FR2710810A1 - Sealed microcomponent housing and method of encapsulation in such a housing - Google Patents

Sealed microcomponent housing and method of encapsulation in such a housing Download PDF

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Publication number
FR2710810A1
FR2710810A1 FR9311587A FR9311587A FR2710810A1 FR 2710810 A1 FR2710810 A1 FR 2710810A1 FR 9311587 A FR9311587 A FR 9311587A FR 9311587 A FR9311587 A FR 9311587A FR 2710810 A1 FR2710810 A1 FR 2710810A1
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France
Prior art keywords
cover
receptacle
housing
crown
micro
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Granted
Application number
FR9311587A
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French (fr)
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FR2710810B1 (en
Inventor
Cointrel Jean-Pierre
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Sagem SA
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Sagem SA
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Publication date
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Priority to FR9311587A priority Critical patent/FR2710810B1/en
Priority to FI944465A priority patent/FI944465A/en
Priority to DE9415696U priority patent/DE9415696U1/en
Priority to NO943603A priority patent/NO943603L/en
Publication of FR2710810A1 publication Critical patent/FR2710810A1/en
Application granted granted Critical
Publication of FR2710810B1 publication Critical patent/FR2710810B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
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    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Glass Compositions (AREA)
  • Micromachines (AREA)
  • Infusion, Injection, And Reservoir Apparatuses (AREA)

Abstract

The sealed housing, capable of accommodating active or passive microcomponents, comprises a receptacle (10) made of thermoplastic or thermosetting material overmoulded onto output electrical contacts (14, 20) of the microcomponent (18), and a cover forming the receptacle and with it defining a cavity, containing a fluid, for accommodating the microcomponents. The material of the receptacle is also overmoulded onto a metal crown (12) and the cover (22) is of metal. It is fixed and sealed onto the crown, by soldering, brazing or even bonding.

Description

BOÎTIER ETANCHE DE MICRO-COMPOSANT ET PROCEDE
D'ENCAPSULATION DANS UN TEL BOÎTIER
La présente invention concerne les boîtiers étanches destinés à recevoir un ou plusieurs micro-composants utilisables dans un circuit électrique ou électronique, ces boîtiers étant destinés à assurer une ou plusieurs fonctions telles que la protection du micro-composant contre les agressions extérieures, le confinement d'un milieu de protection et/ou d'amortissement, la fixation sur un élément extérieur, le maintien dans une position par rapport à un support.WATERPROOF MICRO-COMPONENT PACKAGE AND METHOD
ENCAPSULATION IN SUCH A HOUSING
The present invention relates to waterproof boxes intended to receive one or more micro-components usable in an electric or electronic circuit, these boxes being intended to ensure one or more functions such as the protection of the micro-component against external aggressions, the confinement of 'a protective and / or damping medium, attachment to an external element, maintenance in a position relative to a support.

La fonction à remplir dépend notamment de la nature du micro-composant encapsulé. Ce micro-composant peut être actif ou passif. Parmi les composants actifs, on peut citer les produits semiconducteurs, les transducteurs, les microactuateurs, les circuits intégrés. Parmi les composants passifs, on peut citer les capteurs résistifs ou capacitifs. The function to be fulfilled depends in particular on the nature of the encapsulated micro-component. This micro-component can be active or passive. Among the active components, mention may be made of semiconductor products, transducers, microactuators, integrated circuits. Passive components include resistive or capacitive sensors.

Le milieu contenu dans le boîtier peut également largement varier. I1 peut s'agir d'un gaz de protection, d'un gaz inerte, ou d'un liquide d'isolement, de protection ou d'amortissement tel qu'une huile aux silicones. The medium contained in the housing can also vary widely. It can be a protective gas, an inert gas, or an isolation, protective or damping liquid such as a silicone oil.

La présente invention vise notamment à fournir un boîtier étanche répondant mieux que ceux antérieurement connus aux exigences de la pratique, notamment en ce qu'il est à la fois économique et fiable du point de vue de l'étanchéité. The present invention aims in particular to provide a waterproof housing that better meets those previously known to the requirements of practice, in particular in that it is both economical and reliable from the point of view of sealing.

