FR2710195B1 - Antenna-electronic circuit assembly. - Google Patents

Antenna-electronic circuit assembly.

Info

Publication number
FR2710195B1
FR2710195B1 FR9310932A FR9310932A FR2710195B1 FR 2710195 B1 FR2710195 B1 FR 2710195B1 FR 9310932 A FR9310932 A FR 9310932A FR 9310932 A FR9310932 A FR 9310932A FR 2710195 B1 FR2710195 B1 FR 2710195B1
Authority
FR
France
Prior art keywords
antenna
electronic circuit
circuit assembly
assembly
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9310932A
Other languages
French (fr)
Other versions
FR2710195A1 (en
Inventor
Grancher Alain
Cachier Gerard
Michel Ludovic
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR9310932A priority Critical patent/FR2710195B1/en
Publication of FR2710195A1 publication Critical patent/FR2710195A1/en
Application granted granted Critical
Publication of FR2710195B1 publication Critical patent/FR2710195B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/065—Patch antenna array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6688—Mixed frequency adaptations, i.e. for operation at different frequencies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
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    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2924/01005—Boron [B]
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    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
FR9310932A 1993-09-14 1993-09-14 Antenna-electronic circuit assembly. Expired - Fee Related FR2710195B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9310932A FR2710195B1 (en) 1993-09-14 1993-09-14 Antenna-electronic circuit assembly.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9310932A FR2710195B1 (en) 1993-09-14 1993-09-14 Antenna-electronic circuit assembly.

Publications (2)

Publication Number Publication Date
FR2710195A1 FR2710195A1 (en) 1995-03-24
FR2710195B1 true FR2710195B1 (en) 1995-10-13

Family

ID=9450847

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9310932A Expired - Fee Related FR2710195B1 (en) 1993-09-14 1993-09-14 Antenna-electronic circuit assembly.

Country Status (1)

Country Link
FR (1) FR2710195B1 (en)

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Publication number Priority date Publication date Assignee Title
GB2337861B (en) * 1995-06-02 2000-02-23 Dsc Communications Integrated directional antenna
US5629241A (en) * 1995-07-07 1997-05-13 Hughes Aircraft Company Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same
FR2745119B1 (en) * 1996-02-16 1998-06-05 Thomson Csf INTEGRATED CIRCUIT ENCAPSULATION BOX FOR HYPERFREQUENCY APPLICATIONS AND ITS MANUFACTURING PROCESS
FR2753569B1 (en) * 1996-09-16 1998-10-09 Alcatel Espace RADIANT ELEMENT DEVICE
BR9713810A (en) * 1996-12-31 2000-01-25 Ericsson Inc Process for integrating a plurality of antennas into a distributed antenna communication system, and integrated antenna unit.
FR2758908B1 (en) * 1997-01-24 1999-04-16 Thomson Csf LOW COST MICROWAVE ENCAPSULATION BOX
CA2240224A1 (en) 1997-06-12 1998-12-12 Radio Communication Systems Ltd. Distributed antenna for personal communications system
US6100853A (en) * 1997-09-10 2000-08-08 Hughes Electronics Corporation Receiver/transmitter system including a planar waveguide-to-stripline adapter
EP1025615B1 (en) 1997-10-21 2002-07-03 Interwave Communications International, Ltd. Self-contained masthead units for cellular communication networks
US6362790B1 (en) * 1998-09-18 2002-03-26 Tantivy Communications, Inc. Antenna array structure stacked over printed wiring board with beamforming components
DE19904303A1 (en) 1999-01-28 2000-08-24 Bosch Gmbh Robert Housing for an electronic device in microwave technology
JP4028178B2 (en) * 2001-02-09 2007-12-26 株式会社東芝 Mobile antenna device
JP3973402B2 (en) * 2001-10-25 2007-09-12 株式会社日立製作所 High frequency circuit module
JP3964873B2 (en) * 2001-11-09 2007-08-22 株式会社日立製作所 In-vehicle millimeter wave radar system
US6825817B2 (en) * 2002-08-01 2004-11-30 Raytheon Company Dielectric interconnect frame incorporating EMI shield and hydrogen absorber for tile T/R modules
JP2005086603A (en) * 2003-09-10 2005-03-31 Tdk Corp Electronic component module and its manufacturing method
JP4189970B2 (en) 2004-11-05 2008-12-03 株式会社日立製作所 Antenna device
GB0426319D0 (en) 2004-12-01 2005-01-05 Finglas Technologies Ltd Remote control of antenna line device
JP2010147746A (en) 2008-12-18 2010-07-01 Mitsumi Electric Co Ltd Antenna device
US8633858B2 (en) * 2010-01-29 2014-01-21 E I Du Pont De Nemours And Company Method of manufacturing high frequency receiving and/or transmitting devices from low temperature co-fired ceramic materials and devices made therefrom
JP6905438B2 (en) * 2017-09-22 2021-07-21 株式会社フジクラ Wireless communication module

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62295501A (en) * 1986-06-14 1987-12-22 Matsushita Electric Works Ltd Vplane antenna
DE3738506A1 (en) * 1987-11-13 1989-06-01 Dornier System Gmbh ANTENNA STRUCTURE
DE69020319T2 (en) * 1989-12-11 1996-03-14 Toyoda Chuo Kenkyusho Kk Mobile antenna system.

Also Published As

Publication number Publication date
FR2710195A1 (en) 1995-03-24

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