FR2704870B1 - Dispositif de pulvérisation à champ magnétique, et installation de traitement sous vide associée. - Google Patents
Dispositif de pulvérisation à champ magnétique, et installation de traitement sous vide associée.Info
- Publication number
- FR2704870B1 FR2704870B1 FR9402187A FR9402187A FR2704870B1 FR 2704870 B1 FR2704870 B1 FR 2704870B1 FR 9402187 A FR9402187 A FR 9402187A FR 9402187 A FR9402187 A FR 9402187A FR 2704870 B1 FR2704870 B1 FR 2704870B1
- Authority
- FR
- France
- Prior art keywords
- magnetic field
- spraying device
- vacuum treatment
- treatment installation
- associated vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3455—Movable magnets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH01362/93A CH690805A5 (de) | 1993-05-04 | 1993-05-04 | Magnetfeldunterstützte Zerstäubungsanordnung und Vakuumbehandlungsanlage hiermit. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2704870A1 FR2704870A1 (fr) | 1994-11-10 |
FR2704870B1 true FR2704870B1 (fr) | 1997-01-17 |
Family
ID=4208668
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9402187A Expired - Lifetime FR2704870B1 (fr) | 1993-05-04 | 1994-02-25 | Dispositif de pulvérisation à champ magnétique, et installation de traitement sous vide associée. |
Country Status (9)
Country | Link |
---|---|
US (1) | US5490913A (fr) |
JP (1) | JP3727669B2 (fr) |
KR (1) | KR100349407B1 (fr) |
AU (1) | AU673727B2 (fr) |
CH (1) | CH690805A5 (fr) |
DE (1) | DE4405747B4 (fr) |
FR (1) | FR2704870B1 (fr) |
GB (1) | GB2278368B (fr) |
NL (1) | NL194654C (fr) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6689254B1 (en) | 1990-10-31 | 2004-02-10 | Tokyo Electron Limited | Sputtering apparatus with isolated coolant and sputtering target therefor |
US5433835B1 (en) * | 1993-11-24 | 1997-05-20 | Applied Materials Inc | Sputtering device and target with cover to hold cooling fluid |
EP0704878A1 (fr) * | 1994-09-27 | 1996-04-03 | Applied Materials, Inc. | DépÔt de film d'épaisseur uniforme de matériaux pulvérisés |
AU4503696A (en) * | 1995-05-11 | 1996-11-29 | Materials Research Corporation | Sputtering apparatus with isolated coolant and sputtering ta rget therefor |
DE19546826C1 (de) * | 1995-12-15 | 1997-04-03 | Fraunhofer Ges Forschung | Verfahren und Einrichtung zur Vorbehandlung von Substraten |
JPH10195649A (ja) * | 1996-12-27 | 1998-07-28 | Sony Corp | マグネトロンスパッタ装置および半導体装置の製造方法 |
US6264804B1 (en) | 2000-04-12 | 2001-07-24 | Ske Technology Corp. | System and method for handling and masking a substrate in a sputter deposition system |
JP4928692B2 (ja) * | 2001-09-14 | 2012-05-09 | アプライド マテリアルズ インコーポレイテッド | スパッタリング装置のマグネトロンユニット及びスパッタリング装置 |
EP1336985A1 (fr) * | 2002-02-19 | 2003-08-20 | Singulus Technologies AG | Cathode de pulvérisation, et dispositif et méthode pour le dépôt d'une pluralité de couches sur un substrat |
US7297247B2 (en) * | 2003-05-06 | 2007-11-20 | Applied Materials, Inc. | Electroformed sputtering target |
US7910218B2 (en) | 2003-10-22 | 2011-03-22 | Applied Materials, Inc. | Cleaning and refurbishing chamber components having metal coatings |
DE102004027897A1 (de) * | 2004-06-09 | 2006-01-05 | Leybold Optics Gmbh | Vorrichtung und Verfahren zur Zerstäubung mit einem bewegbaren planaren Target |
US7670436B2 (en) | 2004-11-03 | 2010-03-02 | Applied Materials, Inc. | Support ring assembly |
US8617672B2 (en) | 2005-07-13 | 2013-12-31 | Applied Materials, Inc. | Localized surface annealing of components for substrate processing chambers |
US7762114B2 (en) * | 2005-09-09 | 2010-07-27 | Applied Materials, Inc. | Flow-formed chamber component having a textured surface |
US9127362B2 (en) | 2005-10-31 | 2015-09-08 | Applied Materials, Inc. | Process kit and target for substrate processing chamber |
US20070125646A1 (en) | 2005-11-25 | 2007-06-07 | Applied Materials, Inc. | Sputtering target for titanium sputtering chamber |
US20070283884A1 (en) * | 2006-05-30 | 2007-12-13 | Applied Materials, Inc. | Ring assembly for substrate processing chamber |
US7981262B2 (en) | 2007-01-29 | 2011-07-19 | Applied Materials, Inc. | Process kit for substrate processing chamber |
US7942969B2 (en) * | 2007-05-30 | 2011-05-17 | Applied Materials, Inc. | Substrate cleaning chamber and components |