Dans ce but, l'invention propose notamment un boîtier étanche de micro-composant comprenant un réceptacle en matériau thermo-plastique ou thermo-durcissable surmoulé sur des contacts électriques de sortie du micro-composant et un couvercle fermant le réceptacle et définissant avec lui une cavité, contenant un fluide, de réception du micro-composant, caractérisé en ce que le matériau du réceptacle est également surmoulé sur une couronne métallique et en ce que le couvercle est métallique et soudé de façon étanche sur la dite couronne. To this end, the invention provides in particular a sealed micro-component case comprising a receptacle made of thermo-plastic or thermosetting material overmolded on electrical contacts for output of the micro-component and a cover closing the receptacle and defining with it a cavity, containing a fluid, for receiving the micro-component, characterized in that the material of the receptacle is also overmolded on a metal crown and in that the cover is metallic and welded in leaktight manner on said crown.

Dans un mode avantageux de réalisation, facilitant le remplissage de la cavité par un fluide approprié en excluant la présence d'air, le couvercle présente une cheminée d'évacuation obturée par pincement, ce qui implique de constituer ce couvercle en un métal écrouissable, et éventuellement par brasure. In an advantageous embodiment, facilitating the filling of the cavity with an appropriate fluid by excluding the presence of air, the cover has an evacuation chimney closed by pinching, which implies constituting this cover in a work-hardening metal, and possibly by soldering.

La couronne sera généralement formée par un anneau mince à section droite courbe, pouvant présenter des pattes raccordables à un outil de soudage. Le couvercle pourra alors présenter un rebord à section courbe, destiné à s'appliquer sur la couronne le long d'un cercle à distance de sa périphérie. The crown will generally be formed by a thin ring with a curved straight section, which may have tabs that can be connected to a welding tool. The cover could then have a rim with a curved section, intended to be applied to the crown along a circle at a distance from its periphery.

Les contacts peuvent avoir des formes diverses suivant la nature du micro-composant contenu. Un ou plusieurs de ces contacts peuvent être prévus pour recevoir directement le micro-composant et se trouvent contre le fond de la cavité. The contacts can have various forms depending on the nature of the micro-component contained. One or more of these contacts can be provided for directly receiving the micro-component and are located against the bottom of the cavity.

Le micro-composant est alors directement fixé sur eux par soudage ou collage. Certains des contacts ou tous les contacts peuvent aussi bien être reliés au micro-composant par des fils souples soudés, immergés dans le fluide contenu dans la cavité.The micro-component is then directly fixed on them by welding or gluing. Some of the contacts or all of the contacts may as well be connected to the micro-component by flexible welded wires, immersed in the fluid contained in the cavity.

La présente invention vise également à fournir un procédé de réalisation d'un boîtier du genre défini cidessus et dlencapsulation d'au moins un micro-composant dans ce boîtier. Pour cela, on surmoule un réceptacle en matière thermo-plastique ou thermo-durcissable sur des contacts métalliques de connexion traversant sa paroi et sur une couronne métallique délimitant une ouverture ; on fixe le micro-composant dans le réceptacle et on le relie aux dits contacts ; on soude un couvercle en métal mince écrouissable sur le couvercle en laissant subsister un passage de remplissage ; on effectue ou on achève le remplissage en fluide de la cavité en utilisant le passage ; et on obture le dit passage. The present invention also aims to provide a method of producing a box of the kind defined above and encapsulation of at least one micro-component in this box. For this, a receptacle of thermo-plastic or thermosetting material is overmolded on metal connection contacts passing through its wall and on a metal ring delimiting an opening; the micro-component is fixed in the receptacle and it is connected to the said contacts; a thin metal hardenable cover is welded onto the cover while leaving a filling passage; the filling with fluid of the cavity is carried out or completed using the passage; and we close the said passage.

Comme on l'a indiqué plus haut, le passage peut notamment être constitué par une cheminée qui est fermée par pincement et éventuellement par brasure. As indicated above, the passage can in particular consist of a chimney which is closed by pinching and possibly by brazing.

