30 | 2020-11-04 | Ansaldo Energia IP UK Limited | Procédé de mesure de l'épaisseur d'une couche |
DE102006001496B4 (de) * | 2006-01-11 | 2019-02-21 | Siemens Aktiengesellschaft | System und Verfahren zur Bestimmung geometrischer Veränderungen eines Werkstücks |
JP5122854B2 (ja) * | 2007-04-13 | 2013-01-16 | 株式会社ディスコ | デバイスの研削方法 |
US7795555B2 (en) | 2007-06-08 | 2010-09-14 | Caterpillar Inc | Process for determining whether used friction elements may be returned to service |
US8834230B2 (en) * | 2008-07-31 | 2014-09-16 | Shin-Etsu Handotai Co., Ltd. | Wafer polishing method and double-side polishing apparatus |
JP4955624B2 (ja) * | 2008-07-31 | 2012-06-20 | 信越半導体株式会社 | 両面研磨装置 |
DE102008049972A1 (de) * | 2008-10-01 | 2010-04-22 | Peter Wolters Gmbh | Verfahren zum Messen der Dicke von in einer Bearbeitungsmaschine bearbeiteten scheibenförmigen Werkstücken |
EP2199021A1 (fr) * | 2008-12-22 | 2010-06-23 | Essilor International (Compagnie Générale D'Optique) | Procédé et appareil pour la fabrication d'une lentille optique |
DE102009010019B4 (de) * | 2009-02-21 | 2012-05-31 | Jos. Schneider Optische Werke Gmbh | Verfahren zum berührungslosen Messen der Topographie |
US9760020B2 (en) | 2012-11-21 | 2017-09-12 | Kla-Tencor Corporation | In-situ metrology |
US9494485B2 (en) | 2014-03-07 | 2016-11-15 | Google Inc. | Measuring parallelism in lightguide surfaces |
WO2016040306A1 (fr) | 2014-09-08 | 2016-03-17 | The Research Foundation Of State University Of New York | Grillages métalliques et leurs procédés de mesure |
US10332781B2 (en) * | 2014-12-19 | 2019-06-25 | Globalwafers Co., Ltd. | Systems and methods for performing epitaxial smoothing processes on semiconductor structures |
JP6765887B2 (ja) * | 2016-07-21 | 2020-10-07 | スピードファム株式会社 | 研磨装置 |
US11415409B1 (en) * | 2019-08-22 | 2022-08-16 | Charles S. Powers | Apparatuses and methods for measuring parameters of an object |
CN114623786B (zh) * | 2022-05-16 | 2022-07-15 | 成都市鸿侠科技有限责任公司 | 一种飞行器大型弧形构件表面光洁度检测装置 |
CN114986325B (zh) * | 2022-06-10 | 2023-09-22 | 中国工程物理研究院激光聚变研究中心 | 光学元件全口径抛光局部区域恒温加工装置及抛光机 |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4417816A (en) * | 1980-08-11 | 1983-11-29 | Colt Industries Operating Corp. | Laser measuring system and method for turning machine |
JPS5840247A (ja) * | 1981-09-02 | 1983-03-09 | Hitachi Ltd | 精密位置決め装置 |
JPS5810441A (ja) * | 1981-07-10 | 1983-01-21 | Toshiba Mach Co Ltd | 精密切削加工システム |
US4594003A (en) | 1983-07-20 | 1986-06-10 | Zygo Corporation | Interferometric wavefront measurement |
JPS6090656A (ja) * | 1983-10-20 | 1985-05-21 | Citizen Watch Co Ltd | 工作機械におけるスピンドル位置決め補正装置 |
DE3931213A1 (de) * | 1989-09-19 | 1991-04-04 | Wacker Chemitronic | Verfahren und vorrichtung zur interferometrischen messung der ebenheit von beidseitig oberflaechen geringer rauhigkeit aufweisenden halbleiter-, insbesondere siliciumscheiben |
US5081796A (en) * | 1990-08-06 | 1992-01-21 | Micron Technology, Inc. | Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer |
GB2256606A (en) * | 1991-05-09 | 1992-12-16 | Cranfield Precision Engineerin | High-precision positional control. |
US5633711A (en) | 1991-07-08 | 1997-05-27 | Massachusettes Institute Of Technology | Measurement of material properties with optically induced phonons |
JPH05318287A (ja) * | 1992-05-21 | 1993-12-03 | Okuma Mach Works Ltd | 超精密加工機 |
US5433650A (en) * | 1993-05-03 | 1995-07-18 | Motorola, Inc. | Method for polishing a substrate |
JPH06338485A (ja) * | 1993-05-28 | 1994-12-06 | Kawasaki Steel Corp | ウェーハの表面性状評価方法およびその研磨方法 |
JP3326443B2 (ja) * | 1993-08-10 | 2002-09-24 | 株式会社ニコン | ウエハ研磨方法及びその装置 |
US5488477A (en) * | 1993-11-15 | 1996-01-30 | Zygo Corporation | Methods and apparatus for profiling surfaces of transparent objects |
JPH07198319A (ja) * | 1993-12-28 | 1995-08-01 | Agency Of Ind Science & Technol | リアルタイム位相シフト干渉計 |
US5664987A (en) * | 1994-01-31 | 1997-09-09 | National Semiconductor Corporation | Methods and apparatus for control of polishing pad conditioning for wafer planarization |
