FR2706729B1 - Radiateur pour composants électroniques de puissance. - Google Patents

Radiateur pour composants électroniques de puissance.

Info

Publication number
FR2706729B1
FR2706729B1 FR9306905A FR9306905A FR2706729B1 FR 2706729 B1 FR2706729 B1 FR 2706729B1 FR 9306905 A FR9306905 A FR 9306905A FR 9306905 A FR9306905 A FR 9306905A FR 2706729 B1 FR2706729 B1 FR 2706729B1
Authority
FR
France
Prior art keywords
radiator
electronic power
power components
components
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9306905A
Other languages
English (en)
Other versions
FR2706729A1 (fr
Inventor
Panhaleux Patrick
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sagem SA
Original Assignee
Sagem SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sagem SA filed Critical Sagem SA
Priority to FR9306905A priority Critical patent/FR2706729B1/fr
Publication of FR2706729A1 publication Critical patent/FR2706729A1/fr
Application granted granted Critical
Publication of FR2706729B1 publication Critical patent/FR2706729B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR9306905A 1993-06-09 1993-06-09 Radiateur pour composants électroniques de puissance. Expired - Fee Related FR2706729B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9306905A FR2706729B1 (fr) 1993-06-09 1993-06-09 Radiateur pour composants électroniques de puissance.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9306905A FR2706729B1 (fr) 1993-06-09 1993-06-09 Radiateur pour composants électroniques de puissance.

Publications (2)

Publication Number Publication Date
FR2706729A1 FR2706729A1 (fr) 1994-12-23
FR2706729B1 true FR2706729B1 (fr) 1995-09-08

Family

ID=9447915

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9306905A Expired - Fee Related FR2706729B1 (fr) 1993-06-09 1993-06-09 Radiateur pour composants électroniques de puissance.

Country Status (1)

Country Link
FR (1) FR2706729B1 (fr)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3305004A (en) * 1965-08-24 1967-02-21 Philips Corp Heat dissipator with pivotable means to grip a semiconductor device
US3412788A (en) * 1966-03-11 1968-11-26 Mallory & Co Inc P R Semiconductor device package
DE2927860A1 (de) * 1979-07-10 1981-01-29 Siemens Ag Vorrichtung zum einspannen eines scheibenfoermigen halbleiterbauelements zwischen zwei kuehlkoerper
IT1201836B (it) * 1986-07-17 1989-02-02 Sgs Microelettronica Spa Dispositivo a semiconduttore montato in un contenitore segmentato altamente flessibile e fornite di dissipatore termico
US5172755A (en) * 1992-04-01 1992-12-22 Digital Equipment Corporation Arcuate profiled heatsink apparatus and method

Also Published As

Publication number Publication date
FR2706729A1 (fr) 1994-12-23

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Legal Events

Date Code Title Description
ST Notification of lapse