Le couvercle, suivant le métal qui le constitue, pourra être fixé par soudure électrique, par brasure en prévoyant une préforme d'alliage de brasure sur la couronne ou sur le couvercle, ou par collage. The cover, depending on the metal which constitutes it, may be fixed by electrical welding, by brazing by providing a brazing alloy preform on the crown or on the cover, or by gluing.

S'il est mince et s'il a un profil lui permettant de changer de forme élastiquement (par exemple s'il présente des ondulations ou des coudes alternés), le couvercle peut se déformer sous l'action d'une pression différentielle, due par exemple à une dilatation différentielle ou à une variation de pression externe. Si le couvercle est suffisamment mince, le boîtier peut être utilisé pour contenir un capteur de pression et le protéger contre les agressions ambiantes. If it is thin and has a profile allowing it to change shape elastically (for example if it has alternating undulations or elbows), the cover can deform under the action of a differential pressure, due for example a differential expansion or a variation of external pressure. If the cover is thin enough, the case can be used to contain a pressure sensor and protect it from environmental aggressions.

Dans la mesure où le couvercle est en un métal ayant un coefficient de conductibilité thermique élevé, le boîtier peut également recevoir un capteur de température. Since the cover is made of a metal having a high coefficient of thermal conductivity, the housing can also receive a temperature sensor.

L'invention sera mieux comprise à la lecture de la description qui suit d'un mode particulier de réalisation, donné à titre d'exemple non limitatif. La description se réfère aux dessins qui l'accompagnent, dans lesquels
- la figure 1 montre schématiquement un boîtier suivant l'invention contenant un micro-composant, en coupe suivant un plan passant par l'axe du boîtier
- la figure 2 est une vue en coupe suivant la ligne
II-II de la figure 1, mais avant montage du couvercle ; et
- la figure 3 est une demi-vue de dessus du réceptacle, démuni du couvercle.The invention will be better understood on reading the following description of a particular embodiment, given by way of non-limiting example. The description refers to the accompanying drawings, in which
- Figure 1 schematically shows a housing according to the invention containing a micro-component, in section along a plane passing through the axis of the housing
- Figure 2 is a sectional view along the line
II-II of Figure 1, but before mounting the cover; and
- Figure 3 is a half top view of the receptacle, deprived of the cover.

Le boîtier montré en figure 1 dans son état d'utilisation comporte un réceptacle 10 en matière thermo-plastique ou thermo-durcissable surmoulé sur des contacts de connexion métalliques prédécoupés et sur une couronne 12 support de couvercle. Les contacts présentent une portion en saillie à l'extérieur permettant de les relier électriquement à un circuit et pouvant également être utilisée pour fixer le boîtier. Dans le cas illustré, les contacts de connexion comportent d'une part un contact 14 constituant le fond d'une cavité 16 de réception d'un micro-composant 18, qui est par exemple une poutre d'accéléromètre, et d'autre part des contacts 20 destinés à être reliés au micro-composant par des liaisons souples qu'on décrira plus loin. The box shown in FIG. 1 in its state of use comprises a receptacle 10 made of thermo-plastic or thermosetting material overmolded on precut metal connection contacts and on a crown 12 supporting the cover. The contacts have a projecting portion on the outside allowing them to be electrically connected to a circuit and can also be used to fix the housing. In the illustrated case, the connection contacts comprise on the one hand a contact 14 constituting the bottom of a cavity 16 for receiving a micro-component 18, which is for example an accelerometer beam, and on the other hand contacts 20 intended to be connected to the micro-component by flexible connections which will be described later.