JPH07328916A (ja) * | 1994-06-06 | 1995-12-19 | Japan Aviation Electron Ind Ltd | ラップ・ポリッシュ盤 |
US5478435A (en) * | 1994-12-16 | 1995-12-26 | National Semiconductor Corp. | Point of use slurry dispensing system |
JPH08174411A (ja) * | 1994-12-22 | 1996-07-09 | Ebara Corp | ポリッシング装置 |
JPH08240413A (ja) * | 1995-01-06 | 1996-09-17 | Toshiba Corp | 膜厚測定装置及びポリシング装置 |
US5649849A (en) * | 1995-03-24 | 1997-07-22 | Eastman Kodak Company | Method and apparatus for realtime monitoring and feedback control of the shape of a continuous planetary polishing surface |
DE69635816T2 (de) * | 1995-03-28 | 2006-10-12 | Applied Materials, Inc., Santa Clara | Verfahren zum Herstellen einer Vorrichtung zur In-Situ-Kontrolle und Bestimmung des Endes von chemisch-mechanischen Planiervorgängen |
US5893796A (en) * | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
JPH08330259A (ja) * | 1995-05-30 | 1996-12-13 | Komatsu Electron Metals Co Ltd | 半導体ウェハの研磨方法 |
JP3689175B2 (ja) * | 1995-06-08 | 2005-08-31 | オリンパス株式会社 | 圧電素子の位置決め方法及び位置決め精度確認方法 |
JPH09123057A (ja) * | 1995-10-31 | 1997-05-13 | Sony Corp | 基板研磨装置 |
JPH09131660A (ja) * | 1995-11-06 | 1997-05-20 | Toshiba Corp | 半導体製造装置及び方法 |
JP2833549B2 (ja) * | 1995-11-07 | 1998-12-09 | 日本電気株式会社 | 研磨布の表面調整方法及び機構 |
JPH09252100A (ja) * | 1996-03-18 | 1997-09-22 | Shin Etsu Handotai Co Ltd | 結合ウェーハの製造方法及びこの方法により製造される結合ウェーハ |
JPH09298176A (ja) * | 1996-05-09 | 1997-11-18 | Canon Inc | 研磨方法及びそれを用いた研磨装置 |
JPH10214804A (ja) * | 1997-01-28 | 1998-08-11 | Olympus Optical Co Ltd | 機械化学研磨装置用の平坦化過程モニター装置 |
-
1997
- 1997-12-01 US US08/982,236 patent/US6301009B1/en not_active Expired - Lifetime
-
1998
- 1998-12-01 FR FR9815143A patent/FR2771666B1/fr not_active Expired - Lifetime
- 1998-12-01 DE DE19855455A patent/DE19855455B4/de not_active Expired - Lifetime
- 1998-12-01 JP JP35545898A patent/JP4393608B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH11262858A (ja) | 1999-09-28 |
FR2771666A1 (fr) | 1999-06-04 |
DE19855455B4 (de) | 2013-06-06 |
US6301009B1 (en) | 2001-10-09 |
JP4393608B2 (ja) | 2010-01-06 |
DE19855455A1 (de) | 1999-06-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2771666B1 (fr) | Systeme et procede de metrologie in situ | |
FR2782657B1 (fr) | Systeme distributeur-collecteur de fluides et son procede | |
NO985435D0 (no) | FremgangsmÕte og system for overvÕking av flere bevegelige gjenstander | |
IL120632A0 (en) | Multiprocessor system and method | |
DE69706611D1 (de) | Stereoskopisches Display-System und -Verfahren | |
EE200100023A (et) | Piletite ümberjaotamise meetod ja süsteem | |
DE60034814D1 (de) | Bildwiederauffindungsystem und -verfahren | |
DE19780609T1 (de) | Objekterkennungssystem und -verfahren | |
DE69836383D1 (de) | Bildverarbeitungssystem und -verfahren | |
DE69938118D1 (de) | Datenaufnahmeanlage und -Verfahren | |
DE69940005D1 (de) | Drucksystem und -verfahren | |
FI981133A0 (fi) | Mittausmenetelmä ja -järjestelmä | |
FR2773410B1 (fr) | Systeme et procede d'enseignement | |
FR2783389B1 (fr) | Systeme de radiocommunication et procede de radiocommunication | |
FR2735050B1 (fr) | Systeme et procede de distribution de panneau | |
FR2760303B1 (fr) | Circuit et procede de detection de service | |
IL150263A0 (en) | System and method for multiprocessor management | |
NO20000829L (no) | System og fremgangsmåte for vakuumekstrudering | |
DE69815251D1 (de) | Bildbearbeitungssystem und -verfahren | |
DE69626424D1 (de) | Triangulationsbasiertes abbildungs- und bearbeitungsverfahren und -system | |
FI980687A (fi) | Menetelmä ja järjestelmä profiilinhallintaan | |
ID17067A (id) | Metode tampilan sederhana untuk area penghubungan | |
FR2760549B1 (fr) | Procede et systeme de transaction financiere | |
NO20001011D0 (no) | System og fremgangsmõte for mõling av effekt | |
FR2774248B1 (fr) | Systeme de communication et procede apparente |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 18 |
|
PLFP | Fee payment |
Year of fee payment: 19 |
|
PLFP | Fee payment |
Year of fee payment: 20 |