US8968536B2 (en) * | 2007-06-18 | 2015-03-03 | Applied Materials, Inc. | Sputtering target having increased life and sputtering uniformity |
US20090084317A1 (en) * | 2007-09-28 | 2009-04-02 | Applied Materials, Inc. | Atomic layer deposition chamber and components |
US7901552B2 (en) * | 2007-10-05 | 2011-03-08 | Applied Materials, Inc. | Sputtering target with grooves and intersecting channels |
DE102008033904B4 (de) * | 2008-07-18 | 2012-01-19 | Von Ardenne Anlagentechnik Gmbh | Antriebsendblock für eine Magnetronanordnung mit einem rotierenden Target |
DE102009056241B4 (de) * | 2009-12-01 | 2012-07-12 | Von Ardenne Anlagentechnik Gmbh | Stützeinrichtung für eine Magnetronanordnung mit einem rotierenden Target |
DE102010031259B4 (de) * | 2010-07-12 | 2012-07-12 | Von Ardenne Anlagentechnik Gmbh | Stützeinrichtung für eine Magnetronanordnung mit einem rotierenden Target |
DE102011111779A1 (de) * | 2011-09-01 | 2013-03-07 | Von Ardenne Anlagentechnik Gmbh | Medienanschlussstutzen, Sputterbeschichtungseinrichtung und Vakuumbeschichtungsanlage |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4444643A (en) * | 1982-09-03 | 1984-04-24 | Gartek Systems, Inc. | Planar magnetron sputtering device |
CH659484A5 (de) * | 1984-04-19 | 1987-01-30 | Balzers Hochvakuum | Anordnung zur beschichtung von substraten mittels kathodenzerstaeubung. |
JP2627651B2 (ja) * | 1988-10-17 | 1997-07-09 | アネルバ株式会社 | マグネトロンスパッタリング装置 |
US5130005A (en) * | 1990-10-31 | 1992-07-14 | Materials Research Corporation | Magnetron sputter coating method and apparatus with rotating magnet cathode |
GB8909747D0 (en) * | 1989-04-27 | 1989-06-14 | Ionic Coatings Limited | Sputtering apparatus |
US4995958A (en) * | 1989-05-22 | 1991-02-26 | Varian Associates, Inc. | Sputtering apparatus with a rotating magnet array having a geometry for specified target erosion profile |
DE4022345A1 (de) * | 1989-08-22 | 1991-02-28 | Bosch Gmbh Robert | Einrichtung zum uebertragen einer stellposition eines bedienelements |
EP0439360A3 (en) * | 1990-01-26 | 1992-01-15 | Varian Associates, Inc. | Rotating sputtering apparatus for selected erosion |
US5252194A (en) * | 1990-01-26 | 1993-10-12 | Varian Associates, Inc. | Rotating sputtering apparatus for selected erosion |
DE69133275T2 (de) * | 1990-01-26 | 2004-04-29 | Varian Semiconductor Equipment Associates Inc., Gloucester | Sputtervorrichtung mit rotierender Magnetanordnung, deren Geometrie ein vorgegebenes Targetabtragsprofil erzeugt |
US5200049A (en) * | 1990-08-10 | 1993-04-06 | Viratec Thin Films, Inc. | Cantilever mount for rotating cylindrical magnetrons |
DE59208623D1 (de) * | 1991-05-08 | 1997-07-24 | Balzers Hochvakuum | Verfahren zur Montage bzw. Demontage einer Targetplatte in einem Vakuumprozessraum, Montageanordnung hierfür sowie Targetplatte bzw. Vakuumkammer |
US5194131A (en) * | 1991-08-16 | 1993-03-16 | Varian Associates, Inc. | Apparatus and method for multiple ring sputtering from a single target |
-
1993
- 1993-05-04 CH CH01362/93A patent/CH690805A5/de not_active IP Right Cessation
-
1994
- 1994-02-23 DE DE4405747A patent/DE4405747B4/de not_active Expired - Lifetime
- 1994-02-25 FR FR9402187A patent/FR2704870B1/fr not_active Expired - Lifetime
- 1994-03-24 JP JP05367294A patent/JP3727669B2/ja not_active Expired - Lifetime
- 1994-04-13 KR KR1019940007782A patent/KR100349407B1/ko not_active IP Right Cessation
- 1994-04-27 GB GB9408346A patent/GB2278368B/en not_active Expired - Lifetime
- 1994-05-02 AU AU61831/94A patent/AU673727B2/en not_active Ceased
- 1994-05-02 US US08/236,535 patent/US5490913A/en not_active Expired - Lifetime
- 1994-05-04 NL NL9400734A patent/NL194654C/nl not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
AU6183194A (en) | 1994-11-10 |
DE4405747B4 (de) | 2006-04-27 |
CH690805A5 (de) | 2001-01-15 |
GB9408346D0 (en) | 1994-06-15 |
FR2704870A1 (fr) | 1994-11-10 |
GB2278368B (en) | 1997-04-23 |
US5490913A (en) | 1996-02-13 |
NL194654B (nl) | 2002-06-03 |
JPH06330312A (ja) | 1994-11-29 |
GB2278368A (en) | 1994-11-30 |
NL194654C (nl) | 2002-10-04 |
AU673727B2 (en) | 1996-11-21 |
NL9400734A (nl) | 1994-12-01 |
DE4405747A1 (de) | 1994-11-10 |
JP3727669B2 (ja) | 2005-12-14 |
KR100349407B1 (ko) | 2002-12-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
CD | Change of name or company name | ||
TP | Transmission of property |