Le boîtier comprend encore un couvercle 22 destiné à être fixé de façon étanche sur la couronne support 12. La couronne a une section droite en forme de cornière à angle arrondi, dont une branche est noyée sur une partie de sa longueur dans le matériau constitutif du réceptacle 10 et dont une autre branche constitue la face supérieure du réceptacle. La couronne peut notamment être constituée par un anneau mince en cuivre ou nickel, de quelques dixièmes de millimètres d'épaisseur, découpé et plié. Elle peut être prolongée par des pattes 24 de fixation du boîtier et/ou utilisables comme électrodes de soudage du couvercle 22. Ces pattes peuvent alors être noyées sur la majeure partie de leur longueur et faire saillie à la partie basse du réceptacle, comme indiqué schématiquement sur la figure 2. The housing also includes a cover 22 intended to be fixed in leaktight manner on the support crown 12. The crown has a cross section in the form of an angle with a rounded angle, one branch of which is embedded over part of its length in the material of which the receptacle 10 and of which another branch constitutes the upper face of the receptacle. The crown may in particular consist of a thin ring of copper or nickel, a few tenths of a millimeter thick, cut and folded. It can be extended by lugs 24 for fixing the housing and / or usable as welding electrodes for the cover 22. These lugs can then be embedded over most of their length and protrude from the lower part of the receptacle, as shown diagrammatically. in figure 2.

Le couvercle est également constitué en métal mince, par exemple en nickel, en cuivre, ou en tout autre matériau compatible avec celui de la couronne. Il présente un rebord inférieur à section droite courbe, permettant de l'appliquer sur la couronne 12 suivant un cercle à distance de sa périphérie et d'assurer une bonne liaison. The cover is also made of thin metal, for example nickel, copper, or any other material compatible with that of the crown. It has a lower rim with a curved cross section, making it possible to apply it to the crown 12 in a circle at a distance from its periphery and to ensure a good connection.

Le couvercle 22 représenté comporte un passage tubulaire défini par une cheminée 26 qui, lorsque le boîtier est terminé, est obturée par pincement et éventuellement par une brasure 28 pour le rendre étanche. The cover 22 shown has a tubular passage defined by a chimney 26 which, when the housing is finished, is closed by pinching and optionally by a solder 28 to make it waterproof.

On décrira maintenant un procédé d'encapsulation d'un micro-composant dans un boîtier du genre décrit cidessus. We will now describe a method of encapsulating a micro-component in a housing of the kind described above.

On commence par constituer le réceptacle par un surmoulage classique en matériau thermo-plastique ou thermodurcissable sur les contacts électriques, placés dans le moule et pouvant sortir de ce dernier. Le réceptacle est également surmoulé sur la couronne 12. On forme séparément le couvercle, par exemple par découpe et emboutissage d'un feuillard de cuivre ou de nickel. Le composant est mis en place. S'il s'agit par exemple d'une poutre en matériau piézo-électrique ou semiconducteur muni de pistes de raccordement, le socle de la poutre est fixé sur le contact prévu au fond, par brasure ou par collage. Les liaisons électriques supplémentaires prévues peuvent être réalisées à laide de tronçons de fils souples d'aluminium ou d'or, fixés par soudage ultrasonique ou thermo-sonique, la technique choisie pouvant dépendre de la nature de la matière constitutive du boîtier. Les contacts traversants auxquels s'effectue le raccordement peuvent être réalisés en technologie connue sous l'appellation anglo-saxonne "lead frame". We start by constituting the receptacle by a conventional overmolding in thermo-plastic or thermosetting material on the electrical contacts, placed in the mold and able to come out of the latter. The receptacle is also molded onto the crown 12. The cover is formed separately, for example by cutting and stamping a strip of copper or nickel. The component is put in place. If it is for example a beam of piezoelectric or semiconductor material provided with connection tracks, the base of the beam is fixed to the contact provided at the bottom, by soldering or by bonding. The additional electrical connections provided can be made using sections of flexible aluminum or gold wires, fixed by ultrasonic or thermo-sonic welding, the technique chosen may depend on the nature of the material of the housing. The through contacts to which the connection is made can be made using technology known by the English name "lead frame".

Une fois le micro-composant en place, le couvercle est fixé. Pour cela, il est rapporté sur la couronne, puis scellé, par collage, par brasure ou par soudure électrique. Once the micro-component is in place, the cover is fixed. For this, it is attached to the crown, then sealed, by gluing, by soldering or by electrical welding.

Dans le cas d'une soudure électrique, une des électrodes de l'appareil de soudage est appliquée sur le couvercle 22.In the case of electrical welding, one of the electrodes of the welding device is applied to the cover 22.

L'autre électrode peut être raccordée à une patte débordante 24 de la couronne. La brasure peut être réalisée en prévoyant une préforme d'alliage approprié séparément, sur la couronne ou même sur le rebord du couvercle.The other electrode can be connected to a protruding tab 24 of the crown. The solder can be produced by providing an appropriate alloy preform separately, on the crown or even on the rim of the cover.

Une fois le couvercle fixé de façon étanche, on remplit la cavité en fluide approprié, par la cheminée. Lorsque par exemple le fluide est un liquide destiné à amortir les vibrations à la résonance d'une poutre de mesure d'accélération, on peut remplir la cavité en la mettant sous vide et en la plongeant dans le liquide qui est alors aspiré à l'intérieur de la cavité lorsque l'on "casse" le vide. Once the cover is fixed tightly, the cavity is filled with appropriate fluid through the chimney. When, for example, the fluid is a liquid intended to damp the vibrations at the resonance of an acceleration measurement beam, the cavity can be filled by putting it under vacuum and by immersing it in the liquid which is then sucked in. inside the cavity when the vacuum is "broken".

Une fois la cavité remplie, on sertit l'extrémité de la cheminée 26 pour éviter d'emprisonner du gaz à l'intérieur de la cavité. Once the cavity is filled, the end of the chimney 26 is crimped to avoid trapping gas inside the cavity.

Enfin, après nettoyage et/ou dégraissage de l'extérieur de la cheminée sertie, on complète l'étanchéité à l'aide d'une brasure à l'extrémité de la cheminée, en utilisant un matériau compatible avec celui du couvercle. Finally, after cleaning and / or degreasing the outside of the crimped chimney, the sealing is completed using a solder at the end of the chimney, using a material compatible with that of the cover.

Le boîtier étanche ainsi constitué peut être fixé sur un support de diverses façons. On peut notamment utiliser les pattes reliées à la couronne. Une autre solution consiste à laisser subsister, lors du moulage, la carotte d'injection 30 et à l'utiliser pour le montage, après bouterollage de son extrémité. The waterproof casing thus formed can be fixed on a support in various ways. One can in particular use the legs connected to the crown. Another solution consists in leaving the injection core 30 remaining during molding and in using it for mounting, after it has been rolled up at its end.

L'invention est susceptible de nombreuses variantes de réalisation. Le boîtier peut avoir une forme autre que cylindrique. Le couvercle peut présenter des ondulations destinées à accroître sa flexibilité. Des modes de fixation autres que ceux qui ont été décrits peuvent être utilisés.  The invention is susceptible of numerous variant embodiments. The housing may have a shape other than cylindrical. The cover may have corrugations intended to increase its flexibility. Fixation methods other than those which have been described can be used.

Claims (10)

REVENDICATIONS 1. Boîtier étanche de micro-composant, comprenant un réceptacle (10) en matériau thermo-plastique ou thermodurcissable surmoulé sur des contacts électrique (14,20) de sortie du micro-composant (18), et un couvercle formant le réceptacle et définissant avec lui une cavité, contenant un fluide, de réception du micro-composant, 1. Waterproof micro-component housing, comprising a receptacle (10) of thermo-plastic or thermosetting material overmolded on electrical contacts (14, 20) for output of the micro-component (18), and a cover forming the receptacle and defining with it a cavity, containing a fluid, for receiving the micro-component, caractérisé en ce que le matériau du réceptacle est également surmoulé sur une couronne métallique (12) et en ce que le couvercle (22) est métallique et fixé de façon étanche sur la dite couronne. characterized in that the material of the receptacle is also overmolded on a metal crown (12) and in that the cover (22) is metallic and tightly fixed on said crown. 2. Boîtier selon la revendication 1, caractérisé en ce que le couvercle présente une cheminée de remplissage (26) obturée par pincement, et éventuellement par brasure, le métal du couvercle étant écrouissable. 2. Housing according to claim 1, characterized in that the cover has a filling chimney (26) closed by pinching, and optionally by brazing, the metal of the cover being hardenable. 3. Boîtier selon la revendication 1 ou 2, caractérisé en ce que la dite couronne (12) est constituée par un anneau mince à section droite courbe, pouvant présenter des pattes (24) de raccordement. 3. Housing according to claim 1 or 2, characterized in that said crown (12) is constituted by a thin ring with curved cross section, which may have connecting lugs (24). 4. Boîtier selon la revendication 1, 2 ou 3, caractérisé en ce que les dits contacts comportent au moins un contact (14) destiné à recevoir directement le microcomposant et au moins un contact (20) destiné à être relié par un fil souple immergé dans le fluide contenu dans la cavité. 4. Housing according to claim 1, 2 or 3, characterized in that said contacts comprise at least one contact (14) intended to receive the microcomponent directly and at least one contact (20) intended to be connected by a flexible submerged wire in the fluid contained in the cavity. 5. Boîtier suivant l'une quelconque des revendications 1 à 4, caractérisé en ce que le couvercle est métallique et a un profil lui permettant de se déformer élastiquement sous l'action de forces de pression. 5. Housing according to any one of claims 1 to 4, characterized in that the cover is metallic and has a profile allowing it to deform elastically under the action of pressure forces. 6. Procédé d'encapsulation d'un micro-composant dans un boîtier étanche, caractérisé en ce que : on surmoule un réceptacle (10) en matière thermo-plastique ou thermodurcissable sur des contacts de connexion (14,20) traversant sa paroi et sur une couronne métallique (12) délimitant une ouverture ; on fixe le micro-composant (18) dans le réceptable et on le relie aux dits contacts ; on soude un couvercle en métal mince écrouissable (22), présentant une ouverture de remplissage, sur la couronne (12) ; on effectue ou on achève le remplissage en fluide de la cavité de remplissage en utilisant le passage ; et on obture le passage. 6. Method for encapsulating a micro-component in a sealed housing, characterized in that: a receptacle (10) made of thermo-plastic or thermosetting material is overmolded on connection contacts (14, 20) passing through its wall and on a metal crown (12) defining an opening; the micro-component (18) is fixed in the receptacle and it is connected to the said contacts; a hard metal thin metal cover (22), having a filling opening, is welded to the crown (12); filling or completing the fluid filling of the filling cavity using the passage; and we close the passage. 7. Procédé selon la revendication 6, caractérisé en ce que le couvercle est fixé par soudage, par collage ou par brasure à l'aide d'une préforme de métal de brasage prévue sur le couvercle ou la couronne. 7. Method according to claim 6, characterized in that the cover is fixed by welding, by gluing or by brazing using a brazing metal preform provided on the cover or the crown. 8. Procédé selon la revendication 6 ou 7, caractérisé en ce qu'on relie le micro-composant à au moins un contact (14) prévu sur le fond et/ou à des contacts traversants (20) par l'intermédiaire de fils souples soudés. 8. Method according to claim 6 or 7, characterized in that the micro-component is connected to at least one contact (14) provided on the bottom and / or to through contacts (20) by means of flexible wires welded. 9. Procédé selon la revendication 6, 7 ou 8, caractérisé en ce qu'on moule le réceptacle (10) en laissant subsister une carotte centrale de moulage et en ce que l'on fixe finalement le boîtier à l'aide de la dite carotte. 9. Method according to claim 6, 7 or 8, characterized in that the receptacle (10) is molded while leaving a central molding core and in that the housing is finally fixed using said carrot. 10. Procédé selon l'une quelconque des revendications 6 à 9, caractérisé en ce que le dit passage est constitué par une cheminée tubulaire (26), en ce qu'on remplit la cavité par mise sous vide et immersion dans un fluide et en ce qu'on obture la cheminée par pincement et éventuellement brasure.  10. Method according to any one of claims 6 to 9, characterized in that the said passage is constituted by a tubular chimney (26), in that the cavity is filled by evacuation and immersion in a fluid and in what you close the chimney by pinching and possibly brazing.
FR9311587A 1993-09-29 1993-09-29 Waterproof micro-component housing and method of encapsulation in such a housing. Expired - Fee Related FR2710810B1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR9311587A FR2710810B1 (en) 1993-09-29 1993-09-29 Waterproof micro-component housing and method of encapsulation in such a housing.
FI944465A FI944465A (en) 1993-09-29 1994-09-27 A sealed shell of a microcomponent and a method of encapsulating such a shell
DE9415696U DE9415696U1 (en) 1993-09-29 1994-09-28 Dense housing for micro components
NO943603A NO943603L (en) 1993-09-29 1994-09-28 Sealed box for microcomponents and method of encapsulation in such a box

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9311587A FR2710810B1 (en) 1993-09-29 1993-09-29 Waterproof micro-component housing and method of encapsulation in such a housing.

Publications (2)

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FR2710810A1 true FR2710810A1 (en) 1995-04-07
FR2710810B1 FR2710810B1 (en) 1995-12-01

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FR9311587A Expired - Fee Related FR2710810B1 (en) 1993-09-29 1993-09-29 Waterproof micro-component housing and method of encapsulation in such a housing.

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DE (1) DE9415696U1 (en)
FI (1) FI944465A (en)
FR (1) FR2710810B1 (en)
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WO2008128809A1 (en) * 2007-04-23 2008-10-30 Continental Automotive Gmbh Electronic housing

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ATE224100T1 (en) * 1994-11-25 2002-09-15 Ami Doduco Gmbh HOUSING MADE OF A PLASTIC DESIGNED TO ACCOMMODATE ELECTRONIC AND/OR MICROMECHANICAL COMPONENTS, INTO WHICH CONDUCTOR TRACKS INSIDE
FR2729253A1 (en) * 1995-01-11 1996-07-12 Sagem Sensor module in conducting enclosure for motor car parts e.g. accelerometer
US5866818A (en) * 1995-11-30 1999-02-02 Matsushita Electric Works, Ltd. Acceleration sensor device

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FR1284316A (en) * 1960-03-18 1962-02-09 Western Electric Co Ohmic contact without injection for semiconductor devices
FR2253283A1 (en) * 1973-12-03 1975-06-27 Raychem Corp
FR2518812A1 (en) * 1981-12-23 1983-06-24 Cit Alcatel Package for hybrid electronic circuits - is filled with fluorocarbon liq. to withstand high pressures, esp. when immersed at great depth in sea-water
EP0257204A1 (en) * 1986-08-04 1988-03-02 Beta Phase Inc. Seal for an opening to a cavity and integrated circuit package
WO1992020096A1 (en) * 1991-05-06 1992-11-12 Sensonor A.S Arrangement for encasing a functional device, and a process for the production of same

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FR1284316A (en) * 1960-03-18 1962-02-09 Western Electric Co Ohmic contact without injection for semiconductor devices
FR2253283A1 (en) * 1973-12-03 1975-06-27 Raychem Corp
FR2518812A1 (en) * 1981-12-23 1983-06-24 Cit Alcatel Package for hybrid electronic circuits - is filled with fluorocarbon liq. to withstand high pressures, esp. when immersed at great depth in sea-water
EP0257204A1 (en) * 1986-08-04 1988-03-02 Beta Phase Inc. Seal for an opening to a cavity and integrated circuit package
WO1992020096A1 (en) * 1991-05-06 1992-11-12 Sensonor A.S Arrangement for encasing a functional device, and a process for the production of same

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Publication number Priority date Publication date Assignee Title
WO2008128809A1 (en) * 2007-04-23 2008-10-30 Continental Automotive Gmbh Electronic housing
US8168896B2 (en) 2007-04-23 2012-05-01 Continental Automotive Gmbh Electronic housing

Also Published As

Publication number Publication date
DE9415696U1 (en) 1994-12-15
NO943603D0 (en) 1994-09-28
NO943603L (en) 1995-03-30
FI944465A0 (en) 1994-09-27
FI944465A (en) 1995-03-30
FR2710810B1 (en) 1995-12-01

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